三星ダイヤモンド工業 List of Products and Services

On the day of the event, we will unveil the new glass cutter "OZREE." The "glass cutter" has been a beloved tool for cutting various glass products for many years, dating back to the early days of MDI's founding in 1935. We have returned to the origins of manufacturing, reigniting the passion for "cutting glass" that our predecessors built upon, and have completed the new glass cutter "OZREE." The new "OZREE" is the culmination of our 90th anniversary, embodying a transformed "appearance and function" while retaining our unchanged "commitment." All the technology and passion we have cultivated over the years are condensed into this one tool. We invite you to come to the venue and experience the performance and differences of the new "OZREE" for yourself.

• Glass
• Other FPD related

On the day of the exhibition, we plan to demonstrate the standalone machine "DIALOGIC DS Series," which consolidates the chip-making process of semiconductor wafers into a compact body. We will also introduce processing technologies for the chip-making process of cutting-edge SiC wafer semiconductor devices.

• Wafer

We will be exhibiting at the following trade shows! 【Suwa Area Industrial Messe 2023】 　Dates: October 19 (Thursday) - October 21 (Saturday), 2023 　Location: Okaya City Comprehensive Gymnasium / Techno Plaza Okaya 　Booth Number: East Gymnasium 115 【High Precision and Difficult Processing Technology Exhibition 2023】 　Dates: November 29 (Wednesday) - December 1 (Friday), 2023 　Location: Tokyo Big Sight, West Hall 2 　Booth Number: K-81 We will be showcasing various products, including PCD component processing products. We kindly invite everyone to come and visit us.

• Other consumables
• Processing Jig
• Grinding Machine

★Benefits of PCD Processing 　○Less change in diameter due to wear and temperature ★Advantages of PCD Ball Gauges with a Spherical Tip 　〇Less likely to damage the measurement target during insertion 　〇Can be inserted into the measurement target even when tilted 　○Less likely to damage the inside of the hole in the measurement target during measurement

• Other consumables
• Processing Jig
• Grinding Machine

★ Proven track record of long-term use in-house - turning innovative parts into products! Improved work efficiency, reduced man-hours, excellent continuous processing. ○ Quick changeover according to the processing target, no hassle ○ Adjust the stopping position according to the output ○ A rich lineup, with diameter and length customizable ○ Custom-made to fit the collet diameter you are using ○ We also accept inquiries regarding specifications, material changes, and special structures.

• Other consumables
• Processing Jig
• Grinding Machine

★Our in-house developed jigs accommodate complex shapes and difficult machining / Clarifying improvement points through research and analysis technology! Shapes that are difficult to achieve with just our existing equipment can be produced by designing and developing jigs. 〇 Complex shapes are made possible with jigs specifically for wire electrical discharge machining. 〇 High-precision machining without runout is achieved using a centering jig for cylindrical grinding. We are also designing and developing various other machining jigs!

• Other consumables
• Processing Jig
• Grinding Machine

We exhibited at two trade shows: Medtec Japan in April and the New Value Creation Exhibition at the Machine Elements Technology Exhibition in June! Although it's a bit late, we would like to share the details. 【Medtec Japan】 Dates: April 19 (Wed) - 21 (Fri) Theme: Proposing PCD (Polycrystalline Diamond) solutions for consumable parts in medical equipment manufacturing, showcasing our strengths in precision micro-machining and fine grinding as general metal parts, and highlighting our ability to handle simple metal processing with innovative jigs. Response: Currently handling inquiries and estimates! 【New Value Creation Exhibition at the Machine Elements Technology Exhibition】 Dates: June 21 (Wed) - 23 (Fri) Theme: Moving away from a focus solely on mold components, we showcased our polished technology applied to cutting tools and increased inquiries for guide and chuck components using PCD, as well as original products like pin gauges and collet stoppers. Response: Many companies visited with consultation projects, and we are currently advancing these projects! ■ Upcoming Exhibitions 【Suwa Industrial Messe 2023】 Dates: October 19 (Thu) - 21 (Sat) 【High Precision and Difficult Processing Technology Exhibition 2023】 Dates: November 29 (Wed) - December 1 (Fri)

• Other consumables
• Processing Jig
• Grinding Machine

[Overview of the Skills Certification] *Quoted from JAVADA's website The Skills Certification is a national certification system that "tests the skills possessed by workers against certain standards and certifies them as a nation." The purpose of the Skills Certification is to enhance the general social evaluation of skills and to improve the skills and status of working individuals, and it is implemented based on the Act on the Promotion of Vocational Ability Development. Since its implementation in 1959, the Skills Certification has been continuously enhanced, and as of April 2023, there are 111 occupations conducted by prefectures and 20 occupations conducted by designated examination organizations. Those who pass the Skills Certification are highly valued in their workplaces as proof of their solid skills. [Our company has implemented a qualification acquisition encouragement system] Our company has established a qualification acquisition encouragement system aimed at the development and improvement of each individual's abilities. We aim to enhance skills to improve the quality of the products we provide to our customers.

• Other consumables
• Processing Jig
• Grinding Machine

**Overview of Performance** Samsung Diamond Industrial initially utilized electric processing technologies such as discharge machining and laser machining to create mechanical tools for glass cutting, including flat panel displays (FPD) that used cemented carbide, achieving longer lifespans through the development of PCD (sintered diamond). However, there were challenges in responding to the thinning of glass and the improvement of cutting quality due to advancements in FPD. To address this, we advanced the discharge machining technology for PCD, establishing a manufacturing method for small-diameter (Φ2mm or less) wheel tools with sharp and precise edges, as well as high-straightness PCD small-diameter pins (Φ0.8mm or less) that serve as rotating axes, enabling production at a level of tens of thousands of units per month. Furthermore, in addition to this high-precision discharge machining technology, we developed new products such as new tools and industrial components by implementing new techniques in brazing and polishing. We provide products with fine and complex structures and shapes that were previously considered difficult to produce industrially with PCD, as well as items with high precision and high-quality surface conditions (detailed information), engaging in excellent manufacturing based on technological development.

• Other consumables
• Processing Jig
• Grinding Machine

We own multiple machines not only for water-based types but also for oil-based types (a total of 22 machines), and the minimum diameter of the wire is φ0.03 (thinner than a hair), allowing for high-precision processing even with the smallest inner radius. ◆ 30 years of experience in wire electrical discharge machining ◆ Development of new products for high-precision PCD special tools and parts using precision electrical discharge machining technology Awarded a manufacturing excellence award ◆ Several certified wire electrical discharge machining skill exam passers on staff We can meet stringent quality requirements with high-precision processing.

• Other consumables
• Processing Jig
• Grinding Machine

With years of experience in brazing and the accumulated expertise of certified engineers within the company, along with innovations to increase brazing surfaces and repeated strength tests using various brazing materials and component materials, we can achieve stable and high-strength joints. By utilizing this technology and materials with a thickness of 16mm, we ensure that even with ultra-thin punches, the strong connection at the thick shaft part will not come apart.

• Other consumables
• Processing Jig
• Grinding Machine

【Independently Developed PCD Material】 MDI has developed a unique material in collaboration with material manufacturers while pursuing the durability of glass cutting tools. The diamond powder has an ultra-fine particle size of less than 1 µm, and compared to conventional PCD materials, it possesses the following characteristics: - Improved wear resistance and overcoming brittleness - No occurrence of edge chipping or chipping specific to PCD This allows for excellent machinability and enables delicate and high-precision processing. 【PCD High-Precision Processing Know-How】 Leveraging its high hardness, it is generally used for cutting and grinding tools for hard alloys and brittle materials. At MDI, we have accumulated years of experience in manufacturing PCD tools for cutting brittle materials, including glass, and have developed high-precision processing and quality inspection techniques at the micrometer level.

• Other consumables
• Processing Jig
• Grinding Machine

【Performance Introduction】 ○Part Name: Centerless Blade ○Device Name: Centerless Grinding Machine ○Application: Used for processed products (sintered PCD / φ0.8×21L) at our company ■Introduction (From the Field) We received a consultation from our manufacturing department regarding measures to improve equipment utilization rates in the bottleneck process and reduce setup changeover times. ■Current Situation Analysis In the relevant process, a carbide blade was used on the centerless grinding machine, resulting in a setup changeover task occurring once a day for one hour due to wear. Additionally, the worn parts were being discarded. ■Issue Identification and Proposal To reduce the setup changeover time for blade replacement, we proposed a PCD blade with high wear resistance. While other companies were unable to produce PCD blades with a thickness of less than 1mm without warping, our high-hardness component business achieved a quality that does not warp. ■Implementation and Effects The setup changeover task that occurred once a day was reduced to once every ten days. We achieved a reduction of 18 hours in labor and 18 discarded blades over the course of a month!

• Other consumables
• Processing Jig
• Grinding Machine

★Micro machining using wire electrical discharge machining ★Robust brazing technology accumulated over many years of experience ★Precision finishing of approximately 0.06μm made possible by unique polishing techniques - Lifespan over 10 times longer than carbide punches (achievements of 150 million shots) - Chipping prevention treatment - Machining technology with no steps or dents at the boundary of carbide - Coaxiality within 0.003mm, machining accuracy of ±0.002mm or less Please consult us regarding machining with a tip diameter of 0.5mm or less *This product is an example of our "PCD mold parts" machining. *For more details, please view the machining examples from the "PDF download."

• Other molds
• Other consumables
• Press Dies

Utilizing connection technology between different materials, only the wear-prone injection part is made of PCD. The body can be made of SUS or steel, and combinations with complex shapes are also possible. A dedicated jig achieves coaxiality within 3μm. - Body part: Steel, nozzle part: PCD connection technology - Hole diameter φ0.25mm, depth 1.2mm (PCD) - Position accuracy within 0.003mm *This product is a processing example of our "PCD wear-resistant parts." *For more details, please refer to the processing examples available for download in PDF format.

• Other consumables
• nozzle
• Mounter

★Strong brazing technology accumulated over many years of experience ★Precision finishing of approximately 0.06μm made possible by unique polishing techniques ★Fine processing through wire electrical discharge machining We own multiple machines for both underwater and oil-based types, with a minimum wire diameter of φ0.03mm available. This allows for high-precision processing of ultra-fine shafts for punches, as well as complex shapes and minimum inner radii for dies. - More than 10 times longer lifespan compared to carbide dies - Chipping prevention treatment - Capable of handling shapes with R0.02mm using wire diameter φ0.03mm - Processing accuracy of ±0.002mm *This product is a processing example of our "PCD mold components." *For more details, please refer to the processing examples available for download in PDF format.

• Other consumables
• Press Dies
• Other molds

Compared to conventional ruby and carbide tips, wear resistance has improved. Additionally, by manufacturing the shaft with PCD, breakage resistance has also been enhanced. We can customize the shape of the spherical tip and the body part, excluding PCD, according to your requirements. - Complete PCD construction allows for measurements without deflection, even when thin. - Spherical tips range from 0.3 to 1.2 mm (currently used in our own roundness measurement machine). *This product is a processing example of our "PCD wear-resistant parts." *For more details, please refer to the processing examples available for download in PDF format.

• Other consumables
• probe
• 3D measuring device

Support applications for processing targets with centerless grinding! PCD products last 10 times longer than carbide products! (Compared to our own products) Furthermore, processing is possible without warping even at a thickness of 0.3mm or less. - Over 10 times longer lifespan compared to carbide (currently used in our centerless grinding machines) - Can be manufactured at a thickness of 1mm or less - Connection technology aimed at increasing strength - Processing method that minimizes warping to the extreme *This product is a processing example of our "PCD wear-resistant parts." *For more details, please view the processing examples from the "PDF download."

• Other consumables
• Processing Jig
• Grinding Machine

Samsung Diamond Industry utilizes its unique technology, the SnB "Scribe & Break" method, to precisely cut and process device substrates with metal films or silicone resins layered on materials such as silicon carbide (SiC), gallium nitride (GaN), alumina (Al2O3), sapphire, silicon nitride (Si3N4), and silicon (Si) since its establishment. With MDI's proprietary SnB "Scribe & Break" technology, we achieve zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while being environmentally friendly due to the absence of water usage, allowing for a reduction in production costs. **Features of MDI's proprietary SnB (Scribe & Break) technology:** - Stable high-speed cutting is possible for high-frequency and power devices! - High-precision and high-quality cutting allows for reduced street width and compatibility with small sizes! - Compatible with various semiconductor/electronic component processing! - Supports multilayer composite materials! We propose the optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.*

• Wafer
• LCD display
• Fine Ceramics

The PCD materials we use are developed in collaboration with major material manufacturers. The bonding between particles has also been enhanced, making it superior in wear resistance and durability compared to products from other companies. We have achieved maintenance-free operation through extended lifespan (10 to 100 times compared to other metal parts)! We assist in reducing waste loss, contributing to "manufacturing that protects the global environment through our customers." 【Other compatible materials】 You can also trust us with high-precision machining of various materials such as carbide, SUS, and steel. 【Main equipment and technologies】 ■ Surface grinding machine: perpendicular, parallel, flatness below 2μm ■ Wire electrical discharge machine: more than 20 underwater wire machines and 3 oil-based wire machines. Achievements in hole processing of 70μm ■ Mirror finishing: sintered diamond surface roughness below 0.01μm ■ Soldering machine: capable of handling various sizes and shapes ■ We have PG (profile grinder) and cylindrical grinding machines *We are accumulating technology, building relationships, and advancing product development while addressing our customers' concerns. Please feel free to contact us first.

• Processing Contract
• Non-ferrous metals
• Press Dies

This is the mechanism of scribing, using glass cutting as an example. Scribing is a cutting method that utilizes the properties of hard and brittle materials. By precisely controlling the generation and propagation of fine cracks, high-precision cutting can be achieved with high quality. 【Cracks during scribing occur in two stages】 　　First stage: Cracks propagate when the scribing wheel is under load. 　　Second stage: After the wheel has passed, cracks propagate again due to residual stress. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

We develop and produce tools for mechanical scribing in-house. We are exploring tool materials based on diamond, developing shapes suitable for the materials, and have established processing techniques for difficult-to-cut tool materials. <Material Exploration> ■ To extend the tool's lifespan, we are developing tools based on PCD (polycrystalline diamond). <Shape Development> ■ A glass cutter designed with a chip in a wheel shape for easy cutting processing. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

"Scribe & Break processing" is a cutting method that utilizes the physical properties of the processing material. It is a dry processing method that does not use water, and it allows for high-speed processing. On the other hand, it is significantly influenced by the material's physical properties (especially crystal orientation), making it challenging to determine the processing conditions. Additionally, the scribe & break technique has been used for a long time as a method for cutting hard and brittle materials like glass. 【Features】 ■ Support for fine processing - Suitable for cutting small chips from thin substrates - Minimal vibrations during processing, so chips rarely fly off ■ Support for curved processing - Capable of processing curves (3D processing) in applications - Laser scribing allows for cutting with even smaller radii *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Samsung Diamond Industry utilizes its unique technology, the SnB "Scribe & Break" method, to precisely cut and process device substrates that are layered with metal films or silicone resins on materials such as silicon carbide (SiC), gallium nitride (GaN), alumina (Al2O3), sapphire, silicon nitride (Si3N4), and silicon (Si) since its establishment. With MDI's proprietary SnB "Scribe & Break" technology, we achieve zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while also being environmentally friendly due to the absence of water usage, allowing for a reduction in production costs. **Features of MDI's proprietary SnB (Scribe & Break) technology:** - Stable high-speed cutting is possible for high-frequency devices and power devices! - High precision and quality cutting allows for reduced street width and compatibility with small sizes! - Compatible with various semiconductor/electronic component processing! - Supports multilayer composite materials! We propose optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.*

• Wafer
• LCD display
• Fine Ceramics

Samsung Diamond Industrial's "Scribe & Break Method" is a technology for cutting and processing device substrates that have metal films or silicone resins laminated onto materials such as glass, alumina (Al2O3), silicon carbide (SiC), sapphire, and silicon (Si). With the unique "Scribe & Break" technology, it achieves zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while also allowing for cost reduction since no water is used. 【Features】 ■ Stable and high-speed cutting is possible for many materials! ■ High precision and quality cutting enables reduction of street width and accommodates small sizes! ■ Compatible with various semiconductor/electronic component processing! ■ Supports multilayer composite materials! We propose the optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.

• Wafer
• LCD display
• Fine Ceramics

Since starting the production and sale of Samsung brand glass cutting tools in 1935, this long-selling product has continued to evolve and has been loved by customers. Newly added to the lineup are the APIO and Penett glass cutters with blade tips, which are high-performance glass cutters that can be widely used for various glass materials and thicknesses, from FPD, architectural, and automotive glass to hobby applications. Please select the optimal specifications for your various uses.

• Glass
• Touch Panel
• LCD display

It will be a significant weapon for enhancing end face quality and end face strength. The table's θ rotation and automatic alignment function enable smooth and high-precision X/Y breaks. Additionally, the break function and camera section are constructed with a robust design using separate beams.

• Glass
• Touch Panel

Through automatic calculation, each head is driven at the shortest takt time, and it is possible to set separation conditions for each individual head. We propose cutting solutions based on the number of mounted heads for a diverse range of applications. ≪Basic Specifications≫ ■ Supported substrate thickness 　 Single board 0.4mm-1.1mm 　 Laminated board 0.8mm-2.2mm ■ Scribing speed 　 500mm/sec MAX ■ Scribing accuracy 　 Straight line ±40µm

• Glass
• Touch Panel

<<Perspective on Mass Production (Yield Improvement)>> ● No occurrence of "line skipping during glass edge riding" or "intersection (cross) skipping" ● Wide Process Window (scribe load area) <<Perspective on Quality>> ● High "glass edge strength" after glass cutting ● "Internal cutting" is possible <<Perspective on Work Efficiency>> ● Good cutting performance achievable with a single cutting edge, regardless of glass material ● Stabilization of scribing wheel lifespan

• Glass
• Touch Panel
• LCD display

● It is possible to simplify or eliminate the break process. ● Supports various variations for brittle materials (silicon, optical glass, etc.). ● Stable cutting is possible on protective films (10-50μm) and various film-coated substrates.

• Glass
• Touch Panel
• LCD display

This is a scribing wheel that has been used as a versatile tool for scribing brittle materials, including glass.

• Glass
• Touch Panel
• LCD display

● Improvement of mass production ● Quality control and lifespan management are possible ● Improvement of work efficiency ● There are magnet types and pin types according to the application.

• Glass
• Touch Panel
• LCD display

By using the "High Penetration Blade Tip PenettⓇ", it is possible to perform irregular cutting of LCDs that were previously difficult to separate. It can import DXF file data and accommodate arbitrary shapes such as circles, ellipses, and curves. The MMP series is a multi-head type of the single-head MP series. 【Basic Specifications】 ■ Supported substrate thickness Single board: 0.4mm-1.1mm Laminated board: 0.8mm-2.2mm ■ Scribing speed 500mm/sec MAX ■ Scribing accuracy Straight line: ±40µm Irregular: ±100µm

• Glass
• Touch Panel