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substrate(red) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
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substrate Product List

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LTCC substrate

LTCC substrate

LTCC substrate

LTCC stands for Low Temperature Co-fired Ceramics, which refers to low-temperature sintered ceramics. The low firing temperature allows the use of metals with low resistance as conductors, making it ideal for high-frequency applications due to its low loss. Its ease of multilayering and flattening, along with minimal shrinkage variation, enables high-precision and high-density mounting. By using DPC (Direct Plating Copper), it can also be utilized in applications that require high thermal conductivity and excellent heat dissipation. Thus, LTCC is expected to be used in various fields such as circuit boards and semiconductor packages.

  • others

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High thermal conductivity substrate "Metal substrate"

High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board

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Zero One Rotary Encoder Expansion Board 'ADRSZRE'

Zero One Rotary Encoder Expansion Board 'ADRSZRE'

Easy measurement just by connecting to the terminal block/thru-hole! Accelerate the creation of IoT devices!

The "ADRSZRE" is a rotary encoder expansion board exclusively for the Raspberry Pi Zero. By simply connecting a rotary encoder to the terminal block/thru-hole, measurement can be easily performed, accelerating the creation of IoT devices. Additionally, by conducting measurements with a PIC microcontroller, it prevents the loss of pulses from high-pulse rotary encoders. 【Features】 ■ Compact "pHAT" size ■ High-precision measurement ■ Built-in high-performance PIC microcontroller considering real-time capabilities ■ Equipped with LEDs to visualize operating status *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors
  • Other electronic parts
  • Printed Circuit Board

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eDP Simple Signal Generation Board 'iM1427'

eDP Simple Signal Generation Board 'iM1427'

It is suitable for high-resolution, high-speed transmission modules.

The "iM1427" is a simplified signal generation board with eDP (embedded Display Port/5.4G) interface, compatible with modules for Ultra books and Tablets, and includes pattern editing software for eDP output. This board has two DisplayPort outputs, allowing for simultaneous lighting of two panels, thereby expanding the range of inspection and evaluation methods. 【Features】 ■ Includes software for editing lighting patterns and timing ■ Allows pattern creation and timing settings to match the testing environment conducted by the customer *For more details, please download the PDF (English version) or feel free to contact us.

  • Signal Generator
  • Printed Circuit Board

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Sapphire Wafer

Sapphire Wafer

We consistently carry out everything from crystal growth of single crystal sapphire to cutting, grinding and polishing, PSS processing, GaN epitaxial growth, and special processing!

In the doujin industry, we mainly provide sapphire materials using the Kyropoulos method. Our sapphire substrates are produced in domestic factories as well as through contract manufacturing with reputable overseas manufacturers.

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  • Chip type LED
  • diode

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Power semiconductor substrate (DCB)

Power semiconductor substrate (DCB)

Over 10 years of manufacturing experience for substrates for thermoelectric modules (Peltier elements). For power devices, solid-state relays (SSR), and more!

This is an insulating substrate for heat dissipation, which has a copper circuit board bonded to an alumina ceramic substrate using the DCB (Direct Copper Bond) method. *DCB (Direct Copper Bond) method refers to the technique of bonding a copper circuit board to a ceramic substrate through eutectic reaction. **Features** - Over 10 years of manufacturing experience for substrates used in thermoelectric modules (Peltier elements). - Manufactured at a 100% wholly-owned subsidiary in China. - Options for alumina ceramic white boards from Japan, Germany, or China. - The ceramic substrate can flexibly accommodate various external dimensions through mold processing, laser processing, etc. - The ceramic white board and copper plate are bonded using in-house equipment, and copper plating processes such as etching are applied before shipment. - The surface of the copper circuit can be treated in various ways, including untreated, Ni plating, and Ni + Au plating. *For more details, please contact us or download the PDF.*

  • Printed Circuit Board
  • Other semiconductors

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Gold / Silver / Aluminum / ITO Coated Substrate

Gold / Silver / Aluminum / ITO Coated Substrate

Gold / Silver / Aluminum / ITO coated substrate (slide glass / cover slip / silicon wafer / mica)

Surface plasmon resonance (SPR), microarrays, biosensors, nanotechnology, neurobiology, self-assembled monolayers (SAM), X-ray diffraction (XRD), semiconductors, and a variety of research applications can utilize atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and other electron microscopy techniques. In addition to slide glass, we also offer silicon wafers and mica substrates. The main coatings are gold (Au), silver (Ag), aluminum (Al), and ITO. High-reflectivity gold-coated slides are ideal for observing backscattered electron images (BSE) (10-15 eV) and secondary electron images (SE) (5 eV) using SEM. For backscattered electron images <BSE>, a gold thickness of 10 nm is recommended, while for secondary electron images <SE>, products of 50/100 nm are suggested.

  • Glassware and containers
  • Other inspection equipment and devices
  • Other consumables

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Substrates, etc. Brain Power [Authorized Dealer]

Substrates, etc. Brain Power [Authorized Dealer]

From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.

Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.

  • Printed Circuit Board

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