Bond Tester for Semiconductors 'SS-30WD'
Share, pull, peel, push, for strength testing of fine joints.
In the semiconductor industry, evaluating the strength of fine joints is crucial to ensure product reliability. Particularly as miniaturization progresses, even slight abnormalities in joints can affect the overall performance of the product. Variations in joint strength and poor bonding not only reduce product yield but also compromise the reliability of the final product. The bond tester 'SS-30WD' accommodates a variety of tests such as shear, pull, peel, and push, meeting all needs for strength evaluation of fine joints. 【Application Scenarios】 - Shear tests for die, ball, and bump - Wire pull tests - Peel tests (90°/180°) - Push tests 【Benefits of Implementation】 - Wide joint evaluation due to support for various tests - Reliable data acquisition through high-precision measurements - Improved analysis efficiency with data processing software - Quality assurance with JQA calibration certificates
- Company:西進商事
- Price:Other