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ナセル

EstablishmentApril 1998
capital1050Ten thousand
number of employees16
addressTokyo/Itabashi-ku/1-19-16 Kamitakashimadai, Asoruti 2F
phone03-5921-5099
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last updated:Jul 11, 2023
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耐環境GPUボード/キャプチャカード 耐環境GPUボード/キャプチャカード
Rugged tablet PC Rugged tablet PC
Rugged laptop Rugged laptop
Robust server Robust server
Rugged display Rugged display
Robust UPS, AC-DC, DC-AC, DC-DC Robust UPS, AC-DC, DC-AC, DC-DC
Robust video encoder/decoder Robust video encoder/decoder
Robust Ethernet switch Robust Ethernet switch
Rugged video recorder Rugged video recorder
BOX type PC BOX type PC
Mission computer Mission computer
Environmentally resistant CPU board Environmentally resistant CPU board
Environmentally Resistant Ethernet Switch Board / PCIe Switch Board Environmentally Resistant Ethernet Switch Board / PCIe Switch Board
Environmentally Resistant IO Board Environmentally Resistant IO Board
Avionics MIL-STD-1553 Avionics MIL-STD-1553
Avionics ARINC429 Avionics ARINC429
Avionics MIL-1394 (AS5643) Avionics MIL-1394 (AS5643)
Time server Time server
Military space DC-DC, AC-DC Military space DC-DC, AC-DC
High-speed SRAM and high-reliability components High-speed SRAM and high-reliability components
I will help you find hard-to-obtain items. I will help you find hard-to-obtain items.
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Time Sync Box VTS-1200GU - Vecow Corporation

Vecow's next-generation mobile device, equipped with Xilinx's Ultrascale+ MPSoC, robust time synchronization box.

Robust and compact design, equipped with Xilinx Zynq UltraScale+ MPSoC Supports a rich set of PPS time synchronization and frame-out functions, accommodating cameras, LiDAR, radar, and IMU Equipped with two LAN ports (M12 connector per X-code specification), supporting PTP/gPTP protocol with single network synchronization Adopts Septentrio's high-precision dual-antenna GPS Equipped with RTK RTCM functionality supporting centimeter-level positioning accuracy Utilizes high-precision Xsens MTi-670 9-axis IMU Supports external GNSS input and daisy-chain synchronization output Input voltage range of DC 5V to 60V, fanless design with operating temperature range of -20°C to 75°C Optionally supports MIPI CSI x16 and 8 frame-out PPS

  • Other server related
  • Other embedded systems (software and hardware)

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Super Durable Environment 3U Single XEON Server XRS 3U S8 SOLO

MIL-spec compliant robustness. An aluminum machined 3U edge server that excels in scalability and durability.

The XRS 3U S8 SOLO is an "Extreme Rugged" server designed for harsh edge environments. It features a single 4th/5th generation Intel Xeon Scalable processor, providing high performance while keeping costs and power consumption low. The seamless aluminum chassis complies with MIL-STD-810G (shock and vibration) and MIL-STD-461G (electromagnetic interference) standards. It is equipped with up to five full-height PCIe slots, allowing for flexible installation of expansion cards such as GPUs and FPGAs. The depth can be selected from 430mm or 510mm.

  • server

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Super Durable Environment 2U Single XEON Server XRS 2U S8 SOLO

MIL-spec ruggedness. High-performance server made from machined aluminum that conquers harsh edge environments.

The XRS 2U S8 SOLO is an "Extreme Rugged" server optimized for harsh edge computing environments. It is equipped with a single configuration of 4th/5th generation Intel Xeon Scalable processors, balancing advanced processing power and cost efficiency. Its most notable feature is the seamless, robust chassis design made from machined aluminum. This ensures compliance with strict military standards such as MIL-STD-810G (temperature, shock, vibration) and MIL-STD-461G (electromagnetic interference), guaranteeing stable operation in extreme conditions. The depth can be selected from 400mm or 475mm, allowing for flexible adaptation to space-constrained field infrastructures.

  • server

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Environmentally resistant 3U waterproof robust server XRS 3U-IP S8 SOLO

Equipped with 5th generation Xeon. A rugged edge server compliant with IP54 and MIL standards, operating in extreme environments.

The XRS 3U-IP S8 SOLO is an extremely robust edge server designed for operation in harsh environments. It features a single-socket 5th/4th generation Intel Xeon Scalable processor, providing AI acceleration and advanced security features. The 3U aluminum machined chassis has an IP54 protection rating and uses MIL-grade connectors for I/O and power. It complies with MIL-STD-810G (temperature, shock, vibration) and MIL-STD-461G (electromagnetic compatibility), boasting reliability that is ideal for critical missions in defense and industry.

  • server

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Vecow Corporation Environmentally Resistant Fanless PC RES-5000

IP67 compliant, ultra-compact embedded system RES-5000 with excellent robustness.

【RES-5000 Main Features】 - Achieves CPU productivity with a maximum 15W TDP using an Intel Core i7-1185G7E processor in an onboard configuration. - High reliability with waterproof and dustproof compliance to IP 67 standards. - Equipped with two GigE LAN ports with X-code specification, and two COM ports and USB 3 ports with A-code specification, all using M12 connectors. - Complies with Intel vPro, Time-Sensitive Networking (TSN), and TCC standards, and supports TPM 2.0. - Wide DC power input of 9V-55V, capable of ignition control. - Fanless design supports operating temperatures from -40°C to 70°C.

  • Industrial PCs

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3U Rugged Dual XEON Server GAP-351R-S9

3U environmental-resistant dual XEON server (rear I/O, rear power) compliant with MIL-STD-810 and MIL-STD-461 *6th generation XEON

The GAP-351R-S9 is designed for 19-inch rack mounting and features a 3U chassis with a depth of 510mm. The rear I/O and power configuration allows for a variety of storage options. In addition to two onboard M.2 NVMe SSDs, it can accommodate up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, it is a robust server that supports up to six PCIe cards. To enhance protection against shock and vibration, an additional board with a dedicated retainer kit is available, ensuring optimal safety during transport. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, guaranteeing reliable operation even under harsh conditions commonly encountered in edge environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

  • server

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3U Rugged Dual XEON Server GAP-351P-S9

3U environmental-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-351P-S9 is designed for 19-inch rack mounting and features a 3U chassis with a depth of 510mm. Its front I/O and front power configuration provide flexible storage options, allowing for two internal M.2 NVMe slots, as well as the capability to support up to four removable U.2 NVMe SSDs or up to six removable 2.5-inch SATA SSDs. Additionally, this robust server can accommodate up to six PCIe cards. To enhance protection against shock and vibration, it can be supplied with a dedicated retainer kit for additional boards, ensuring optimal safety during transport. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, guaranteeing reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

  • server

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3U Rugged Dual XEON Server GAP-351F-S9

3U environmental-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, rear power) *6th generation XEON

The GAP-351F-S9 is designed for 19-inch rack mounting and features a 3U chassis with a depth of 510mm. With its front I/O and rear power configuration, it offers flexible storage options, accommodating two internal M.2 NVMe slots, up to six removable U.2 NVMe SSDs, or up to nine removable 2.5-inch SATA SSDs. Additionally, this robust server supports up to six PCIe cards. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors. Each unit comes with an inventory list to ensure configuration management and reproducibility. Additionally, upon request, specific thermal and mechanical environmental stress tests can be conducted for all server configurations.

  • server

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2U Rugged Single XEON Server GAP-247R-S9-SOLO

2U environmental-resistant single XEON server (rear I/O, rear power) compliant with MIL-STD-810 and MIL-STD-461 *6th generation XEON

The GAP-247R-S9-SOLO is designed for 19-inch rack mounting and features a 2U chassis with a depth of 470mm. Its rear I/O and power configuration provide a variety of storage options. In addition to two onboard M.2 NVMe SSDs, it can accommodate up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, this robust server can support two low-profile cards as well as up to three full-height, full-length PCIe x16 cards. Optionally, configurations with two full-height, full-length dual-slot PCIe x16 cards and two low-profile cards are also available. The robust edge server from GAP is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Additionally, an optional configuration compliant with the MIL-STD-461 standards for EMI/EMC is available.

  • server

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2U Rugged Dual XEON Server GAP-247R-S9

2U environment-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (rear I/O, rear power) *6th generation XEON

The GAP-247R-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 470mm. With its rear I/O and rear power configuration, it offers flexible storage options that can accommodate two internal M.2 NVMe slots, as well as up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, this robust server can support up to two PCIe cards. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available, utilizing MIL-standard connectors for both power input and I/O connectors. Each unit comes with an inventory list included at shipment to ensure configuration management and long-term reproducibility.

  • server

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2U Rugged Dual XEON Server GAP-247RL-S9

2U environment-resistant dual XEON server compatible with MIL-STD-810 and MIL-STD-461 (rear IO, rear power) *6th generation XEON

The GAP-247RL-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 470mm. Its rear I/O and rear power configuration provide flexible storage options, allowing for two internal M.2 NVMe slots, as well as the capability to accommodate up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, this robust server supports up to six low-profile PCIe cards. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors. Each unit comes with an inventory list that guarantees configuration management and reproducibility. Moreover, upon request, specific thermal and mechanical environmental stress tests can be conducted for all server configurations.

  • server

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2U Rugged Single XEON Server GAP-245RL-S9-SOLO

2U environment-resistant single XEON server compatible with MIL-STD-810 and MIL-STD-461 (rear I/O, rear power) *6th generation XEON

The GAP-245RL-S9-SOLO is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. With its rear I/O and rear power configuration, it offers flexible storage options supporting two internal M.2 NVMe SSDs, as well as up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Additionally, this robust server can accommodate up to six low-profile PCIe cards. GAP's rugged edge server complies with MIL-STD-810F standards for temperature resistance and shock resistance, and MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors. Each unit comes with an inventory list to ensure configuration management and reproducibility. Additionally, upon request, specific thermal and mechanical environmental stress tests can be conducted for all server configurations.

  • server

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2U Rugged Single XEON Server GAP-245P-S9-SOLO

2U environmental-resistant single XEON server compatible with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-245P-S9-SOLO is designed for 19-inch rack mounting and features a 1U chassis with a depth of 450mm. Its front I/O and front power configuration provide flexible storage options, supporting two onboard M.2 NVMe SSDs, one 2.5-inch internal NVMe U.2/SATA/SAS SSD, and up to two removable U.2 NVMe SSDs or up to three removable 2.5-inch SATA SSDs. Additionally, this robust server can accommodate two low-profile cards as well as up to three full-height, full-length PCIe x16 cards. Optionally, configurations with two full-height, full-length dual-slot PCIe x16 cards and two low-profile cards can also be selected. It is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, ensuring reliable operation even under harsh conditions that frequently occur in edge environments.

  • server

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2U Rugged Dual XEON Server GAP-245P-S9

2U environmental-resistant dual XEON server compatible with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-245P-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. It offers a variety of storage options, including two internal M.2 NVMe slots, thanks to its front I/O and front power configuration. Additionally, this robust server can accommodate up to two PCIe cards. To enhance protection against shock and vibration, an additional board with a dedicated retainer kit is available, ensuring optimal safety during transport. The GAP rugged edge server is designed to comply with MIL-STD-810F standards for temperature resistance and shock resistance, as well as MIL-STD-167-1A standards for vibration resistance, guaranteeing reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available, utilizing military-grade connectors for both power input and I/O connectors.

  • server

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2U Rugged Dual XEON Server GAP-245PL-S9-DUO

2U environmental-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-245PL-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. With its front I/O and front power configuration, it offers flexible storage options that can accommodate two internal M.2 NVMe slots, as well as up to two removable U.2 NVMe SSDs or up to three removable 2.5-inch SATA SSDs. Additionally, this robust server can support up to six low-profile PCIe cards. To enhance protection against shock and vibration, it can be supplied with a dedicated retainer kit for additional boards, ensuring optimal safety during transport. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, guaranteeing reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

  • server

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2U Rugged Single XEON Server GAP-245F-S9-SOLO

2U environment-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, rear power) *6th generation XEON

The GAP-245F-S9-SOLO is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. The front I/O and rear power configuration allow for a variety of storage options. In addition to two onboard M.2 NVMe SSDs, it can accommodate up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Furthermore, this robust server can support two low-profile cards as well as up to three full-height, full-length PCIe x16 cards. Optionally, configurations with two full-height, full-length dual-slot PCIe x16 cards and two low-profile cards can also be selected. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Optionally, a configuration compliant with the MIL-STD-461 standards for EMI/EMC is available.

  • server

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2U Rugged Dual XEON Server GAP-245F-S9

2U environmental-resistant dual XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, rear power) *6th generation XEON

The GAP-245F-S9 is designed for 19-inch rack mounting and features a 2U chassis with a depth of 450mm. With its front I/O and rear power configuration, it offers a variety of storage options, including two internal M.2 NVMe slots, up to two removable U.2 NVMe SSDs, or up to three removable 2.5-inch SATA SSDs. It can accommodate NVMe SSDs or up to three removable 2.5-inch SATA SSDs. Additionally, this rugged server can support up to two PCIe cards. It is a robust edge server with heat and shock resistance compliant with MIL-STD-810F standards, as well as vibration resistance compliant with MIL-STD-167-1A standards. The design meets the temperature resistance and shock resistance of MIL-STD-810F and the vibration resistance of MIL-STD-167-1A, ensuring reliable operation even under harsh conditions commonly encountered in edge environments. Furthermore, it can be configured to comply with the MIL-STD-461 standards for EMI/EMC as an option. Military-grade connectors are used for both power input and I/O connectors.

  • server

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2U Rugged Single XEON Server GAP-235PL-S9SOLO

2U environmental-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, front power) *6th generation XEON

The GAP-235PL-S9-SOLO is designed for 19-inch rack mounting and features a 2U chassis with a depth of 350mm. Its front I/O and front power configuration provide a variety of storage options. Specifically, it can accommodate two internal M.2 NVMe SSDs, and up to two removable U.2 NVMe SSDs, or up to three removable 2.5-inch SATA SSDs simultaneously. Furthermore, this rugged server can house up to six low-profile PCIe cards and comes standard with a rear-removable fan. GAP's robust edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, ensuring reliable operation even under the harsh conditions frequently encountered in edge environments. Additionally, an optional configuration compliant with the MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

  • server

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1U Rugged Single XEON Server GAP-151R-S9 SOLO

1U environmental-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (rear I/O, rear power) * 6th generation XEON

The GAP-151R-S9-SOLO is designed for 19-inch rack mounting and has a depth of 540mm in a 1U chassis. With its rear I/O and rear power configuration, it can accommodate two onboard M.2 NVMe SSDs, as well as up to six removable U.2 NVMe SSDs or up to nine removable 2.5-inch SATA SSDs. Additionally, this rugged server can support one low-profile PCIe x16 card and up to two full-height, full-length PCIe x16 cards. To enhance protection against shocks and vibrations, an optional dedicated retainer kit for additional boards can be included, ensuring optimal safety during transport. GAP's rugged edge server is designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standard for vibration resistance, guaranteeing reliable operation even under the harsh conditions frequently encountered in edge environments. Furthermore, it can be configured to comply with the MIL-STD-461 standards for EMI/EMC as an option. Military-grade connectors are used for both power input and I/O connectors.

  • server

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1U Rugged Single XEON Server GAP-145P-S9 SOLO

1U environment-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, front power) * 6th generation XEON

The GAP-145P-S9-SOLO is designed for 19-inch rack mounting and features a 1U chassis with a depth of 450mm. With its front I/O and front power configuration, it offers a variety of storage options, supporting two onboard M.2 NVMe SSDs and up to two 2.5-inch internal NVMe or SATA SSDs. Furthermore, this rugged server can accommodate up to two full-height, full-length PCIe x16 cards and one low-profile PCIe x16 card. To enhance protection against shock and vibration, it provides an additional board with a dedicated retainer kit, ensuring optimal safety even during transport. Designed to meet the MIL-STD-810F standards for temperature resistance and shock resistance, as well as the MIL-STD-167-1A standards for vibration resistance, GAP's rugged edge server guarantees reliable operation even under harsh conditions frequently encountered in edge environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available. Military-grade connectors are used for both power input and I/O connectors.

  • server

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1U Rugged Single XEON Server GAP-145F-S9 SOLO

1U environmental-resistant single XEON server compliant with MIL-STD-810 and MIL-STD-461 (front IO, rear power) *6th generation XEON

The GAP-145F-S9-SOLO is designed for 19-inch rack mounting and features a 1U chassis with a depth of 450mm. With its front I/O and rear power configuration, it offers a variety of storage options. In addition to two internal M.2 NVMe SSDs and one internal NVMe U.2/SATA SSD, it can accommodate up to two onboard U.2 NVMe SSDs or up to three removable 2.5-inch SATA SSDs. Furthermore, this rugged server can support up to two full-height, full-length PCIe x16 cards and one low-profile PCIe x16 card. Designed to meet MIL-STD-810F standards for temperature resistance and shock resistance, as well as MIL-STD-167-1A standards for vibration resistance, GAP's robust edge server ensures reliable operation even in harsh environments. Additionally, an optional configuration compliant with MIL-STD-461 standards for EMI/EMC is available, featuring military-grade connectors for both power input and I/O connectors.

  • server

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Vecow Dustproof and Waterproof AI PC RAC-1000

NVIDIA Jetson AGX Orin equipped, IP67 compliant, fanless AI PC RAC-1000

The rugged AI PC "RAC-1000," compliant with IP67 standards, features NVIDIA Jetson AGX Orin / Jetson AGX Orin Industrial and supports the JetPack 6.0 SDK. It is equipped with GigE LAN, USB 3.1, isolated CAN Bus, and COM ports, supports 4x M.2 and up to 8 automotive GMSL2 cameras (Fakra-Z connector), and operates in a fanless design with an extended temperature range from -25°C to 70°C. It is ideal for outdoor and harsh environments, including automation of agricultural machinery, outdoor robots, and construction site automation.

  • Industrial PCs
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Vecow Dustproof and Waterproof AI PC RAC-1100

NVIDIA Jetson AGX Orin equipped, IP67 compliant, fanless AI PC RAC-1100

The rugged AI PC "RAC-1100," compliant with the IP67 standard, features the NVIDIA Jetson AGX Orin / Jetson AGX Orin Industrial and supports the JetPack 6.0 SDK (Software Development Kit). It is equipped with PoE+, GigE LAN, USB 3.1, isolated CAN Bus, and COM ports, has 2x M.2 slots, and operates in a fanless design, supporting an extended temperature range from -25°C to 70°C. It is ideal for outdoor and harsh environments, such as automation in agricultural machinery, outdoor robots, and construction site automation.

  • Industrial PCs
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Vecow Corporation Rugged PC HEC-1000

HEC-1000 rugged PC equipped with 14th/13th generation Intel CPU, compliant with MIL-STD-810G and MIL-STD-461G.

【HEC-1000 Main Features】 - Equipped with Intel Core 200S series and Intel Core processors (14th/13th/12th generation) - High-performance MIL-standard compliant PC with IP66 for reliable waterproof and dustproof protection - Features MIL-DTL-38999 connectors with 6×USB2.0, 4×GigE RJ45, 4×COM ports, DVI-I, and Key M - Conveniently equipped with 2 external 2.5" SSD trays - Wide power input DC 9V to 50V - Fanless design supporting temperatures from -40°C to 65°C

  • Industrial PCs

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16ch differential, 4x8bit DIO mezzanine card TFMC685

TEWS company ANSI/VITA 57.1 compliant FPGA mezzanine card (FMC) TFMC685.

The TFMC685 provides the capability to add a 16-bit M-LVDS (Multi-Point Low Voltage Differential Signaling) I/O interface or a 16-bit RS-485/RS-422 I/O interface to an FMC carrier card. TFMC685-10R: 16 M-LVDS I/O, 32 digital I/O, LPC-FMC TFMC685-20R: 16 RS485/RS422 I/O, 32 digital I/O, LPC-FMC Each I/O signal is connected to the VHDCI-68 connector on the front panel.

  • Expansion Boards
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Condor GR5S-AD5000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card (equipped with NVIDIA RTX 5000 Ada generation)

The Condor GR5S-AD5000 is an extremely robust 3U OpenVPX standard video graphics and GPGPU processing card equipped with an NVIDIA RTX 5000 GPU (Ada Lovelace architecture). This card features a powerful core configuration with 9,728 CUDA cores, 304 Tensor cores, and 76 RT cores, and it combines high reliability and computational performance with 16 GB of GDDR6 memory with ECC (Error Correction Code). It adopts PCI Express Gen 4 for its interface, and the support for GPUDirect RDMA significantly reduces data transfer latency. Additionally, it is developed in alignment with the SOSA standard, ensuring interoperability and scalability in military and aerospace applications. The cooling method offers both conduction cooling (CC) and airflow-through (AFT) variations to meet stringent thermal requirements. This card provides an unparalleled solution for data-intensive tasks, delivering exceptional efficiency and responsiveness.

  • Embedded Board Computers

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Condor VC300xX - EIZO

Robust 12G-SDI XMC video capture solution

The Condor VC300xX is an ultra-high-definition (UHD) video capture solution in the XMC form factor designed for high-performance video processing. This device transfers raw video data to the host system with ultra-low latency via PCIe, enabling real-time viewing, processing, analysis, and display. This allows for seamless integration into workflows that require advanced video processing. One of its key features is its low power consumption of less than 20W, making it ideal for compact platforms sensitive to SWaP (Size, Weight, and Power) such as UAVs (unmanned aerial vehicles). This product is available in ruggedized variants for air cooling and conduction cooling, and can be integrated into systems aligned with VITA and SOSA standards. A comprehensive SDK is provided to simplify capture data management. It also supports VITA 46.9 VPX I/O signal mapping (X12d, X8d, X16s).

  • Embedded Board Computers

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Condor GR5S-AD2000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card equipped with NVIDIA RTX 2000 Ada generation.

The Condor GR5S-AD2000 is a robust 3U OpenVPX standard video graphics/GPGPU processing card equipped with an NVIDIA RTX 2000 GPU (Ada Lovelace). Performance: It features 3,072 CUDA cores, 96 Tensor cores, and 24 RT cores, providing high efficiency and responsiveness for edge computing and data-intensive tasks. Memory: It is equipped with 8 GB of GDDR6 graphics memory with ECC (Error Correction Code), ensuring high reliability. Connectivity: It supports PCI Express Gen 4 connections (x4, x8, x16 lanes) and supports GPUDirect RDMA, significantly reducing data transfer latency. Cooling: Both air-cooled and conduction-cooled variations are available, offering robustness that meets the VITA 47.3 design specifications.

  • Embedded Board Computers

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Condor GR5S-B4000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card (NVIDIA RTX PRO 4000 Blackwell GPU)

The Condor GR5S-B4000 is a rugged video graphics/GPGPU card in the 3U OpenVPX standard, equipped with the cutting-edge NVIDIA RTX PRO 4000 Blackwell GPU. Performance: It features 7,680 CUDA cores and 240 Tensor cores, delivering exceptional performance in edge AI inference and real-time situational analysis. Memory: It is equipped with 16 GB of ECC-supported GDDR7 memory, ensuring reliability for mission-critical applications. Connectivity: High-speed data transfer is achieved through PCIe Gen 4 switching and GPUDirect RDMA. Cooling: It supports both conduction cooling and airflow-through variations, maintaining stable operation even in harsh environments due to its new design. This card is the ideal solution for fields that demand extreme reliability and high computational power.

  • Embedded Board Computers

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Condor NVB2000xX - EIZO

Embedded XMC graphics and GPGPU card equipped with NVIDIA RTX PRO 2000 Blackwell GPU.

The Condor NVB2000xX is a robust XMC video graphics and GPGPU card built on the advanced NVIDIA RTX PRO 2000 Blackwell GPU, which supports error correction code (ECC) and 8GB of GDDR7 graphics memory with a 128-bit memory interface. As the first architecture to support GDDR7, NVIDIA Blackwell has made significant advancements in bandwidth speed, improved signal integrity, and reductions in energy usage and power consumption, making it an ideal choice for demanding high-performance computing environments. It also supports three DisplayPort++/DVI video outputs. The Condor NVB2000xX is a high-performance card featuring the NVIDIA RTX PRO 2000 Blackwell GPU, equipped with 3,328 CUDA cores, demonstrating exceptional capabilities for AI processing and real-time analytics. It achieves high-speed data transfer with PCIe Gen 5 and GPUDirect RDMA, making it perfect for mission-critical VPX systems.

  • Embedded Board Computers

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Condor NVB500xX - EIZO

Embedded XMC graphics & GPGPU card equipped with NVIDIA RTX PR 500 Blackwell GPU.

The Condor NVB500xX is a robust XMC video graphics and GPGPU card. GPU: Equipped with the advanced NVIDIA RTX PRO 500 Blackwell GPU. Memory: Supports 6GB of ECC-enabled GDDR7 graphics memory and a 128-bit memory interface. Features: NVIDIA Blackwell, the first architecture to support GDDR7, achieves significant improvements in bandwidth, enhanced signal integrity, and reductions in energy consumption and power usage. Applications: These features make it ideal for demanding high-performance computing environments. Output: Supports three DisplayPort++/DVI video outputs. This card is a high-performance embedded system solution that leverages next-generation memory technology and is equipped with the NVIDIA RTX PRO 500 Blackwell GPU. It has 1,792 CUDA cores, excelling in AI processing and real-time analytics. It enables high-speed data transfer with PCIe Gen 5 and GPUDirect RDMA, compatible with VPX systems.

  • Embedded Board Computers

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Condor GR5S-B5000 - EIZO Rugged

SOSA-aligned 3U VPX graphics and GPGPU card (NVIDIA RTX PRO 5000 Blackwell GPU)

The Condor GR5SL-B5000 is a robust 3U OpenVPX video graphics/GPGPU card equipped with the advanced NVIDIA RTX PRO 5000 Blackwell GPU. It features 10,496 CUDA cores, 320 Tensor cores, and 80 RT cores, along with ECC-supported 24 GB GDDR7 memory (256-bit), providing high performance and efficiency for AI inference and edge computing. Connectivity: It integrates a Microchip PFX PCIe Gen 4 switch for high-speed connections and supports GPUDirect RDMA to reduce data transfer latency. Cooling: It offers both conduction cooling (VITA 48.2) and airflow-through (VITA 48.8) variations, with a new design that significantly improves thermal efficiency. This card also includes the 9th generation NVENC (supporting 4:2:2) and 6th generation NVDEC decoder, making it ideal for mission-critical environments.

  • Embedded Board Computers

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Condor GR5SL-B4000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card (NVIDIA RTX PRO 4000 Blackwell GPU)

The Condor GR5SL-B4000 is a robust 3U OpenVPX video graphics and GPGPU card equipped with the advanced NVIDIA RTX PRO 4000 Blackwell GPU. It features ECC-supported 16 GB GDDR7 memory and PCI Express Gen 5, providing groundbreaking performance and efficiency in high-performance computing (HPEC) environments such as edge AI inference. The GPU includes 7,680 CUDA cores, 240 Tensor cores, and 60 RT cores, enabling AI-accelerated data processing. Additionally, it has a built-in 9th generation NVENC/6th generation NVDEC encoder, excelling in video performance. It supports NVIDIA GPUDirect RDMA, reducing data transfer latency. The thermal design accommodates conduction cooling (VITA 48.2) and airflow-through (VITA 48.8), improving thermal efficiency.

  • Embedded Board Computers

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Condor GR5SL-B5000 - EIZO

SOSA-aligned 3U VPX graphics and GPGPU card (NVIDIA RTX PRO 5000 Blackwell GPU)

The Condor GR5SL-B5000 is a robust 3U OpenVPX video graphics and GPGPU card equipped with the advanced NVIDIA RTX PRO 5000 Blackwell GPU. It supports ECC-enabled 24 GB GDDR7 graphics memory and PCI Express Gen 5 for the first time, significantly improving data transfer speeds and performance per watt. The GPU features 10,496 CUDA cores, 320 Tensor cores, and 80 RT cores, delivering exceptional performance for AI-accelerated data processing and real-time situational analysis. It also includes a 9th generation NVENC encoder and a 6th generation NVDEC decoder that support 4:2:2, providing advanced video compression and playback capabilities. Additionally, it supports NVIDIA GPUDirect RDMA, greatly reducing data transfer latency. Available in both conduction cooling (VITA 48.2) and airflow-through (VITA 48.8) variations, it minimizes performance degradation at high temperatures.

  • Embedded Board Computers

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Condor GR6S-AD2000 - EIZO

SOSA-aligned 3U VPX video capture and GPGPU card (based on NVIDIA RTX 2000 Ada generation)

This is a robust 3U OpenVPX video capture and GPGPU processing card designed for mission-critical C5ISR and high-performance embedded computing (HPEC) applications. The Condor GR6S-AD2000, equipped with the NVIDIA RTX 2000 Ada GPU, is the ideal solution for ultra-low latency video capture and delivery in sensor fusion, object detection, and automatic target recognition (ATR) applications. Based on the NVIDIA Ada Lovelace architecture, it features 3,072 CUDA cores, 24 Tensor cores, and 96 RT cores, delivering exceptional performance in parallel computing, AI workloads, and advanced visualization. The 8GB GDDR6 memory with error correction code (ECC) ensures reliable data integrity and stability even in harsh environments. It supports encoding/decoding of H.265 (HEVC), H.264 (MPEG4/AVC), and AV1. Additionally, it is compatible with NVIDIA GPUDirect RDMA, achieving reduced latency and improved data transfer speeds in real-time processing.

  • Embedded Board Computers

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Condor AGX-ORIN64-HPC - EIZO

NVIDIA Jetson AGX Orin 64GB equipped embedded 3U VPX single-board computer

The Condor AGX-ORIN64-HPC is a robust 3U VPX high-performance single board computer (SBC) designed for autonomous and embedded edge computing systems. It features the NVIDIA Jetson AGX Orin 64GB (Industrial) System on Module (SoM), which is equipped with an NVIDIA Ampere architecture GPU and a 12-core Arm Cortex-A78AE CPU. The module's 64GB LPDDR5 system memory achieves a maximum memory bandwidth of 205 GB/s, shared among the internal CPU, GPU, and accelerator engines. It is equipped with HEVC (H.265)/AVC (H.264) compliant NVENC and NVDEC engines, supporting up to 4K-UHD encoding resolution. The AGX-ORIN64-HPC is designed to support both the VITA 46/65 and Sensor Open System Architecture (SOSA) technical standards for slot profile 14.6.11.

  • Embedded Board Computers

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32ch Differential I/O FPGA Mezzanine Card TFMC684

TEWS company's FPGA mezzanine card (FMC) is a mezzanine module compliant with ANSI/VITA 57.1.

The TFMC684 provides the capability to add a 32-bit M-LVDS (Multi-Point Low Voltage Differential Signaling) I/O interface or a 32-bit RS-485/RS-422 I/O interface to an FMC carrier card. TFMC684-10R: Compliant with TIA/EIA-899 standard (Type 2 receiver) TFMC684-20R: Compliant with TIA/EIA-485 and TIA/EIA-422 standards The 32-bit differential I/O is connected to the VHDCI-68 connector on the front panel.

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Condor AGX-IOX - EIZO

NVIDIA Jetson AGX Orin 64GB equipped embedded 3U VPX single-board computer

The Condor AGX-IOX is a robust 3U VPX high-performance single board computer (SBC) designed for autonomous and embedded edge computing systems. It performs instantaneous data analysis and transfer, multi-sensor processing, encoding/decoding, and AI inference. The Condor AGX-IOX is equipped with the NVIDIA Jetson AGX Orin SoM (Industrial) and supports the NVIDIA Ampere GPU and Arm Cortex-A78AE CPU. This product supports 64GB LPDDR5 system memory and achieves a maximum memory bandwidth of 205 GB/s shared between the ARM Cortex CPU, NVIDIA Ampere GPU, and accelerator engines.

  • Embedded Board Computers

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TEWS cPCI-Serial Ethernet TCPS892

3U CompactPCI Serial 4-Channel 1000BASE-T Ethernet Card TCPS892

The TCPS892 from TEWS is a 3U module compatible with PICMG CPCI-S.0 R2.0. Ethernet 10Base-T / 100Base-TX / 1000Base-TX Equipped with Intel I350 PHY Supports IEEE 1588/802.1AS time protocol (PTP) Each port is electrically isolated from the Ethernet controller and connects to the P3 rear I/O connector. ◆ The CompactPCI Serial 3U rear board TCPS007-TM is also available.

  • Embedded Board Computers
  • Communications

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MilDef Ultra-Rugged 10.1-Inch Tablet PC DS16P

Complies with MIL-STD-810H, MIL-STD-461G, and IP65. Operating temperature supports -30°C (optional), ultra-rugged tablet PC.

The "DS16P" from MilDef, a robust standard manufacturer with numerous overseas achievements and a track record in domestic defense applications, is the third generation of the DS series. It features enhancements in AI, graphics, and power efficiency, providing a powerful platform capable of meeting the demands of modern mobile computing. In addition to programmable NVIS functions that work in conjunction with the OS and a variety of options, it also allows for various customizations, including compatibility with MIL connectors that are waterproof. This is the best solution that can respond widely and flexibly to customer requests! ■ Japanese technical documents for MIL-STD-810, MIL-STD-461, and IP standards are available. If you would like to see them, please contact sales@nacelle.co.jp ■

  • Industrial PCs

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VITA-93 QMC Standard Explanation Japanese Version

Introducing a New Era of Modular I/O Solutions: VITA-93 QMC Standard Explanation - Japanese Version

VITA 93 (QMC) is a groundbreaking advancement in mezzanine card technology, offering unparalleled modularity, flexibility, scalability, and reliability.

  • Embedded Board Computers

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TEWS PCIe Mini Card Carrier TPCE240

PCIe Mini Card Single PCI Express Revision 2.0 Compatible Carrier Board TPCE240

TEWS' PCIe mini card carrier can be used as a mechanical adapter to connect PCIe mini cards to PCIe bus-based systems.

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TEWS Technologies cPCI-Serial XMC Carrier TCPS275

3U CompactPCI Serial XMC Module Carrier Card TCPS275

The TCPS275 from TEWS is a 3U module compatible with PICMG CPCI-S.0 R2.0. It can be used as a mechanical adapter to connect XMC I/O solutions to CompactPCI Serial.

  • Expansion Boards
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TEWS Technology cPCI-Serial PMC Carrier TCPS260

3U CompactPCI Serial PMC Module Carrier Card TCPS260

The TEWS TCPS260 is a 3U module compatible with PICMG CPCI-S.0 R2.0. It can be used as a mechanical adapter to connect PMC I/O solutions to CompactPCI Serial.

  • Embedded Board Computers
  • Expansion Boards

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TEWS Corporation Serial Interface Card TQMC400

TQMC400 is a 4-channel serial card with a QMC form factor.

The TQMC400 is a VITA 93.0 compliant QMC mezzanine card equipped with a multi-protocol transceiver and features four UART channels. Each channel can be programmed to operate as an RS232, RS422/RS485 (full duplex), or RS485 (half duplex) interface.

  • Embedded Board Computers
  • Other embedded systems (software and hardware)

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