We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for process.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

process Product List and Ranking from 45 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

process Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 奥野製薬工業 大阪・放出、東京、名古屋など Osaka//Chemical
  2. クロスライトソフトウェアインク日本支社 Chiba//software
  3. ネツレン　高周波熱錬株式会社 Tokyo//Machine elements and parts
  4. 4 柿原工業 Hiroshima//Automobiles and Transportation Equipment
  5. 5 アイ'エムセップ 研究開発部 Kyoto//Electronic Components and Semiconductors
Go to Company Ranking

process Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Semiconductor Process & Device Simulator "NovaTCAD" クロスライトソフトウェアインク日本支社
  2. Electroless copper plating process for glass substrates for TGV surface treatment 奥野製薬工業 大阪・放出、東京、名古屋など
  3. Mild carburizing process ネツレン　高周波熱錬株式会社
  4. 4 Plating on Polyimide (PI) Film: Top SAPINA Process 奥野製薬工業 大阪・放出、東京、名古屋など
  5. 4 Dry plating process "Chrome PVD" 柿原工業

process Product List

16～30 item / All 133 items

Displayed results
Environmentally friendly aluminum pretreatment process free of phosphates, boron, and nitrates.

Environmentally friendly aluminum pretreatment process free of phosphates, boron, and nitrates.

It is an aluminum treatment process that does not contain phosphoric acid, boron, or nitric acid. It achieves a uniform and smooth high-gloss appearance while reducing wastewater burden.

Aluminum is a metal that has excellent luster. In addition to physical and mechanical methods, chemical polishing is commonly used to polish aluminum. Chemical polishing is a technique that dissolves the aluminum surface chemically to achieve a polished finish, and phosphoric-nitric polishing solutions are widely used to obtain a high-gloss appearance. Okuno Pharmaceutical Industry, which aims to achieve the SDGs, has developed a high-gloss finishing process for aluminum that does not contain phosphoric or nitric acid. Please take a look at OKUNO's environmentally friendly products that are gentle on the Earth and people.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
UBM formation plating process for aluminum electrodes on a wafer.

UBM formation plating process for aluminum electrodes on a wafer.

It is the process of forming UBM. It can improve the connection reliability between the aluminum electrode and the package terminal.

UBM stands for Under Bump Metal or Under Barrier Metal, and it is a film formed to join aluminum electrode pads on semiconductor chips with package terminals through wire bonding, soldering, or silver sintering. This film is composed of materials such as electroless nickel/gold plating or electroless nickel/palladium/gold plating. We offer a wide range of products that support the evolution of semiconductors and electronics, so please feel free to consult with us.

  • Chemicals

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High connectivity reliability electroless copper plating process with excellent follow-up characteristics.

High connectivity reliability electroless copper plating process with excellent follow-up characteristics.

Introducing the latest surface treatments for semiconductor package substrates all at once. We propose surface treatments and plating chemicals that support the miniaturization, high density, and high performance of electronic devices!

Electronic devices such as computers and smartphones are evolving daily. Along with this, multilayer printed circuit boards are also required to be miniaturized and made more densely packed. Our company has newly developed an electroless copper plating process that excels in coverage for the subtractive process using copper-clad laminates for printed circuit board manufacturing. Okuno Pharmaceutical Industry offers a wide variety of processing chemicals primarily for the plating process of printed wiring boards, covering all aspects of wet processes. Additionally, we propose the latest products and processes for the manufacturing processes of IC substrates and interposers produced by semi-additive processes, so please feel free to contact us.

  • Chemicals

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Process for forming an electroless nickel plating seed layer on polyimide film

Process for forming an electroless nickel plating seed layer on polyimide film

Introducing the latest surface treatments for flexible printed circuit boards used in smartphones, wearable devices, and more! Metallization using a wet process is possible.

Electronic devices such as smartphones are becoming smaller and more high-performance, and flexible printed circuit boards are used to meet the demands for lightweight and compact designs. Our company has newly developed a process that can form a nickel seed layer using a wet method, which is capable of responding to the miniaturization of circuits. This process is compatible with the semi-additive method, allowing for the formation of fine circuits.

  • Chemicals

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Superhydrophobicity is imparted to the aluminum surface, Top Algeek Process.

Superhydrophobicity is imparted to the aluminum surface, Top Algeek Process.

A process for imparting superhydrophobicity to aluminum surfaces! Okuno Pharmaceutical Industry, a specialist in aluminum surface treatment, presents a new product!

The lotus leaf is known as a surface with water-repellent properties found in nature. The surface of the lotus leaf has protrusions of about a few micrometers, and this fine uneven structure manifests its water-repellent properties. As a result, water on the surface of the lotus leaf forms droplets due to surface tension and rolls off along with dirt and foreign substances. By chemically reproducing this self-cleaning property (lotus effect), we have successfully imparted anti-fouling and self-cleaning properties to aluminum surfaces. We propose applications of this process for anti-fouling in buildings, prevention of frost on air conditioning parts, and suppression of reduced thermal conductivity due to water accumulation on cooling components.

  • Chemicals

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Plating chemicals and processes for printed circuit boards/semiconductor package substrates.

Plating chemicals and processes for printed circuit boards/semiconductor package substrates.

Okuno Pharmaceutical Industry introduces plating chemicals and processes under the theme of "OKUNO products contributing to the development of printed circuit boards/semiconductor package substrates"!

From prototype creation to introducing outsourcing partners, please feel free to consult us about any surface treatment concerns. Okuno Pharmaceutical Industry will be presenting the latest plating chemicals and processes at the 24th Semiconductor and Sensor Packaging Exhibition / Semiconductor Backend Process Specialized Exhibition (ISP), which will be held at Tokyo Big Sight from January 25 (Wednesday) to January 27 (Friday), 2023. 【Related Technology Associations】 ◆ Latest surface treatment processes and plating chemicals for semiconductor wafers https://premium.ipros.jp/okuno/product/category/62111/ ◆ Latest plating and surface treatment chemicals for polyimide, PET, LCP, and glass https://premium.ipros.jp/okuno/product/category/49378/ ◆ Printed circuit boards, printed wiring boards, and circuit formation technology https://premium.ipros.jp/okuno/product/category/61629/ A company introduction video titled "Turning Imagination into Reality" is currently available on our website. ◆ Okuno Pharmaceutical Industry Co., Ltd. website https://www.okuno.co.jp/

  • Chemicals
  • Coating Agent
  • Surface treatment contract service

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Electroless plating process for insulation circuit boards for power semiconductors.

Electroless plating process for insulation circuit boards for power semiconductors.

The optimal electroless plating process for the base layer when joining power modules using soldering or silver sintering.

In recent years, SiC and GaN devices have garnered attention as next-generation power semiconductors (power modules) capable of high-temperature operation, with these next-generation power modules expected to operate continuously at temperatures above 200°C. Our company has developed a sulfur-free, low-phosphorus electroless nickel plating solution, "ICP Nicoron LPW-LFN," which minimizes nickel diffusion into solder even in high-temperature environments, thereby maintaining joint reliability. Additionally, sintering bonding using silver particle paste is gaining attention as a high-heat-resistant bonding method to replace traditional solder joints. We have newly developed an electroless silver plating solution, "Top Silver ACC / Top Silver AG," which helps suppress corrosion of the base metal and contributes to improved bonding strength.

  • Chemicals

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Suzukobalt chrome alloy plating Piroalloy SC process

Suzukobalt chrome alloy plating Piroalloy SC process

Introducing the "Pilo Alloy SC Process" for Suzukobalt Chrome Alloy Plating.

Chrome plating is adopted in various industries for its color tone and corrosion resistance. The Pyroalloy SC process introduced here is an environmentally friendly surface treatment that does not contain harmful substances during the process or in the coating. Unlike chrome plating, it can be processed in a barrel, allowing for the plating of small items such as screws. In recent years, concerns have arisen regarding the use of hexavalent chromium in the chrome plating process due to environmental issues, but our product is very easy to handle. ● For more details, please download the catalog or contact us.

  • Other metal materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Brain Seal Co., Ltd. New Product Development Process

Brain Seal Co., Ltd. New Product Development Process

I will explain the flow of the new product development process from development to mass production.

In the new product development process, we first conduct hearings to understand our customers' requests. We select materials that meet the required specifications and propose the most suitable materials. Considering product shape, required quality, and productivity, we suggest precise and reliable molds. To evaluate not only functionality but also quality, productivity, reliability, and cost, we quickly carry out prototype molding in our own factory. After evaluating the prototypes, we provide feedback on any processing issues and customer feedback to the design team to ensure quality. Utilizing state-of-the-art vacuum forming machines and measurement and testing equipment, we deliver high-quality products. We also respond flexibly to requests for short delivery times and small production runs. Through thorough quality management, we provide products and detailed services that satisfy our customers. For more details, please contact us or refer to our catalog.

  • Other machine elements
  • Rubber
  • Other metal materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Ultra-high-speed coagulation sedimentation treatment device ACTIFLO process

Ultra-high-speed coagulation sedimentation treatment device ACTIFLO process

Achieving ultra-fast separation speed by using micro sand (ActiSand) - a space-saving and cost-effective device that matches a highly circular society.

A super high-speed coagulation and sedimentation treatment device that demonstrates remarkable processing capabilities for water supply and drainage clarification treatment systems in all fields.

  • Other processing machines

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Presenting the data! The LIGA process challenging micro-machines.

Presenting the data! The LIGA process challenging micro-machines.

Realized by combining lithography technology, hard electroforming technology, and molding technology.

This document introduces the 'LIGA process,' which is realized by combining lithography technology, hard electroforming technology, and molding technology. Additionally, it features a variety of products in the photoelectroforming process, including "high open-area ratio mesh," "high-elastic probes," and "filters." [Excerpt from the Photoelectroforming Process] - High open-area ratio mesh - High-elastic probes - Filters - Probe sheets with bumps - Spider metal masks *For more details, please refer to the PDF document or feel free to contact us.

  • Mold Design

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Fused coating process

Fused coating process

The film alloyed and bonded strongly! A film that excels in almost all mechanical and physical properties!

In the "Fused Coating Process," after forming a coating through thermal spraying, it is remelted again using a gas torch or electric furnace. This creates an alloy layer between the base material and the coating, achieving metallurgical bonding and resulting in a stronger weld. This coating excels in most mechanical and physical properties. 【Features of Self-Fusing Alloys】 ■ The coating is alloyed. ■ The coating merges with the base material to become integrated. ■ It has wear resistance. ■ It has heat resistance. ■ It has galling resistance. *For more details, please refer to the catalog or feel free to contact us.

  • Surface treatment contract service
  • Other surface treatment equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Comprehensive Catalog of Metal Surface Treatment Processes

Comprehensive Catalog of Metal Surface Treatment Processes

We provide a total solution for the "plating" that you are seeking.

This catalog provides an overview of "Metal Surface Treatment Processes." It includes a non-cyanide silver plating process, "Dain Silver EL, RD," which allows for the selection of replacement or reduction types depending on the target material, as well as various stable tin alloy plating processes such as "DAIN TINGOOD 501, DAIN TINSIL SBB VI." Yamato Kasei can propose "new plating processes" that address issues related to plating, such as environmental concerns, improvement of working conditions, and reduction of total costs. [Contents] ■ Non-cyanide silver plating process ■ Lead-free tin plating process ■ Various additives for the same plating ■ Non-cyanide indium plating ■ Zinc-nickel alloy plating and chromate ■ Nano-etching treatment agents for titanium materials ■ Palladium smut removers *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Electroless Ni-P replacement Au plating process with excellent solder wettability.

Electroless Ni-P replacement Au plating process with excellent solder wettability.

For printed circuit boards. An alternative to the electroless Ni-P/replacement Au plating process is possible.

The 'Electroless Ni-P/Replacement Au plating process with excellent solder wettability' is a plating process that uses 4Ag, which has similar characteristics to Au, making it an alternative to the electroless Ni-P/Replacement Au plating process. The solder wettability is better immediately after plating compared to the electroless Ni-P/Replacement Au plating. For more details, please contact us or download the catalog.

  • Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Production process

Production process

Our company produces metal press parts, plastic molded parts, and even assembly!

At Shimizu Industries, we provide the desired products through a "one-stop production system" from prototyping to mold manufacturing and mass production, ensuring single-function machines, high quality, and low cost. We are also promoting initiatives called "4M activities," which constantly incorporate cutting-edge production and quality management methods as well as IoT technology. Through our "one-stop production system" from handmade prototypes to mold manufacturing and mass production, we deliver the desired products with short lead times, high quality, and low cost. [Overview] ■ 4M Project ■ Automation Project ■ Production Management Project ■ Quality Management Project *For more details, please refer to the PDF materials or feel free to contact us.

  • plastic

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.