ナミックス List of Products and Services

We have developed a low-resistance and flexible Ag wiring material using our proprietary metal powder dispersion technology and resin formulation technology. By adopting nano Ag as the conductive powder, we have achieved a volume resistivity of uΩ·cm. Since it exhibits low resistance even in thin films (<10um), it also enables cost reduction compared to conventional products.

• Other electronic parts
• Other metal materials

Development is underway for flexible/stretchable substrates for wearable devices. Circuits can be formed on these substrates, and wiring that can accommodate the stretching and contracting of the substrate can be created. In recent years, in-mold electronics (IME), which combines the in-mold insert decoration process with conductive paste/ink for printed electronics, has been gaining attention. Wiring that can be formed to accommodate the heating and molding of the film (stretching at high temperatures) and the in-mold insert molding process is possible.

• Composite Materials
• Other electronic parts

Development is underway for flexible/stretchable substrates for wearable devices. It accommodates substrates that do not have heat resistance for that purpose. 【Product/Device Features】 - Compatible with dispense coating - Can cure at 70°C! - Good conductivity - Supports component mounting on stretchable/flexible substrates ~ Achieves an elastic modulus of 0.6 GPa (25°C/DMA) with a thermosetting type ~ - High reliability ~ Connectivity stability after 1000 temperature cycles ~

• Composite Materials
• glue
• Other electronic parts

With the increasing density and integration of devices, high thermal conductivity materials are in demand. Additionally, Pb solder materials have not yet been established. Therefore, by using MO technology, we have developed a high thermal conductivity die attach that allows for low-temperature sintering. A thermal conductivity of 170 W/mK has been achieved, and the brittleness of the Ag sintered body has been improved through reinforcement with resin. We have samples available for provision, so please contact us for consultation. 【Features】 ■ Uses MO technology ■ Enables low-temperature sintering ■ Thermal conductivity of 170 W/mK ■ Samples available for provision *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• others

"Dia Attach Agent" is a thermosetting conductive material that is versatile for various applications, including die bonding for bare chips, adhesion of LEDs, and bonding of electrodes and lead wires, as well as for high thermal conductivity. Our trademark "Unimec" is a conductive material that can be treated at low temperatures, made from a thermosetting resin primarily based on epoxy resin, with specially processed in-house conductive powder uniformly dispersed throughout. The development and blending of conductive powders enable the manufacture of products with various characteristics. [Features] ■ Versatile applications ■ Thermosetting conductive material ■ Can be treated at low temperatures *For more details, please refer to the PDF document or feel free to contact us.

• Dedicated IC
• Other semiconductors
• others

The "Passive Component Terminal Electrode Material" is a thermally sintered conductive material tailored for the terminal electrodes of surface-mounted passive components such as chip resistors, MLCCs, and chip inductors. It promotes the lead-free transition of products. Our trademark "Himec" is a sintered conductive paste that disperses metal particles (Ag, Cu, Ni) and inorganic additives in a vehicle, adjusted for paste characteristics according to the type of substrate, processing conditions, and application methods. 【Features】 ■ Material for terminal electrodes ■ Thermally sintered ■ Promotes lead-free transition *For more details, please refer to the PDF document or feel free to contact us.

• Other terminal blocks
• Other polymer materials
• Other electronic parts

The "Passive Component Internal Electrode Material" is a thermally sintered conductive material tailored for the internal electrodes of surface-mounted passive components such as MLCCs and chip inductors. Our trademark "Himec" is a sintered conductive paste that disperses metal particles (Ag, Cu, Ni) and inorganic additives in a vehicle, adjusted for paste characteristics according to the type of substrate, processing conditions, and application methods. 【Features】 ■ Thermally sintered ■ Low resistance ■ High printing accuracy ■ Various shrinkage rates *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials
• Other electronic parts

"Surface mount adhesive" is a thermosetting conductive adhesive that can undergo low-temperature processing compatible with lead-free mounting and has high-temperature solder reflow resistance. Our trademark "Unimec" is a conductive material that can be processed at low temperatures, consisting of a thermosetting resin primarily based on epoxy resin, with specially treated in-house processed conductive powder uniformly dispersed. The development and blending of conductive powders enable the production of products with various characteristics. [Features] ■ Low-temperature processing possible ■ Thermosetting conductive material ■ Compatible with lead-free mounting ■ High-temperature solder reflow resistance *For more details, please refer to the PDF document or feel free to contact us.

• Other terminal blocks
• Other polymer materials
• Other electronic parts

The "Passive Component Terminal Electrode Agent" is a thermosetting conductive material suitable for application processes such as printing and dipping, used as terminal electrode materials for surface-mounted components like chip resistors, MLCCs, and tantalum capacitors. Our trademark "Unimec" is a conductive material that can be treated at low temperatures, consisting of a thermosetting resin primarily based on epoxy resin, with specially processed in-house conductive powder uniformly dispersed. The development and blending of conductive powders enable the manufacturing of products with various characteristics. 【Features】 ■ Can be treated at low temperatures ■ Thermosetting conductive material ■ Ideal for application processes such as printing and dipping *For more details, please refer to the PDF document or feel free to contact us.

• Other terminal blocks
• Other polymer materials
• Other electronic parts

"Die Attach Adhesive" is one of the methods for mounting bare chips, where the circuit side of an IC chip with metal bump electrodes is adhered to the opposite side of the mounting substrate using a dispensing type insulating material for the mounting technology. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ One of the methods for bare chip mounting ■ Dispensing type *For more details, please refer to the PDF document or feel free to contact us.

• Dedicated IC
• Other semiconductors
• others

The "Dam & Fill Material" is an insulating material primarily used for sharp dam formation in CSP/BGA and other wire bonding implementations, enabling smooth filling between wires for sealing. It boasts excellent moldability and is a highly reliable material that reduces package warpage. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Sharp dam shape ■ Excellent moldability ■ Achieves reduction of package warpage ■ High reliability *For more details, please refer to the PDF document or feel free to contact us.

• Dedicated IC
• Other semiconductors
• others

The "Low-Temperature Curing Adhesive" is a product of Namix, a trademark of "Chip Coat," which conducts research, development, manufacturing, and sales of electrochemical materials. This product is designed for high-precision bonding and fixing, as well as for bonding components with low heat resistance, and it is an insulating adhesive that can cure at temperatures below 100°C. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Low-temperature curing type *For more details, please refer to the PDF document or feel free to contact us.

• Dedicated IC
• Other semiconductors
• glue

The "adhesive for camera modules" is an insulating adhesive that allows for a process with minimal shrinkage due to UV curing. It is intended for bonding and fixing applications that require high positional accuracy, as well as for bonding materials with low heat resistance. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Curing by UV irradiation ■ Low-temperature curing ■ High reliability *For more details, please refer to the PDF document or feel free to contact us.

• Dedicated IC
• Other semiconductors
• glue

The 'Pre-supply Type Underfill Material (NCP)' is a pre-supply type paste underfill material. After applying it to the substrate or interposer, the chip is thermocompression bonded (TCB) and sealed. It is a material that can improve productivity and support fillet width control (KOZ compatible). 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Pre-supply type paste ■ Improved productivity ■ Compatible with fillet width control *For more details, please refer to the PDF document or feel free to contact us.

• Microcomputer
• Dedicated IC
• ASIC

The "Underfill Material for CSP/BGA Board Level" is a reinforcement material designed to improve impact resistance and heat cycle durability when secondary mounting packaged bare chips onto a motherboard. It is a capillary flow type material that is injected and sealed, characterized by high reliability and high productivity. 【Features】 ■ Insulating material for injecting and sealing semiconductor chips ■ Capillary flow type ■ Excellent injectability for narrow gaps ■ High reliability, high productivity, and high moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

• Microcomputer
• Dedicated IC
• ASIC

The "Underfill for Chipon Film" is one type of bare chip mounting, where the circuit side of an IC chip with metal bump electrodes is directly electrically connected to the mounting substrate. It is a chip coat that is injected and sealed using a capillary flow type. Among insulating materials, it has good injectability into narrow gaps and excellent moisture resistance, and it is a material compatible with flexible substrates, mainly used in mounting substrates for LCD drivers and similar applications. 【Features】 ■ One type of bare chip mounting ■ Insulating material for sealing semiconductor chips ■ Capillary flow type ■ Excellent injectability into narrow gaps ■ Excellent moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

• Microcomputer
• Dedicated IC
• ASIC

The "Adfurema" registered trademark of Namix, which conducts research, development, manufacturing, and sales of electrochemical materials, offers the "Adhesive Film (Machinery and Measuring Instruments)." This thin-layer insulating adhesive film is suitable for high-precision bonding in various materials and shapes, and it is a thermosetting resin film in an unreacted state that allows for flow control. 【Features】 ■ Optimal for high-precision bonding ■ Low-temperature curing ■ Film thickness: 40, 80µm *For more details, please refer to the PDF document or feel free to contact us.

• others
• glue

The "semiconductor insulating encapsulation film" is a product of Namix, a company engaged in the research, development, manufacturing, and sales of electrochemical materials, under the trademark "Adfrema." It is a pre-supply type film underfill material that is laminated onto a substrate or interposer, followed by thermal compression bonding (TCB) of the chip, and serves as an encapsulation type underfill material. This material is capable of improving productivity and controlling fillet width (compatible with KOZ), and it can also be supplied to wafers. 【Features】 ■ Pre-supply type film ■ Improved productivity ■ Capable of fillet width control ■ Can be supplied to wafers *For more details, please refer to the PDF document or feel free to contact us.

• others
• Other surface treatment equipment

The "High-Performance Insulating Adhesive Film for Electronic Components and Modules" is a product of Namix, a company engaged in the research, development, manufacturing, and sales of electrochemical materials, under the trademark "Adofrema." It is a thermosetting resin film in an unreacted state that features low dielectric constant and low dielectric loss tangent, making it ideal for GHz band high-frequency characteristics. It has excellent filling properties for uneven surfaces at low temperature and low pressure, and it can achieve high adhesion, high heat resistance, and high reliability. It is suitable for application in electronic components for RF modules, which require miniaturization and low profile. 【Features】 ■ Low dielectric constant and low dielectric loss tangent ■ Thin layer insulation: 5–30µm thickness ■ Excellent filling properties for uneven surfaces at low temperature and low pressure ■ Thermosetting resin film ■ Applicable to electronic components for RF modules *For more details, please request documentation or view the PDF data available for download.

• others
• glue

The "High Frequency and High-Speed Transmission FPC and Rigid Circuit Board Insulating Adhesive Film" is a product of Namix, which conducts research, development, manufacturing, and sales of electrochemical materials under the trademark "Adfrema." This film has excellent low dielectric constant and low dielectric loss tangent, making it ideal for high-frequency characteristics in the GHz range. It features good filling properties for uneven surfaces at low temperature and low pressure, and it can exhibit high adhesion and high heat resistance in its unreacted state as a thermosetting resin film. In addition to being used as an interlayer insulating material and build-up material for FPCs, it is also suitable as a MEMS structural material and process material, and it is compatible with laser and plating processing. 【Features】 - Low dielectric constant and low dielectric loss tangent - Thin layer insulation: 5 to 30 µm thickness - Excellent filling properties for uneven surfaces at low temperature and low pressure - Thermosetting resin film - Suitable for laser and plating processing *For more details, please refer to the PDF document or feel free to contact us.

• others
• glue

The "Coating Agent for Chip Resistor Protection" is a product of Namix, a company engaged in the research, development, manufacturing, and sales of electrochemical materials, under the trademark "Overcoat." It is an insulating material for the protective coat (G2) of chip resistor elements, featuring excellent printability and moisture resistance. 【Features】 ■ Insulating material for the protective coat of chip resistor elements ■ Excellent printability and moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

• Coating Agent
• others

The "Underfill for Flip Chip" is a chip coating that is injected and sealed using a capillary flow type in the implementation technology where the circuit surface of an IC chip with metal bump electrodes is directly electrically connected to the mounting substrate side. It is one of the bare chip mounting methods and can accommodate the flip chip technology that is advancing in various applications, including CPUs and graphic LSIs. 【Features】 ■ One of the bare chip mounting methods ■ Insulating material that seals semiconductor chips ■ Capillary flow type *For more details, please refer to the catalog or feel free to contact us.

• Microcomputer
• Dedicated IC
• ASIC