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Substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Sep 23, 2026～Oct 20, 2026
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Substrate Product List

211～220 item / All 220 items

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High heat-resistant, low-loss flexible substrate for medical devices

High heat-resistant, low-loss flexible substrate for medical devices

Flexible substrates contributing to the miniaturization and high performance of precision medical devices.

In the medical device industry, there is a demand for miniaturization and high-density implementation of equipment to enable precise diagnosis and treatment. Particularly in medical devices that handle high-frequency signals, it is crucial to minimize signal loss and ensure stable operation. Conventional substrates may face challenges such as performance degradation and signal loss due to heat and humidity. Our high heat-resistant, low-loss flexible substrates address these issues and contribute to improving the reliability of medical devices. 【Application Scenarios】 - Medical devices such as endoscopes and catheters - Imaging diagnostic equipment such as MRI and CT scanners - Surgical robots 【Benefits of Implementation】 - Improved operability through miniaturization and lightweight design - Enhanced diagnostic accuracy through stable transmission of high-frequency signals - High reliability in harsh environments

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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[For Defense] High Heat Resistance and Low Loss All LCP Flexible Circuit Board

[For Defense] High Heat Resistance and Low Loss All LCP Flexible Circuit Board

A highly durable flexible substrate that demonstrates stable performance even in harsh environments.

In the defense sector, the reliability of equipment and long-term operation are required. Particularly for electronic devices used in harsh environments such as temperature changes, vibrations, and shocks, the durability of the substrate is crucial. Conventional substrates may experience performance degradation in high-temperature environments and damage to joints due to vibrations. Our high-heat-resistant, low-loss all-LCP flexible substrates offer high heat resistance, low moisture absorption, and chemical resistance, providing stable performance even in harsh conditions. 【Application Scenarios】 - Military communication equipment - Aerospace equipment - Missile systems - Radar systems 【Benefits of Implementation】 - High reliability in harsh environments - Long product lifespan - Reduction in maintenance costs

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss LCP flexible substrate for data centers

High heat-resistant, low-loss LCP flexible substrate for data centers

Solving heat management and signal loss in high-density data centers.

In the data center industry, the high-density implementation of servers is advancing, and the increase in heat generation and losses due to faster signals are becoming challenges. High density is essential for processing more information in limited space, but it simultaneously causes issues such as performance degradation due to heat and signal attenuation. Our high-heat-resistant, low-loss all-LCP flexible circuit boards address these challenges. 【Usage Scenarios】 - High-density implementation servers - High-speed communication devices - High-frequency compatible circuit boards 【Benefits of Implementation】 - Improved long-term reliability due to high heat resistance - Maintenance of signal quality due to low-loss characteristics - Contribution to space-saving solutions

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss flexible substrate for displays

High heat-resistant, low-loss flexible substrate for displays

Flexible substrate with high heat resistance and low loss that contributes to high-quality displays.

In the display industry, there is a demand for high image quality, along with thinner products and high-density mounting. Particularly in displays that operate in high-temperature environments or use high-frequency signals, the heat resistance and low loss characteristics of the substrate are essential for maintaining product performance. Inappropriate substrates can lead to display malfunctions or performance degradation. Our high heat-resistant, low loss flexible substrates meet the demands of high-quality displays. 【Usage Scenarios】 - High-definition displays - Displays compatible with high-frequency signals - Displays used in high-temperature environments 【Benefits of Implementation】 - Achievement of high-quality display - Improvement in product reliability - Contribution to thinner designs and high-density mounting

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High-precision semiconductor manufacturing supported by high heat resistance and low loss flexible substrates.

In the semiconductor manufacturing industry, high-precision process control and stable performance are required. Particularly in situations involving high-temperature environments and high-frequency signals, the heat resistance and low-loss characteristics of substrates are crucial. Conventional substrates may suffer from deformation due to heat and signal attenuation, which can compromise manufacturing precision and product reliability. Our all-LCP flexible substrates offer high heat resistance, low-loss characteristics, and low outgassing, supporting high-precision processes in semiconductor manufacturing. 【Application Scenarios】 - Semiconductor manufacturing equipment - High-frequency circuits - Cleanroom environments 【Benefits of Implementation】 - Stabilization of manufacturing processes - Improvement in product reliability - Enhancement of yield

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Analysis of Two-layer CCL Production Trends

Focusing on the rapidly growing two-layer FPC, we conducted demand forecasting by application and clarified trends in the market, applications, manufacturers, and types. Additionally, regarding the two-layer CCL, which is facing supply constraints due to a sharp increase in demand, we investigated and analyzed the production status and expansion plans of each two-layer CCL manufacturer to clarify the current supply and demand situation. This provides an outlook on the future of two-layer FPC/CCL.

  • Printed Circuit Board
  • Adhesive tape
  • Substrate

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Mouse Emulation System [Embedded System Development Case Study]

Mouse Emulation System [Embedded System Development Case Study]

Capture and process analog waveforms! Leave FPGA development to us.

We would like to introduce a case where we delivered a mouse emulation system to a display manufacturer. The company requested whether we could develop an FPGA program for an FPGA-equipped board and a LabVIEW program that communicates with the FPGA-equipped board via USB to execute mouse emulation on a PC. Our company has a proven track record in FPGA development, and we have a specialized partner who excels in LabVIEW programming. In this case, the client has expressed satisfaction after delivery. [Case Overview] ■ Request - Development of an FPGA program for an FPGA-equipped board and a LabVIEW program ■ Our Strengths - Proven track record in FPGA development - Specialized partner for LabVIEW programming ■ Result: The client is satisfied after delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Other embedded systems (software and hardware)
  • Substrate

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Printed circuit board design high-frequency board

Printed circuit board design high-frequency board

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

  • others
  • Substrate

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Industrial ITX motherboard 'MIX-H810WV1' with rich I/O.

Industrial ITX motherboard 'MIX-H810WV1' with rich I/O.

Equipped with a wide range of USB, serial, and video outputs. An ideal Mini-ITX board for embedding in industrial equipment that requires multiple input/output control.

The "MIX-H810WV1" is a Mini-ITX motherboard designed for industrial equipment that requires a variety of I/O options. It comes standard with a powerful array of interfaces that can connect directly to diverse devices, including USB3.2 Gen2×2, USB2.0×4, four serial ports (RS-232/422/485), 8-bit DIO, and HDMI/DP. The CPU can be selected from the Intel Core Ultra 200S series (LGA1851). It supports DDR5 SODIMM×2 (up to 96GB), ensuring stable operation even in control and monitoring systems that require long-term operation. Additionally, with M.2, SATA, and PCIe Gen5, adding storage or dedicated cards is easy. With a DC12-24V input and an operating range of 0-60°C, it can be safely used in a wide range of environments, including manufacturing lines, FA equipment, and embedded PCs. *CPU, memory, storage, and OS are not included.

  • Embedded Board Computers
  • Substrate

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Mini-ITX motherboard for industrial machinery integration 'MIX-H810WV1'

Mini-ITX motherboard for industrial machinery integration 'MIX-H810WV1'

Achieves high-speed computation and stability. An industrial Mini-ITX motherboard that can be smoothly integrated into NC devices, control panels, and automated processing equipment.

The industrial Mini-ITX motherboard 'MIX-H810WV1' is designed with a focus on the required "stable operation," "high-speed response," and "long-term supply" for control systems in working machinery. By adopting the latest Intel Core Ultra 200S series, it can comfortably handle complex interpolation calculations and high-speed communication with peripherals. It is equipped with specifications that support high-speed processing for control applications, including up to 96GB of DDR5 memory, PCIe Gen5 x4, and M.2 NVMe. Standard I/O includes USB3.2, 2.5GbE x2, serial x4, and DIO, ensuring connectivity with on-site PLCs, sensors, and display devices, and it serves as a central controller for NC devices and automation equipment. It supports DC 12-24V input and operates within a temperature range of 0-60°C, demonstrating robustness suitable for installation inside machinery.

  • Embedded Board Computers
  • Substrate

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