Laser Bond Tester I + Magazine Changer
We will introduce products that can be used for efficient sampling inspections and full bond inspections of medium lots.
This product is a laser bond tester designed specifically for large-diameter aluminum wire bonds with a magazine supply system. It comes standard with a function that corrects the measurement position to an optimal location through image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections for medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Targets - Aluminum wire bonding interface condition - Wire diameter: φ200μm to φ400μm ■ Measurement Laser: Semiconductor laser, etc. *For more information, please refer to the PDF document or feel free to contact us.
- Company:アイエルテクノロジー
- Price:Other