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evaluation Product List and Ranking from 114 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.

evaluation Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. ユーロフィンFQL Kanagawa//Service Industry
  3. アイテス Shiga//Electronic Components and Semiconductors
  4. 4 一般財団法人材料科学技術振興財団　MST Tokyo//Testing, Analysis and Measurement
  5. 5 null/null
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evaluation Product ranking

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.

  1. Eurofins FQL Co., Ltd. | Business Information ユーロフィンFQL
  2. Lithium-ion battery contract evaluation (charging and discharging tests / safety tests / post-test analysis)
  3. Understand in 3 minutes! Basic knowledge of Device Development | Semiconductor Design and Evaluation BREXA Technology（旧社名：アウトソーシングテクノロジー）
  4. 4 No. 21 Evaluation of Pore Structure by NLDFT Method and GCMC Method
  5. 5 Evaluation of Activated Carbon Fiber Structure Using No. 10 T-Plot Method (Application Edition 1)

evaluation Product List

46～60 item / All 357 items

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[Analysis Case] Composition and Thickness Evaluation of Ultra-Thin SiON Films

[Analysis Case] Composition and Thickness Evaluation of Ultra-Thin SiON Films

Estimation of film thickness using the average free path of photoelectrons.

For extremely thin films with a thickness of a few nanometers or less, such as natural oxide films on silicon wafers and silicon nitride thin films, we will measure the Si2p spectrum of the sample's surface. By performing waveform analysis on the obtained spectrum, we will determine the proportion of each bonding state and estimate the film thickness from this result and the average free path of photoelectrons (Equation 1).

  • Contract Analysis

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[Analysis Case] Evaluation of Si Anode in Lithium-Ion Secondary Batteries

[Analysis Case] Evaluation of Si Anode in Lithium-Ion Secondary Batteries

It is possible to evaluate the structure of the Si anode after charging through sample cooling.

Si is one of the candidates for high-capacity negative electrode active materials, but it is said to suffer from severe cycle degradation due to very large volume changes during charge and discharge. In this study, to confirm the state of the Si negative electrode after charging, we disassembled it under a controlled atmosphere environment and performed cooling FIB processing, followed by observing the cross-sectional shape using SEM. When observing the cross-section at room temperature, significant damage such as film contraction, roughness of the observation surface, and pore formation was observed. In contrast, by conducting the observation while cooling, we were able to suppress the alteration of the Si negative electrode and evaluate the original shape of the sample.

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  • 充電曲線およびSi負極の形態観察.png
  • 充電後の形状観察結果_Si膜の変質_Cu箔の露出.png
  • 電池図.png
  • Contract Analysis
  • Contract measurement

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[Analysis Case] Quality Evaluation of SiC Substrates

[Analysis Case] Quality Evaluation of SiC Substrates

Evaluation of crystal orientation, in-plane defect distribution, surface roughness, and impurities.

SiC power devices are expected to reduce power loss and handle high power in a compact form as power conversion elements. The quality evaluation of SiC substrates, which is necessary for manufacturing these devices, has become a challenge. We propose a method to evaluate and quantify the crystal orientation, in-plane defect distribution, surface roughness, and impurities of SiC substrates, as well as to visualize these factors. Measurement methods: XRD, AFM, PL, SIMS Product fields: Power devices, lighting Analysis purposes: Trace concentration evaluation, structural evaluation, shape evaluation, failure analysis, defect analysis For more details, please download the materials or contact us.

  • Contract Analysis

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[Analysis Case] Evaluation of Silicon Oxide Film by XAFS

[Analysis Case] Evaluation of Silicon Oxide Film by XAFS

Local structural analysis around silicon, quantification of intermediate oxides, evaluation of bulk and interfaces.

Silicon oxide films are widely used as gate dielectrics in MOS devices and as anode materials in lithium-ion secondary batteries, but it is known that the presence of intermediate oxides and the bonding states at the interface have a significant impact on device characteristics. XAFS measurements using synchrotron radiation can detect information from a depth of several tens of nanometers from the sample surface, allowing for non-destructive analysis of the structure and bonding states in both bulk and at the interface. This document presents a case study investigating the presence of intermediate oxides in silicon oxide films using XAFS.

  • Contract Analysis

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[Analysis Case] Evaluation of Functional Groups in Graphene

[Analysis Case] Evaluation of Functional Groups in Graphene

Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.

Graphene, a monolayer form of graphite, is expected to be applied in a wide range of fields such as batteries, transparent electrodes, and sensors due to its excellent properties, including toughness, high electrical conductivity, and high thermal stability. It is also said that the types and amounts of functional groups present on the surface vary depending on the manufacturing method, and clarifying its structure is an important point for improving performance. This case study introduces a comparison of the functional groups of two types of graphene using thermal decomposition GC/MS method.

  • Contract Analysis
  • Transistor
  • Power storage device

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Evaluation of organic substances at the metal interface causing delamination.

Evaluation of organic substances at the metal interface causing delamination.

TOF-SIMS can evaluate organic substances at metal interfaces in the depth direction.

Organic substances at metal interfaces can cause poor adhesion and delamination. For analyzing this poor adhesion, physically peeling off the layers and conducting qualitative analysis on the peeled surfaces is effective (refer to analysis case C0198). On the other hand, there are many cases where peeling cannot be performed, and in such cases, using a sputtering ion source for depth analysis is effective. This document presents a case of qualitative analysis of organic substances at metal interfaces, either in thin films or as secondary contamination, in the depth direction. As a conclusion, the presence of organic substances was confirmed by detecting C-series ions. Additionally, it is sometimes possible to identify organic substances by comparing them with known standard samples.

  • Ingredient analysis
  • Other analysis and evaluation services

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Evaluation avoiding duplication of Oji Peak by HAXPES.

Evaluation avoiding duplication of Oji Peak by HAXPES.

Comparison of spectra obtained from Ga line (HAXPES) and Al line/Mg line (XPS) measurements.

In HAXPES, hard X-rays (Ga radiation) are used for excitation, which results in different positions of the Auger peaks compared to the Al and Mg radiation typically used in standard XPS measurements. Therefore, even in samples where the photoelectron peaks and Auger peaks overlap in Al and Mg measurements, this overlap can be avoided in Ga measurements, allowing for a detailed evaluation of the bonding states. This document presents the spectra of Kovar (an alloy of Fe, Ni, and Co) and GaN measured using Ga radiation (equipped with HAXPES) and Al and Mg radiation (equipped with XPS).

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  • Contract Analysis
  • Contract measurement

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[Analysis Case] Internal Structure Evaluation of Battery Components Using Nano-CT

[Analysis Case] Internal Structure Evaluation of Battery Components Using Nano-CT

Observe the fine structure inside the sample in three dimensions with a spatial resolution of 100 nm!

Nano-CT is a type of X-ray CT that uses synchrotron radiation as a source and allows for three-dimensional observation of the internal structure of samples with a spatial resolution of about 100 nm. This document presents a case study that visualizes the internal structure of battery components sealed in laminate film. Through nano-CT measurements, it is possible to confirm the fine structures and cracks of active materials that could not be captured by conventional micro-CT (spatial resolution of 1 μm or more).

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  • Contract measurement
  • Contract Inspection
  • X-ray inspection equipment

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Evaluation of the heating effects on plated parts using AFM/AES Auger electron spectroscopy.

Evaluation of the heating effects on plated parts using AFM/AES Auger electron spectroscopy.

We will conduct a multifaceted investigation of heating effects on plated components using AFM scanning probe microscopy and AES Auger electron spectroscopy.

The AFM scanning probe microscope is a device that detects various physical interactions occurring between the probe and the sample surface, allowing for the observation of surface shapes in minute areas and the measurement of electrical and mechanical properties. These physical interactions include atomic forces, frictional forces, and electrostatic forces. Additionally, measurements can be conducted in various environments, including atmospheric and vacuum conditions, enabling the observation of sample surfaces regardless of whether they are conductive or insulating. The AES Auger electron spectrometer allows for elemental analysis of the extreme surface layer of materials (approximately 5nm) and investigation of concentration gradients in the depth direction. Using these two analytical devices, we conducted a study on the heating effects on the surface of plated connector contact pins. Please take a moment to read the PDF materials. Furthermore, in addition to these analytical devices, our company also conducts various surface analyses such as XPS and GD-OES. We would be happy to assist you, so please feel free to reach out to us. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/ *Other materials are also available. If you request through the inquiry button, we will send them to you.

  • Contract Analysis
  • Analysis Services
  • Plating Equipment

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Conductivity evaluation of plated contact component surfaces 【DL available/AFM】

Conductivity evaluation of plated contact component surfaces 【DL available/AFM】

AFM can capture and measure extremely small surface topographies (roughness).

The AFM scanning probe microscope is a device that "detects various physical interactions between the probe and the sample surface, allowing for the observation of surface shapes in minute areas and the measurement of electrical and mechanical properties." These physical interactions include atomic forces, frictional forces, and electrostatic forces. Additionally, measurements can be taken in various environments, including atmospheric and vacuum conditions, enabling the observation of sample surfaces regardless of conductivity or insulation. Using this analytical device, we conducted an investigation into the "surface treatment of plated connector contact parts." Please take a moment to read the PDF materials. Furthermore, in addition to this analytical device, our company also conducts various surface analyses such as XPS, AES, and GD-OES. We would be happy to assist you, so please feel free to reach out. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/ *We have many other achievements as well. If you request through the inquiry button, we will send them to you.

  • Plating Equipment
  • Contract Analysis
  • Electrical Instruments/Electrometers

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Evaluation of semiconductor insulating films using STEM/EDS.

Evaluation of semiconductor insulating films using STEM/EDS.

STEM-EDS observation can confirm the shape and layer structure of the insulating film between semiconductor Poly-Si (polysilicon) and can be applied to investigate the causes of semiconductor defects.

In STEM (Scanning Transmission Electron Microscopy) and EDS (Energy Dispersive X-ray Spectroscopy), information regarding the composition of the sample (contrast images reflecting atomic numbers) can be obtained by scanning a finely focused electron beam over the sample. Additionally, the following features are available: - Observation of changes in diffraction contrast by varying the angle of incidence of the electron beam - Determination of whether the observation target is crystalline - Acquisition of information on crystal defects (dislocations, twins, etc.) within the crystal In this case, we introduce "Evaluation of Semiconductor Insulating Films using STEM-EDS." This case yielded no issues, but abnormal detection is also possible. Please take a moment to read the PDF materials. Furthermore, in addition to this STEM, our company excels in identifying defective areas by performing 3D reconstruction on specific regions of the sample in combination with FIB. We would be happy to provide a demonstration, so please feel free to reach out to us. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/ *Other materials are also available. If you request them through the inquiry button, we will send them to you.

  • Semiconductor inspection/test equipment
  • Contract Analysis
  • Other semiconductors

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Eurofins FQL Co., Ltd. | Business Information

Eurofins FQL Co., Ltd. | Business Information

Reliability evaluation, environmental testing, failure analysis, support for building and improving quality-related systems and processes, quality-related education, etc., specialists solve quality assurance challenges!

Eurofins FQL Co., Ltd. has its origins in the analysis division of Fujitsu Laboratories Ltd. and the quality assurance department of Fujitsu Ltd. It has been engaged in activities to improve product quality for a long time, not only in material analysis, reliability evaluation, safety assessment, and failure analysis, but also in supplier quality management and manufacturing plant audits. Additionally, it contributes to solving challenges faced by organizations responsible for quality through the development and educational support of personnel involved in quality, as well as the construction and improvement of quality management, product chemical substance management systems, and software development processes. ■ Reliability Evaluation and Environmental Testing Various reliability evaluations, safety verification of secondary batteries, power supplies, etc., including smoke and fire hazards. Evaluation of special environments such as weather resistance and gas corrosion. ■ Failure Analysis Failure analysis of electronic components and devices, confirmation of characteristics related to materials, and detailed analysis of defects. ■ Support for Building and Improving Quality-Related Systems and Processes To achieve QCD (Quality, Cost, Delivery) goals, we support the improvement of development processes using models such as CMMI and Automotive SPICE. ■ Quality-Related Education Customizing educational programs for needs such as "wanting to energize the organization," "wanting to cultivate a quality mindset," and "wanting to provide quality education for new employees."

  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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Survey Environmental Assessment

Survey Environmental Assessment

Environmental assessment (environmental impact assessment) is an important method for maintaining a rich natural environment and a comfortable living environment.

In the world, there are various development projects, but in order to avoid development projects that ignore the natural environment and living conditions, we will predict and evaluate the impacts of development on the natural and living environments, and conduct assessments to determine whether the project plans are appropriate.

  • Other analyses

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