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Substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
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Substrate Product List

106~120 item / All 203 items

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Connector for board-to-board (FPC) connection | FB35AT6 series

Connector with a height of 0.6mm, 0.35mm pitch, compact, ultra-low profile, and narrow pitch.

The FB35AT6 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.6mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.6mm ■ Available core lineup: 6 cores, 8 cores, 10 cores, 18 cores ■ Adoption of a metal cap design achieves a robust structure ■ Metal is placed in the center of the receptacle connector: further strength enhancement through an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → realization of space-saving due to reduction in the number of contact cores ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improves the click feel and extraction force during mating *For more details, please refer to the PDF materials or feel free to contact us.

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5G Electronic Materials PTFE FPC Fluororesin Substrate

Sheet processing of ultra-thin resin sheets with low dielectric properties, high strength, and low elasticity.

We have over 1,000 prototypes related to 5G-related electronic materials, FPC, CASE-related, power device-related, and various others. This includes metal foils, electrode foils, insulating foils, separator foils, films, sheets, and rolls. You can rest assured with any materials, components, or processing methods. We can provide optimal proposals tailored to each customer, each development project, and each stage from prototyping to mass production in a one-stop manner. This is our greatest value, "Total Service for Punching Out." Please feel free to contact us about anything. We will respond promptly and sincerely, putting in our best effort.

  • Other electronic parts

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Connector for board-to-board (FPC) connections | FB35AA series

Connector with a height of 0.8mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35AA series connector is designed for connecting PCBs to FPCs with a 0.35mm pitch, a mating height of 0.8mm, and a depth of 1.8mm. It adopts a metal cap method where the metal is integrally molded at the plug end, providing a robust structure that enhances strength against damage in case of misalignment. 【Features】 - The adoption of the metal cap method achieves a robust structure. - The tabs can carry up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. - It features a highly reliable two-point contact structure. - A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF materials or feel free to contact us.*

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Connector for board-to-board (FPC) connection | FB35AT5 series

Connector with a height of 0.5mm, 0.35mm pitch, compact, ultra-low profile, and narrow pitch.

The FB35AT5 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.5mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.5mm ■ Number of contacts available: 8 contacts ■ Adoption of a metal cap design for a robust structure ■ Metal placed in the center of the receptacle connector: further strength enhancement through an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → achieving space-saving due to reduced number of contact pins ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improves the click feel and extraction force during mating *For more details, please refer to the PDF document or feel free to contact us.

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Connector for board-to-board (FPC) connection | FB35AT8 series

Connector with a height of 0.8mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35AT8 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.8mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.8mm ■ Available core counts: 12 and 16 cores ■ Adoption of a metal cap design for a robust structure ■ Metal placed in the center of the receptacle connector: further strength enhancement with an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → realization of space-saving due to reduced contact core count ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improved click feel and extraction force during mating *For more details, please refer to the PDF document or feel free to contact us.

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Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

A flexible circuit board that achieved over 10 million bending characteristics at 70℃! It is flexible and excels in bending performance even in high-temperature environments, ensuring high reliability!

The "High Flex FPC" is a flexible printed circuit board (FPC) with bending characteristics that exceed 10 million cycles at 70°C. By using a high Tg (glass transition temperature) coverlay, it suppresses the degradation of bending characteristics at high temperatures. It is flexible and excels in bending performance even in high-temperature environments, offering high reliability. 【Features】 ■ Significantly improved bending characteristics by using rolled copper foil ■ Capable of high-speed transmission of over Gbps with low loss ■ Easy to match characteristic impedance  ・Characteristic impedance value can be matched at differential 100±15Ω *For more details, please request materials or view the PDF data from the download.

  • Printed Circuit Board

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Narrow pitch pad on beer flexible substrate

By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.

  • padonvia_002.png
  • padonvia_003.png
  • High frequency/microwave parts

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Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias are also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports high-density wiring compatible with fine pattern formation and small-diameter vias *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing

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Introduction to printed circuit boards.

We propose highly reliable and high-performance circuit boards that support a wide range of fields, including information communication and industry!

A "printed circuit board" refers to a substrate on which a pattern (electronic circuit) called a pattern is printed on the surface of an insulating board. Our company proposes high-reliability and high-performance substrates tailored to customer requirements, supporting a wide range of fields such as "information and communication," "semiconductor-related," "aerospace," and "industrial." We offer a rich lineup of products, including flexible substrates that achieve space-saving through the reduction of supporting materials, such as "self-supporting sliding FPC," "high-flex FPC," and "high-speed transmission FPC," as well as innovative products with self-supporting and high-flex capabilities. 【Features】 - Lamination, plating, and patterning technologies that support the manufacturing of characteristic impedance-controlled substrates - In-house developed order management systems and design/manufacturing tools that accommodate single prototype and development needs, as well as small to medium volume production of various types - Highly flexible and sliding flexible substrates *For more details, please refer to the external link page or feel free to contact us.

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Connector for board-to-board (FPC) connection | FB35S series

Connector with a height of 0.7mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35S series connector is a connector for connecting a board to an FPC, with a short length of 2.1mm, which is 0.2mm shorter than the FB35 receptacle connector, a pitch of 0.35mm, and a mating height of 0.7mm. Like the FB35 series connector, it features power contacts capable of carrying a current of 4A through the tabs, contributing to the miniaturization and slimness of devices. 【Features】 ■ Receptacle connector short length (tail to tail) 2.1mm ■ The tabs can carry up to 4A as power contacts. When carrying high current, space-saving can be achieved by reducing the number of contact pins. ■ The receptacle tabs have an insert structure that surrounds the outer circumference, reducing damage during misalignment insertion of the connector. ■ A recessed structure has been added to the plug contacts to improve the click feel during insertion and the extraction force. *For more details, please refer to the PDF document or feel free to contact us.

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Connector for board-to-board (FPC) connection | FB35AW6 series

Connector with a height of 0.6mm, 0.35mm pitch, capable of carrying 7.0A, ultra-low profile and compact power composite type.

The FB35AW6 series connector is a board-to-board (FPC) connector with a 0.35mm pitch, a mating height of 0.6mm, and a depth of 1.95mm. This connector features a combined terminal arrangement for signal contacts and power contacts. 【Features】 ■ Power contacts capable of carrying 7A ■ Pitch of 0.35mm, product width of 1.95mm, mating height of 0.6mm ■ Available core counts: 10, 14, 18, 20, 22 cores ■ Adoption of a metal cap design for a robust structure ■ The metal cap can carry up to 2.5A as a power contact ■ Metal is placed in the center of the receptacle connector: enhanced strength through an inner metal armor structure ■ Highly reliable two-point contact structure ■ Improved click feel during mating and increased extraction force *For more details, please refer to the PDF document or feel free to contact us.

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Board-to-board (FPC) battery connection connector | FPB4 series

Low-profile, compact connector for high-capacity batteries capable of 8.0A current with a mating height of 0.6mm.

The FPB4 series connector is designed for board-to-board (FPC) connections with a mating height of 0.6mm. It features power contacts capable of carrying 8A, making it suitable for applications requiring high current, such as battery connections. 【Features】 ■ Power contacts capable of carrying 8A ■ Mating height of 0.6mm, product width of 1.95mm ■ Number of pins: 2 signal contacts, 2 power contacts, 2 metal caps ■ Adoption of a metal cap design for a robust structure ■ Metal cap can carry up to 2.5A as a power contact ■ Metal placed in the center of the receptacle connector: enhanced strength through an inner metal armor structure ■ Highly reliable two-point contact structure ■ Improved click feel during mating and increased withdrawal force *For more details, please refer to the PDF document or feel free to contact us.

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Board-to-board (FPC) battery connection connector | FPB6 series

Ultra-low profile and compact connector for high-capacity batteries capable of 7.0A current with a fitting height of 0.6mm.

The FPB6 series connector is designed for board-to-board (FPC) connections with a mating height of 0.6mm. It features power contacts capable of carrying 7A, making it suitable for applications such as battery connections that require high current. 【Features】 ■ Power contacts capable of carrying 7A ■ Mating height of 0.6mm, product width of 1.95mm ■ Number of pins: 4 signal contacts, 2 power contacts, 2 metal caps ■ Adoption of a metal cap design achieves a robust structure ■ The metal cap can carry up to 2.5A as a power contact ■ Metal is placed in the center of the receptacle connector: enhanced strength through an inner metal armor structure ■ Highly reliable two-point contact structure ■ Achieves a good click feel during mating and improved extraction force *For more details, please refer to the PDF document or feel free to contact us.

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Board-to-board (FPC) battery connection connector | FPB7 series

Ultra-low profile and compact connector for high-capacity battery capable of 7.0A current with a mating height of 0.6mm.

The FPB7 series connector is designed for board-to-board (FPC) connections with a mating height of 0.6mm. It features power contacts capable of carrying 7A, making it suitable for applications such as battery connections that require high current. 【Features】 ■ Power contacts capable of carrying 7A ■ Mating height of 0.6mm, product width of 1.95mm ■ Number of pins: 6 signal contacts, 2 power contacts, 2 metal caps ■ Adoption of a metal cap design for a robust structure ■ Metal caps can carry up to 2.5A as power contacts ■ Metal placed in the center of the receptacle connector: enhanced strength due to inner metal armor structure ■ Highly reliable two-point contact structure ■ Improved click feel during mating and enhanced extraction force *For more details, please refer to the PDF document or feel free to contact us.

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Fine flexible circuit board

Achieving fine pattern processing using methods such as etching and additive techniques!

FPC (Flexible Printed Circuit) boards are circuit boards that use polyimide film as the base material and have copper electrodes patterned on them. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards by using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction treatment on both sides is possible. For more details, please contact us or refer to the catalog.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Processing Contract

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