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ナセル

EstablishmentApril 1998
capital1050Ten thousand
number of employees16
addressTokyo/Itabashi-ku/1-19-16 Kamitakashimadai, Asoruti 2F
phone03-5921-5099
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last updated:Jul 11, 2023
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耐環境GPUボード/キャプチャカード 耐環境GPUボード/キャプチャカード
Rugged tablet PC Rugged tablet PC
Rugged laptop Rugged laptop
Robust server Robust server
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Robust UPS, AC-DC, DC-AC, DC-DC Robust UPS, AC-DC, DC-AC, DC-DC
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I will help you find hard-to-obtain items. I will help you find hard-to-obtain items.
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Aerospace HOLT Corporation 1553 IP Core Demo Kit

Support for integrating the Holt HI-6300 IP core into Vivado design and FPGA implementation.

In the aerospace industry, reliable data transmission is essential. Particularly in communication under harsh environments, the accuracy and stability of data become crucial. The HI-6300 IP core supports FPGA implementation and provides a solution to enhance the reliability of data transmission. This product demonstrates access to IP bus controller (BC), remote terminal (RT), and monitor (MT) functions using the Holt API library. 【Usage Scenarios】 - Data transmission in aerospace equipment - Development of communication systems using FPGA - Evaluation of the HI-6300 IP core 【Benefits of Implementation】 - Rapid integration into FPGA designs - Improved reliability of data transmission - Reduced development time

  • Development support tools (ICE, emulators, debuggers, etc.)

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HOLT Corporation 1553 IP core demo kit ADK-6300

Demo kit ADK-6300 to support FPGA implementation by integrating Holt's HI-6300 IP core into Vivado design.

This kit is provided to integrate the HI-6300 IP core into Vivado designs and assist with FPGA implementation. The accompanying software demonstrates access to the IP's bus controller (BC), remote terminal (RT), and monitor (MT) functions using the Holt API library. This demonstration uses the Xilinx Zynq UltraScale+ MPSoC ZCU102 evaluation kit. The embedded ARM Cortex-A53 interfaces with the HI-6300 IP core via the AXI4 bus and runs the demonstration software. The demo project is a bare-metal implementation using the Holt API software library. This software can be accessed from a terminal console via the USB/UART connector.

  • Development support tools (ICE, emulators, debuggers, etc.)

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HOLT Corporation Avionics Transceiver HI-1587

MIL-STD-1553 dual transceiver IC with built-in IP security module HI-1587, HOLT Corporation

The HI-1587 is an ultra-low power MIL-STD-1553 dual transceiver designed to meet all the requirements of the MIL-STD-1553 and MIL-STD-1760 standards. This device is designed to provide a transceiver interface between FPGAs equipped with a bus isolation transformer and Holt MIL-STD-1553 IP core, and it includes an integrated IP security module necessary for enabling the IP. This eliminates the need for conventional external IP dongle chips commonly used with other IP solutions. It features built-in 1.8V, 2.5V, and 3.3V compatible digital I/O, facilitating easy interfacing with a wide range of FPGAs. Packaged in a 6mm x 6mm 48-pin plastic QFN, it is the smallest in the industry for MIL-STD-1553 transceivers.

  • Dedicated IC

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3-slot 3U VPX system Huey

Forced air cooling, conduction cooling 3U VPX system Huey - Concurrent Technologies Corporation

【3-Slot 3U VPX System】 Huey is a robust Commercial Off the Shelf (COTS) system that is optimized for size, weight, power, and cost (SWaP-C) in a 3-slot 3U VPX configuration. This system is designed for 3U SOSA-compliant, conduction-cooled cards that are required to operate in harsh environments, and it features an AC power fan in the external housing for easy maintenance. Huey supports a powerful payload with minimal weight, making it ideal for use cases where size and weight are critical.

  • Industrial PCs

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Vecow Corporation Ultra-Compact Fanless PC SPC-9000 Series

Intel Core Ultra processor equipped, ultra-compact fanless PC SPC-9000 - Vecow Corporation

The ultra-compact fanless system "SPC-9000," equipped with Intel Core Ultra processors, features two 2.5G LAN ports, two USB 3.2 Gen2 ports, and one USB 3.2 Gen 2x2 Type-C port, supporting multiple displays. It also supports optional SUBMIT B expansions for 10GigE LAN, 10G SPF+, or 4G networks. Additionally, by supporting Intel vPro, TSN, TCC, and TPM 2.0 standards, it enables compatibility with edge AI applications such as factory management, data collection and monitoring, AMR, and smart retail.

  • Industrial PCs

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Vecow Corporation Time Sync Box VTS-1100

Vecow's next-generation mobile device, equipped with Xilinx's Ultrascale+ MPSoC, robust time synchronization box.

The VTS-1100 offers three key technologies: Time Winding, Time Stamping, and Time Keeping, enhancing multi-sensor synchronization, recognition, accuracy, and positioning functions. - Robust and compact design, equipped with Xilinx Zynq UltraScale+ MPSoC - Rich PPS time synchronization and frame-out capabilities, supporting cameras, LiDAR, and radar - Equipped with 2x LAN (M12 connector per X code specification), with one port supporting PTP/gPTP protocols - Supports external GNSS input and daisy-chain synchronization output - Power input DC 5V to 60V, fanless design with operating temperature range of -20°C to 75°C

  • Embedded Board Computers

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TEWS Technology cPCI-s Rear I/O TCPS007-TM

3U CompactPCI Serial 4CH Gigabit Ethernet Rear I/O Module TCPS007-TM

The TCPS007-TM is a 3U rear I/O module compatible with PICMG CPCI-S.0 R2.0 that provides a 4-channel 10Base-T/100Base-TX/1000Base-T Ethernet interface. - 4CH Ethernet interface (10Base-T / 100Base-TX / 1000Base-T) - Equipped with common mode choke filter and RJ45 connector - Supports rear I/O of CompactPCI-Serial modules (such as TCPS892)

  • Embedded Board Computers

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ACME Corporation High-End Portable PC MegaPAC L3

The MegaPAC L3 is a portable workstation equipped with a 23.8-inch triple 4K display.

A robust portable setup equipped with three 23.8-inch UHD displays, achieving a total resolution of 11520 x 2160 (3840 x 2160 per display). This portable workstation features excellent expandability with full-length PCI-Express slots that can accommodate up to seven cards and eight removable storage bays.

  • Industrial PCs

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ACME Corporation 3-Screen Portable PC FlexPAC L3

The FlexPAC L3 is a rugged portable computer equipped with three HD resolution displays.

The FlexPAC L3 enables the instant construction and deployment of a complete mobile command control center. Its robust structure and portability allow for rapid response to emergencies. With seven full-size expansion slots, it offers flexible use that can accommodate demanding applications. Additionally, the fully stowable three-screen large HD display provides a total resolution of 5760 x 1080, allowing for a more accurate understanding of the entire situation and enhancing operational efficiency.

  • Industrial PCs

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ACME Corporation Portable PC FlexPAC L1

FlexPAC L1 is a robust and highly portable computer system suitable for operation in harsh environments.

The FlexPAC L1 is a rugged unit with a sturdy metal structure, ideal for mission-critical applications and portable enough to take anywhere. The FlexPAC L1, which allows for a passive backplane board configuration, features full-length expansion slots that enable a variety of applications by freely combining expansion cards. The display of the FlexPAC L1 is designed for operation in harsh environments, with enhanced protection due to the use of specially treated anti-glare reinforced glass. The FlexPAC L1 is equipped with dual system cooling side fans, and easy access to the expansion ports allows for quick system upgrades and maintenance.

  • Industrial PCs

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GPU acceleration system ICS-1000 - Vecow Corporation

Edge server CPU equipped, GPU acceleration system ICS-1000 by Vecow capable of supporting up to 1800W.

The Vecow ICS-1000 is a scalable GPU acceleration system equipped with a dGPU (discrete GPU). It provides server-grade computing power with Intel Xeon -2800/D-2700 processors. The ICS-1000 features up to 6 PCIe slot expansions and supports 1800W of power for dual NVIDIA/AMD graphics cards for AI and inference. It is equipped with high-speed interfaces such as PCIe 4.0, SATA 3.0, USB 3.0, and 10GigE LAN.

  • server

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Time Sync Box VTS-1200GU - Vecow Corporation

Vecow's next-generation mobile device, equipped with Xilinx's Ultrascale+ MPSoC, robust time synchronization box.

Robust and compact design, equipped with Xilinx Zynq UltraScale+ MPSoC Supports a rich set of PPS time synchronization and frame-out functions, accommodating cameras, LiDAR, radar, and IMU Equipped with two LAN ports (M12 connector per X-code specification), supporting PTP/gPTP protocol with single network synchronization Adopts Septentrio's high-precision dual-antenna GPS Equipped with RTK RTCM functionality supporting centimeter-level positioning accuracy Utilizes high-precision Xsens MTi-670 9-axis IMU Supports external GNSS input and daisy-chain synchronization output Input voltage range of DC 5V to 60V, fanless design with operating temperature range of -20°C to 75°C Optionally supports MIPI CSI x16 and 8 frame-out PPS

  • Other server related
  • Other embedded systems (software and hardware)

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Super Durable Environment 3U Single XEON Server XRS 3U S8 SOLO

MIL-spec compliant robustness. An aluminum machined 3U edge server that excels in scalability and durability.

The XRS 3U S8 SOLO is an "Extreme Rugged" server designed for harsh edge environments. It features a single 4th/5th generation Intel Xeon Scalable processor, providing high performance while keeping costs and power consumption low. The seamless aluminum chassis complies with MIL-STD-810G (shock and vibration) and MIL-STD-461G (electromagnetic interference) standards. It is equipped with up to five full-height PCIe slots, allowing for flexible installation of expansion cards such as GPUs and FPGAs. The depth can be selected from 430mm or 510mm.

  • server

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Super Durable Environment 2U Single XEON Server XRS 2U S8 SOLO

MIL-spec ruggedness. High-performance server made from machined aluminum that conquers harsh edge environments.

The XRS 2U S8 SOLO is an "Extreme Rugged" server optimized for harsh edge computing environments. It is equipped with a single configuration of 4th/5th generation Intel Xeon Scalable processors, balancing advanced processing power and cost efficiency. Its most notable feature is the seamless, robust chassis design made from machined aluminum. This ensures compliance with strict military standards such as MIL-STD-810G (temperature, shock, vibration) and MIL-STD-461G (electromagnetic interference), guaranteeing stable operation in extreme conditions. The depth can be selected from 400mm or 475mm, allowing for flexible adaptation to space-constrained field infrastructures.

  • server

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Environmentally resistant 3U waterproof robust server XRS 3U-IP S8 SOLO

Equipped with 5th generation Xeon. A rugged edge server compliant with IP54 and MIL standards, operating in extreme environments.

The XRS 3U-IP S8 SOLO is an extremely robust edge server designed for operation in harsh environments. It features a single-socket 5th/4th generation Intel Xeon Scalable processor, providing AI acceleration and advanced security features. The 3U aluminum machined chassis has an IP54 protection rating and uses MIL-grade connectors for I/O and power. It complies with MIL-STD-810G (temperature, shock, vibration) and MIL-STD-461G (electromagnetic compatibility), boasting reliability that is ideal for critical missions in defense and industry.

  • server

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Vecow Corporation Environmentally Resistant Fanless PC RES-5000

IP67 compliant, ultra-compact embedded system RES-5000 with excellent robustness.

【RES-5000 Main Features】 - Achieves CPU productivity with a maximum 15W TDP using an Intel Core i7-1185G7E processor in an onboard configuration. - High reliability with waterproof and dustproof compliance to IP 67 standards. - Equipped with two GigE LAN ports with X-code specification, and two COM ports and USB 3 ports with A-code specification, all using M12 connectors. - Complies with Intel vPro, Time-Sensitive Networking (TSN), and TCC standards, and supports TPM 2.0. - Wide DC power input of 9V-55V, capable of ignition control. - Fanless design supports operating temperatures from -40°C to 70°C.

  • Industrial PCs

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3U Rugged Dual XEON Server GAP-351R-S9

3U environmental-resistant dual XEON server (rear I/O, rear power) compliant with MIL-STD-810 and MIL-STD-461 *6th generation XEON

The GAP-351R-S9 is designed for 19-inch rack mounting and features a 3U chassis with a depth of 510mm. The rear I/O and power configuration allows for a variety of storage options. In addition to two onboard M.2 NVMe SSDs, it can accommodate up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, it is a robust server that supports up to six PCIe cards. To enhance protection against shock and vibration, an additional board with a dedicated retainer kit is available, ensuring optimal safety during transport. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, guaranteeing reliable operation even under harsh conditions commonly encountered in edge environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

  • server

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3U Rugged Dual XEON Server GAP-351P-S9

3U environmental-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-351P-S9 is designed for 19-inch rack mounting and features a 3U chassis with a depth of 510mm. Its front I/O and front power configuration provide flexible storage options, allowing for two internal M.2 NVMe slots, as well as the capability to support up to four removable U.2 NVMe SSDs or up to six removable 2.5-inch SATA SSDs. Additionally, this robust server can accommodate up to six PCIe cards. To enhance protection against shock and vibration, it can be supplied with a dedicated retainer kit for additional boards, ensuring optimal safety during transport. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, guaranteeing reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

  • server

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3U Rugged Dual XEON Server GAP-351F-S9

3U environmental-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, rear power) *6th generation XEON

The GAP-351F-S9 is designed for 19-inch rack mounting and features a 3U chassis with a depth of 510mm. With its front I/O and rear power configuration, it offers flexible storage options, accommodating two internal M.2 NVMe slots, up to six removable U.2 NVMe SSDs, or up to nine removable 2.5-inch SATA SSDs. Additionally, this robust server supports up to six PCIe cards. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors. Each unit comes with an inventory list to ensure configuration management and reproducibility. Additionally, upon request, specific thermal and mechanical environmental stress tests can be conducted for all server configurations.

  • server

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2U Rugged Single XEON Server GAP-247R-S9-SOLO

2U environmental-resistant single XEON server (rear I/O, rear power) compliant with MIL-STD-810 and MIL-STD-461 *6th generation XEON

The GAP-247R-S9-SOLO is designed for 19-inch rack mounting and features a 2U chassis with a depth of 470mm. Its rear I/O and power configuration provide a variety of storage options. In addition to two onboard M.2 NVMe SSDs, it can accommodate up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, this robust server can support two low-profile cards as well as up to three full-height, full-length PCIe x16 cards. Optionally, configurations with two full-height, full-length dual-slot PCIe x16 cards and two low-profile cards are also available. The robust edge server from GAP is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Additionally, an optional configuration compliant with the MIL-STD-461 standards for EMI/EMC is available.

  • server

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2U Rugged Dual XEON Server GAP-247R-S9

2U environment-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (rear I/O, rear power) *6th generation XEON

The GAP-247R-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 470mm. With its rear I/O and rear power configuration, it offers flexible storage options that can accommodate two internal M.2 NVMe slots, as well as up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, this robust server can support up to two PCIe cards. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available, utilizing MIL-standard connectors for both power input and I/O connectors. Each unit comes with an inventory list included at shipment to ensure configuration management and long-term reproducibility.

  • server

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2U Rugged Dual XEON Server GAP-247RL-S9

2U environment-resistant dual XEON server compatible with MIL-STD-810 and MIL-STD-461 (rear IO, rear power) *6th generation XEON

The GAP-247RL-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 470mm. Its rear I/O and rear power configuration provide flexible storage options, allowing for two internal M.2 NVMe slots, as well as the capability to accommodate up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, this robust server supports up to six low-profile PCIe cards. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors. Each unit comes with an inventory list that guarantees configuration management and reproducibility. Moreover, upon request, specific thermal and mechanical environmental stress tests can be conducted for all server configurations.

  • server

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2U Rugged Single XEON Server GAP-245RL-S9-SOLO

2U environment-resistant single XEON server compatible with MIL-STD-810 and MIL-STD-461 (rear I/O, rear power) *6th generation XEON

The GAP-245RL-S9-SOLO is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. With its rear I/O and rear power configuration, it offers flexible storage options supporting two internal M.2 NVMe SSDs, as well as up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Additionally, this robust server can accommodate up to six low-profile PCIe cards. GAP's rugged edge server complies with MIL-STD-810F standards for temperature resistance and shock resistance, and MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors. Each unit comes with an inventory list to ensure configuration management and reproducibility. Additionally, upon request, specific thermal and mechanical environmental stress tests can be conducted for all server configurations.

  • server

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2U Rugged Single XEON Server GAP-245P-S9-SOLO

2U environmental-resistant single XEON server compatible with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-245P-S9-SOLO is designed for 19-inch rack mounting and features a 1U chassis with a depth of 450mm. Its front I/O and front power configuration provide flexible storage options, supporting two onboard M.2 NVMe SSDs, one 2.5-inch internal NVMe U.2/SATA/SAS SSD, and up to two removable U.2 NVMe SSDs or up to three removable 2.5-inch SATA SSDs. Additionally, this robust server can accommodate two low-profile cards as well as up to three full-height, full-length PCIe x16 cards. Optionally, configurations with two full-height, full-length dual-slot PCIe x16 cards and two low-profile cards can also be selected. It is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, ensuring reliable operation even under harsh conditions that frequently occur in edge environments.

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2U Rugged Dual XEON Server GAP-245P-S9

2U environmental-resistant dual XEON server compatible with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-245P-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. It offers a variety of storage options, including two internal M.2 NVMe slots, thanks to its front I/O and front power configuration. Additionally, this robust server can accommodate up to two PCIe cards. To enhance protection against shock and vibration, an additional board with a dedicated retainer kit is available, ensuring optimal safety during transport. The GAP rugged edge server is designed to comply with MIL-STD-810F standards for temperature resistance and shock resistance, as well as MIL-STD-167-1A standards for vibration resistance, guaranteeing reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available, utilizing military-grade connectors for both power input and I/O connectors.

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2U Rugged Dual XEON Server GAP-245PL-S9-DUO

2U environmental-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-245PL-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. With its front I/O and front power configuration, it offers flexible storage options that can accommodate two internal M.2 NVMe slots, as well as up to two removable U.2 NVMe SSDs or up to three removable 2.5-inch SATA SSDs. Additionally, this robust server can support up to six low-profile PCIe cards. To enhance protection against shock and vibration, it can be supplied with a dedicated retainer kit for additional boards, ensuring optimal safety during transport. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, guaranteeing reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

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2U Rugged Single XEON Server GAP-245F-S9-SOLO

2U environment-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, rear power) *6th generation XEON

The GAP-245F-S9-SOLO is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. The front I/O and rear power configuration allow for a variety of storage options. In addition to two onboard M.2 NVMe SSDs, it can accommodate up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, this robust server can support two low-profile cards as well as up to three full-height, full-length PCIe x16 cards. Optionally, configurations with two full-height, full-length dual-slot PCIe x16 cards and two low-profile cards can also be selected. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Optionally, a configuration compliant with the MIL-STD-461 standards for EMI/EMC is available.

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2U Rugged Dual XEON Server GAP-245F-S9

2U environmental-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, rear power) *6th generation XEON

The GAP-245F-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. With its front I/O and rear power configuration, it offers a variety of storage options, including two internal M.2 NVMe slots, up to two removable U.2 NVMe SSDs, or up to three removable 2.5-inch SATA SSDs. It can accommodate NVMe SSDs or up to three removable 2.5-inch SATA SSDs. Additionally, this rugged server can support up to two PCIe cards. It is a robust edge server with heat and shock resistance compliant with MIL-STD-810F standards, as well as vibration resistance compliant with MIL-STD-167-1A standards. The design meets the temperature resistance and shock resistance of MIL-STD-810F and the vibration resistance of MIL-STD-167-1A, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Furthermore, it can be configured to comply with the MIL-STD-461 standards for EMI/EMC as an option. Military-grade connectors are used for both power input and I/O connectors.

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2U Rugged Single XEON Server GAP-235PL-S9SOLO

2U environmental-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-235PL-S9-SOLO is designed for 19-inch rack mounting and features a 2U chassis with a depth of 350mm. Its front I/O and front power configuration provide a variety of storage options. Specifically, it can accommodate two internal M.2 NVMe SSDs, and up to two removable U.2 NVMe SSDs, or up to three removable 2.5-inch SATA SSDs simultaneously. Furthermore, this rugged server can house up to six low-profile PCIe cards and comes standard with a rear-removable fan. GAP's robust edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under the harsh conditions frequently encountered in edge environments. Additionally, an optional configuration compliant with the MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

  • server

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1U Rugged Single XEON Server GAP-151R-S9 SOLO

1U environmental-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (rear I/O, rear power) * 6th generation XEON

The GAP-151R-S9-SOLO is designed for 19-inch rack mounting and has a depth of 540mm in a 1U chassis. With its rear I/O and rear power configuration, it can accommodate two onboard M.2 NVMe SSDs, as well as up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Additionally, this rugged server can support one low-profile PCIe x16 card and up to two full-height, full-length PCIe x16 cards. To enhance protection against shocks and vibrations, an optional dedicated retainer kit for additional boards can be included, ensuring optimal safety during transport. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, guaranteeing reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, it can be configured to comply with the MIL-STD-461 standards for EMI/EMC as an option. Military-grade connectors are used for both power input and I/O connectors.

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1U Rugged Single XEON Server GAP-145P-S9 SOLO

1U environment-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, front power) * 6th generation XEON

The GAP-145P-S9-SOLO is designed for 19-inch rack mounting and features a 1U chassis with a depth of 450mm. With its front I/O and front power configuration, it offers a variety of storage options, supporting two onboard M.2 NVMe SSDs and up to two 2.5-inch internal NVMe or SATA SSDs. Furthermore, this rugged server can accommodate up to two full-height, full-length PCIe x16 cards and one low-profile PCIe x16 card. To enhance protection against shock and vibration, it provides an additional board with a dedicated retainer kit, ensuring optimal safety even during transport. Designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, GAP's rugged edge server guarantees reliable operation even under harsh conditions frequently encountered in edge environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

  • server

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1U Rugged Single XEON Server GAP-145F-S9 SOLO

1U environmental-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, rear power) *6th generation XEON

The GAP-145F-S9-SOLO is designed for 19-inch rack mounting and features a 1U chassis with a depth of 450mm. With its front I/O and rear power configuration, it offers a variety of storage options. In addition to two internal M.2 NVMe SSDs and one internal NVMe U.2/SATA SSD, it can accommodate up to two onboard U.2 NVMe SSDs or up to three removable 2.5-inch SATA SSDs. Furthermore, this rugged server can support up to two full-height, full-length PCIe x16 cards and one low-profile PCIe x16 card. Designed to meet MIL-STD-810F standards for temperature resistance and shock resistance, as well as MIL-STD-167-1A standards for vibration resistance, GAP's robust edge server ensures reliable operation even in harsh environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available, featuring military-grade connectors for both power input and I/O connectors.

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Vecow Dustproof and Waterproof AI PC RAC-1000

NVIDIA Jetson AGX Orin equipped, IP67 compliant, fanless AI PC RAC-1000

The rugged AI PC "RAC-1000," compliant with IP67 standards, features NVIDIA Jetson AGX Orin / Jetson AGX Orin Industrial and supports the JetPack 6.0 SDK. It is equipped with GigE LAN, USB 3.1, isolated CAN Bus, and COM ports, supports 4x M.2 and up to 8 automotive GMSL2 cameras (Fakra-Z connector), and operates in a fanless design with an extended temperature range from -25°C to 70°C. It is ideal for outdoor and harsh environments, including automation of agricultural machinery, outdoor robots, and construction site automation.

  • Industrial PCs
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Vecow Dustproof and Waterproof AI PC RAC-1100

NVIDIA Jetson AGX Orin equipped, IP67 compliant, fanless AI PC RAC-1100

The rugged AI PC "RAC-1100," compliant with the IP67 standard, features the NVIDIA Jetson AGX Orin / Jetson AGX Orin Industrial and supports the JetPack 6.0 SDK (Software Development Kit). It is equipped with PoE+, GigE LAN, USB 3.1, isolated CAN Bus, and COM ports, has 2x M.2 slots, and operates in a fanless design, supporting an extended temperature range from -25°C to 70°C. It is ideal for outdoor and harsh environments, such as automation in agricultural machinery, outdoor robots, and construction site automation.

  • Industrial PCs
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Vecow Corporation Rugged PC HEC-1000

HEC-1000 rugged PC equipped with 14th/13th generation Intel CPU, compliant with MIL-STD-810G and MIL-STD-461G.

【HEC-1000 Main Features】 - Equipped with Intel Core 200S series and Intel Core processors (14th/13th/12th generation) - High-performance MIL-standard compliant PC with IP66 for reliable waterproof and dustproof protection - Features MIL-DTL-38999 connectors with 6×USB2.0, 4×GigE RJ45, 4×COM ports, DVI-I, and Key M - Conveniently equipped with 2 external 2.5" SSD trays - Wide power input DC 9V to 50V - Fanless design supporting temperatures from -40°C to 65°C

  • Industrial PCs

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16ch differential, 4x8bit DIO mezzanine card TFMC685

TEWS company ANSI/VITA 57.1 compliant FPGA mezzanine card (FMC) TFMC685.

The TFMC685 provides the capability to add a 16-bit M-LVDS (Multi-Point Low Voltage Differential Signaling) I/O interface or a 16-bit RS-485/RS-422 I/O interface to an FMC carrier card. TFMC685-10R: 16 M-LVDS I/O, 32 digital I/O, LPC-FMC TFMC685-20R: 16 RS485/RS422 I/O, 32 digital I/O, LPC-FMC Each I/O signal is connected to the VHDCI-68 connector on the front panel.

  • Expansion Boards
  • Embedded Board Computers

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Condor GR5S-AD5000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card (equipped with NVIDIA RTX 5000 Ada generation)

The Condor GR5S-AD5000 is an extremely robust 3U OpenVPX standard video graphics and GPGPU processing card equipped with an NVIDIA RTX 5000 GPU (Ada Lovelace architecture). This card features a powerful core configuration with 9,728 CUDA cores, 304 Tensor cores, and 76 RT cores, and it combines high reliability and computational performance with 16 GB of GDDR6 memory with ECC (Error Correction Code). It adopts PCI Express Gen 4 for its interface, and the support for GPUDirect RDMA significantly reduces data transfer latency. Additionally, it is developed in alignment with the SOSA standard, ensuring interoperability and scalability in military and aerospace applications. The cooling method offers both conduction cooling (CC) and airflow-through (AFT) variations to meet stringent thermal requirements. This card provides an unparalleled solution for data-intensive tasks, delivering exceptional efficiency and responsiveness.

  • Embedded Board Computers

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Condor VC300xX - EIZO

Robust 12G-SDI XMC video capture solution

The Condor VC300xX is an ultra-high-definition (UHD) video capture solution in the XMC form factor designed for high-performance video processing. This device transfers raw video data to the host system with ultra-low latency via PCIe, enabling real-time viewing, processing, analysis, and display. This allows for seamless integration into workflows that require advanced video processing. One of its key features is its low power consumption of less than 20W, making it ideal for compact platforms sensitive to SWaP (Size, Weight, and Power) such as UAVs (unmanned aerial vehicles). This product is available in ruggedized variants for air cooling and conduction cooling, and can be integrated into systems aligned with VITA and SOSA standards. A comprehensive SDK is provided to simplify capture data management. It also supports VITA 46.9 VPX I/O signal mapping (X12d, X8d, X16s).

  • Embedded Board Computers

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Condor GR5S-AD2000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card equipped with NVIDIA RTX 2000 Ada generation.

The Condor GR5S-AD2000 is a robust 3U OpenVPX standard video graphics/GPGPU processing card equipped with an NVIDIA RTX 2000 GPU (Ada Lovelace). Performance: It features 3,072 CUDA cores, 96 Tensor cores, and 24 RT cores, providing high efficiency and responsiveness for edge computing and data-intensive tasks. Memory: It is equipped with 8 GB of GDDR6 graphics memory with ECC (Error Correction Code), ensuring high reliability. Connectivity: It supports PCI Express Gen 4 connections (x4, x8, x16 lanes) and supports GPUDirect RDMA, significantly reducing data transfer latency. Cooling: Both air-cooled and conduction-cooled variations are available, offering robustness that meets the VITA 47.3 design specifications.

  • Embedded Board Computers

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Condor GR5S-B4000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card (NVIDIA RTX PRO 4000 Blackwell GPU)

The Condor GR5S-B4000 is a rugged video graphics/GPGPU card in the 3U OpenVPX standard, equipped with the cutting-edge NVIDIA RTX PRO 4000 Blackwell GPU. Performance: It features 7,680 CUDA cores and 240 Tensor cores, delivering exceptional performance in edge AI inference and real-time situational analysis. Memory: It is equipped with 16 GB of ECC-supported GDDR7 memory, ensuring reliability for mission-critical applications. Connectivity: High-speed data transfer is achieved through PCIe Gen 4 switching and GPUDirect RDMA. Cooling: It supports both conduction cooling and airflow-through variations, maintaining stable operation even in harsh environments due to its new design. This card is the ideal solution for fields that demand extreme reliability and high computational power.

  • Embedded Board Computers

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Condor NVB2000xX - EIZO

Embedded XMC graphics and GPGPU card equipped with NVIDIA RTX PRO 2000 Blackwell GPU.

The Condor NVB2000xX is a robust XMC video graphics and GPGPU card built on the advanced NVIDIA RTX PRO 2000 Blackwell GPU, which supports error correction code (ECC) and 8GB of GDDR7 graphics memory with a 128-bit memory interface. As the first architecture to support GDDR7, NVIDIA Blackwell has made significant advancements in bandwidth speed, improved signal integrity, and reductions in energy usage and power consumption, making it an ideal choice for demanding high-performance computing environments. It also supports three DisplayPort++/DVI video outputs. The Condor NVB2000xX is a high-performance card featuring the NVIDIA RTX PRO 2000 Blackwell GPU, equipped with 3,328 CUDA cores, demonstrating exceptional capabilities for AI processing and real-time analytics. It achieves high-speed data transfer with PCIe Gen 5 and GPUDirect RDMA, making it perfect for mission-critical VPX systems.

  • Embedded Board Computers

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Condor NVB500xX - EIZO

Embedded XMC graphics & GPGPU card equipped with NVIDIA RTX PR 500 Blackwell GPU.

The Condor NVB500xX is a robust XMC video graphics and GPGPU card. GPU: Equipped with the advanced NVIDIA RTX PRO 500 Blackwell GPU. Memory: Supports 6GB of ECC-enabled GDDR7 graphics memory and a 128-bit memory interface. Features: NVIDIA Blackwell, the first architecture to support GDDR7, achieves significant improvements in bandwidth, enhanced signal integrity, and reductions in energy consumption and power usage. Applications: These features make it ideal for demanding high-performance computing environments. Output: Supports three DisplayPort++/DVI video outputs. This card is a high-performance embedded system solution that leverages next-generation memory technology and is equipped with the NVIDIA RTX PRO 500 Blackwell GPU. It has 1,792 CUDA cores, excelling in AI processing and real-time analytics. It enables high-speed data transfer with PCIe Gen 5 and GPUDirect RDMA, compatible with VPX systems.

  • Embedded Board Computers

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Condor GR5S-B5000 - EIZO Rugged

SOSA-aligned 3U VPX graphics and GPGPU card (NVIDIA RTX PRO 5000 Blackwell GPU)

The Condor GR5SL-B5000 is a robust 3U OpenVPX video graphics/GPGPU card equipped with the advanced NVIDIA RTX PRO 5000 Blackwell GPU. It features 10,496 CUDA cores, 320 Tensor cores, and 80 RT cores, along with ECC-supported 24 GB GDDR7 memory (256-bit), providing high performance and efficiency for AI inference and edge computing. Connectivity: It integrates a Microchip PFX PCIe Gen 4 switch for high-speed connections and supports GPUDirect RDMA to reduce data transfer latency. Cooling: It offers both conduction cooling (VITA 48.2) and airflow-through (VITA 48.8) variations, with a new design that significantly improves thermal efficiency. This card also includes the 9th generation NVENC (supporting 4:2:2) and 6th generation NVDEC decoder, making it ideal for mission-critical environments.

  • Embedded Board Computers

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Condor GR5SL-B4000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card (NVIDIA RTX PRO 4000 Blackwell GPU)

The Condor GR5SL-B4000 is a robust 3U OpenVPX video graphics and GPGPU card equipped with the advanced NVIDIA RTX PRO 4000 Blackwell GPU. It features ECC-supported 16 GB GDDR7 memory and PCI Express Gen 5, providing groundbreaking performance and efficiency in high-performance computing (HPEC) environments such as edge AI inference. The GPU includes 7,680 CUDA cores, 240 Tensor cores, and 60 RT cores, enabling AI-accelerated data processing. Additionally, it has a built-in 9th generation NVENC/6th generation NVDEC encoder, excelling in video performance. It supports NVIDIA GPUDirect RDMA, reducing data transfer latency. The thermal design accommodates conduction cooling (VITA 48.2) and airflow-through (VITA 48.8), improving thermal efficiency.

  • Embedded Board Computers

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Condor GR5SL-B5000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card (NVIDIA RTX PRO 5000 Blackwell GPU)

The Condor GR5SL-B5000 is a robust 3U OpenVPX video graphics and GPGPU card equipped with the advanced NVIDIA RTX PRO 5000 Blackwell GPU. It supports ECC-enabled 24 GB GDDR7 graphics memory and PCI Express Gen 5 for the first time, significantly improving data transfer speeds and performance per watt. The GPU features 10,496 CUDA cores, 320 Tensor cores, and 80 RT cores, delivering exceptional performance for AI-accelerated data processing and real-time situational analysis. It also includes a 9th generation NVENC encoder and a 6th generation NVDEC decoder that support 4:2:2, providing advanced video compression and playback capabilities. Additionally, it supports NVIDIA GPUDirect RDMA, greatly reducing data transfer latency. Available in both conduction cooling (VITA 48.2) and airflow-through (VITA 48.8) variations, it minimizes performance degradation at high temperatures.

  • Embedded Board Computers

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