新興製作所 List of Products and Services

We would like to introduce a case study of surface measurement using the newly introduced white light interference microscope at our company. The white light interference microscope is a type of microscope that utilizes the phenomenon of light interference to measure and analyze "surface shape." It accommodates surface roughness and line roughness through 3D measurement, regardless of the material being measured. In the measurement of the wire slice surface and polishing surface of polycrystalline ceramics, the results were as follows: slice surface Sa 0.8446 μm, lapping surface Sa 0.2506 μm, and polishing surface Sa 0.00583 μm. Additionally, in the measurement of the polishing surfaces of SiC single crystal and SUS316L, the results were: SiC single crystal Sa 0.000458 μm and SUS316L Sa 0.000302 μm. 【Features of the White Light Interference Microscope】 ■ Non-contact & Surface Measurement - No restrictions on the material being measured - Accommodates surface roughness and line roughness through 3D measurement ■ Wide Measurement Range & High Resolution Measurement - Wide in-plane measurement range exceeding millimeter units - Height resolution of 0.01nm *For more details, please refer to the PDF document or feel free to contact us.

• 3D measuring device

We also have single wire saws in addition to multi-wire saws. With the single wire saw, it is possible to process large diameter materials and thick plates that are difficult to process with multi-wire saws. By adopting a fixed abrasive method using diamond wire, we can significantly reduce processing loss of expensive materials. 【Main compatible materials】 Aluminum Nitride AlN / Alumina Al2O3 / Sapphire / Silicon Carbide SiC / Copper Cu / Molybdenum Mo / Tungsten W / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate LiNbO3 / Lithium Tantalate LiTaO3 / Barium Titanate BaTiO3 / Zirconia ZrO2 / Silicon Nitride Si3N4 / Cemented Carbide / Ceramic Matrix Composites (CMC) / Crystalline materials (Si, SiC, GaN, etc.) *For more details, please download the PDF catalog or feel free to contact us.

• Processing Contract
• Wafer processing/polishing equipment
• Circuit board processing machine

Our company specializes in "precision cutting and polishing processing" of a wide range of materials, including ceramics, crystalline materials, glass, metals, and resins. Among these, in our "polishing technology," we utilize two methods: lapping processing and polishing processing (mirror polishing method) to achieve the desired surface roughness. 【Features of Our Polishing Technology】 ■ Capable of processing a wide range of difficult-to-cut materials ■ Can process thousands to tens of thousands of pieces simultaneously ■ We can provide consistent support for SiC single crystals, which are in growing demand in the power semiconductor market, from outer shape processing and cutting to mirror polishing. *For more details, please download the PDF document or feel free to contact us.

• Processing Contract
• Wafer processing/polishing equipment
• Circuit board processing machine

Our company specializes in "ultra-precision lapping processing/ultra-precision polishing processing." "Ultra-precision lapping processing" involves performing sliding motion (fitting) while containing free abrasive particles (grinding agents), which polishes the workpiece by micro-cutting, resulting in a flatter finish. "Ultra-precision polishing processing" is a polishing method that finishes the lapped surface to a flat mirror finish. For hard materials, hard polishing processing using diamond powder is employed, while mechanochemical polishing is used for oxides and magnetic materials. 【Features of Ultra-Precision Lapping Processing】 - Free abrasive processing that results in a flatter finish for the workpiece - Achieves high-precision processing surfaces and dimensions - Compatible with a wide range of materials, from ceramics to metals, glass, and single crystals - A processing method has also been developed that uses diamond abrasives fixed to a metal flat plate to generate high-precision surfaces. *For more details, please refer to the PDF document or feel free to contact us.

• Ceramics
• Other metal materials
• Wafer processing/polishing equipment

Among the various cutting technologies, our company is capable of mass production using the fixed abrasive method, which is becoming a global trend in recent years, through "multi-wire cutting." We excel particularly in ceramics, metals, and crystalline materials. Compared to the free abrasive method, there are various advantages, and we have compiled information on the mechanisms of the free abrasive method and the fixed abrasive method in multi-wire cutting. 【Contents】 ■ What is multi-wire cutting? ■ Cutting process ■ Comparison of free abrasive method and fixed abrasive method ■ Advantages of the fixed abrasive method ■ Summary *For more details, please download the PDF catalog or feel free to contact us.

• Processing Contract

Shinko Seisakusho Co., Ltd. offers cutting and polishing technologies as professionals in ultra-precision machining and polishing. With ultra-precision cutting using a multi-wire saw, it is possible to cut materials such as silicon carbide, silicon nitride, cemented carbide, and tungsten. Dicing of small pieces can process tens of thousands of units at once. Additionally, ultra-precision polishing through single-sided and double-sided polishing allows for mirror polishing of φ2mm small pieces, SiC single crystals, and ceramics, with small piece polishing capable of processing tens of thousands of units at once. 【Business Activities】 ■ Precision polishing of mechanical and electronic components ■ Precision cutting of mechanical and electronic components ■ Polishing of optical single crystals *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Other processing machines
• Plastic processing machines (cutting and rolling)

At Shinko Seisakusho Co., Ltd., we perform "polishing processing." Polishing processing is a mirror polishing method that finishes a wrapped surface with a pearly texture to a smooth surface. There are methods such as mechanical polishing and chemical mechanical polishing (CMP), and our company appropriately selects the method according to the various material properties from single crystals, ceramics, metals, to resins, and finishes to your desired surface roughness. We can accommodate various requests for surface roughness ranging from sub-micron to nano-order. If you have any concerns regarding the surface condition of your materials, please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.

• Processing Contract
• Other processing machines

At Shinco Manufacturing Co., Ltd., we offer "lapping processing." Lapping processing involves performing sliding motion while containing free abrasive particles (grinding agents), which polishes the workpiece by making minute cuts, resulting in a flatter finish on the workpiece through free abrasive processing. We have a range of double-sided machines from large 18B models to small 5B models, and for single-sided machines, we offer various sizes from large 48-inch models to small 15-inch models, allowing us to accommodate a wide range of needs from small spot processing to mass production. We also handle various materials, including ceramics, metals, glass, and single crystals, so if you have any issues with lapping processing, please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.*

• Processing Contract
• Other processing machines

At Shinco Manufacturing Co., Ltd., we perform "slicing processing." The cutting technology that started with a wire diameter of 120μm and diamond sizes of 15-25μm (total cutting allowance of 150μm) has now been reduced to a wire diameter of φ60μm and diamond sizes of 6-12μm (total cutting allowance of 75μm), which is half of what it was at that time. Currently, we are receiving positive feedback from customers both domestically and internationally, and we are expanding our fixed abrasive cutting technology, developed through silicon wafer processing for solar cells, into new markets. If you have any issues with cutting technology for various materials, we offer both free abrasive and fixed abrasive methods, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.

• Processing Contract
• Other processing machines

This document is a glossary of terms from Shinko Seisakusho, a company specializing in ultra-precision processing technologies such as grinding, polishing, cutting, and diamond wire in Osaka, Okayama, and Tsuyama. It provides detailed explanations of terms including "precision cutting processing," "lapping processing," "single-sided processing machine," "surface roughness units," and "optical flat." 【Terms Included (Excerpt)】 ■ Precision Cutting Processing ■ Lapping Processing ■ Polishing Processing (Mirror Finish) ■ Single-Sided Processing Machine ■ Abrasives ■ Polishing Agents *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Other processing machines

A "multi-wire saw" is a device that fixes the workpiece to a descending table and presses it against a wire tool that runs at high speed over guide rollers to perform slicing operations. The "guide rollers" have grooves formed at pitches that match the thickness of the product to be processed. Depending on the pitch, it is possible to wind dozens to thousands of wires. 【Features】 ■ Minimal cutting loss ■ Cost-effective and high yield slicing ■ Good thickness and flatness accuracy ■ Capable of slicing thin sheets of about 0.1mm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Other processing machines

Polishing processing is a grinding method that finishes a wrapped surface of pear skin into a flat mirror surface. Compared to wrapping processing, the application of pressure during processing remains the same, but the processing liquid and media are completely different. For polishing processing of hard materials, hard polishing using diamond powder is employed, while for oxides and magnetic materials, mechanochemical polishing is used. The surface roughness can achieve levels from sub-micron to nanometers. Additionally, there are both double-sided and single-sided processing machines, and when high precision such as TTV and LTV is required, double-sided machines are used.

• Ceramics
• Other metal materials
• Wafer processing/polishing equipment

Wrapping processing refers to a method of free abrasive processing that involves performing a sliding motion (rubbing) while containing free abrasive particles (grinding agents), thereby polishing the workpiece by making minute cuts, resulting in a flatter finish on the workpiece. As a result, high-precision processing surfaces and dimensions can be achieved. Furthermore, a processing method has also been developed that fixes diamond abrasive particles to a metal flat plate as a machine for generating high-precision surfaces.

• Other metal materials
• Processing Contract

At Shinko Seisakusho, mass production processing using the fixed abrasive method, which is becoming a global trend, is possible! We manufacture solar silicon wafers using the fixed abrasive method (diamond wire) with two types of materials: single crystal and polycrystalline. Currently, the yield rate for the fixed abrasive method has achieved over 95% on a mass production basis, with more than 4 million silicon wafers produced per month. 【Main Supported Materials】 Aluminum Nitride (AlN) / Alumina (Al2O3) / Sapphire / Silicon Carbide (SiC) / Copper (Cu) / Molybdenum (Mo) / Tungsten (W) / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate (LiNbO3) / Lithium Tantalate (LiTaO3) / Barium Titanate (BaTiO3) / Zirconia (ZrO2) / Silicon Nitride (Si3N4) / Cemented Carbide (SK Material) / Ceramic Matrix Composites (CMC) *For more details, please download the PDF catalog or feel free to contact us.

• Processing Contract

○ Cutting Processing of Materials Shinko Seisakusho began mass production processing using a fixed abrasive method in 2009 and owns a fixed abrasive wire saw for cutting silicon wafers for solar cells. Currently, it achieves a processing yield of over 96% and mass-produces more than 4 million silicon wafers per month. ○ Polishing and Lapping Processing Polishing processing is a method that further flattens and finishes the lapped surface formed during lapping processing to a mirror finish. It uses a soft polishing tool and employs fine particles (micron, sub-micron) as abrasives. ○ Material Development - Single Crystal SiC In 2010, marking the 50th anniversary of its founding, the company started its own material development. Utilizing its technology to handle materials supplied by clients, it aims to focus on developing its own brand of materials in the future. As the first step, it has developed single crystal SiC material, with plans to sell SiC wafers in sight.

• Processing Contract
• Other metal materials