List of Measurement and Analysis products
- classification：Measurement and Analysis
8971～9000 item / All 53345 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
Microscopic PL observation of the fine structure of wafers in the solar cell manufacturing process.
- Image Processing Equipment
- Defect Inspection Equipment
- Contract measurement
The String Checker SZ-200 can identify solar panel failures on a string-by-string basis.
- Other inspection equipment and devices
We conduct environmental testing, as well as non-destructive observation and electrical property measurements.
- Analytical Equipment and Devices
- Analysis Services
Appearance observation and measurement services
We would like to introduce our "Appearance Observation and Measurement Service." We are equipped with a variety of devices to meet your needs, including appearance observation before and after reliability testing, solder joint observation, as well as dimensional measurements and surface roughness measurements of various components. You can also leave the pre-observation processing to us. Our company has IPC-certified IPC specialists on staff. We provide assistance with observations, consultations, and solutions to various observation-related concerns in accordance with international standards.
Inspection equipment effective for initial observation of various components and materials, including implementation substrates and electronic parts.
- X-ray inspection equipment
- Other inspection equipment and devices
Introducing a new device! We present an analytical method aimed at the qualitative and quantitative analysis of components contained in samples.
- Analytical Equipment and Devices
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Two high-power constant temperature and humidity chambers have been introduced! Ideal for temperature cycle tests and temperature and humidity cycle tests for automotive parts and more.
- Contract measurement
- Contract Analysis
- Contract Inspection
Rubber heat aging test
Our company conducts "rubber thermal aging tests" that help evaluate the properties of materials in actual usage environments. Using a method compliant with JIS K6257 (Method for determining thermal aging characteristics of vulcanized rubber and thermoplastic rubber), rubber test pieces are suspended in a gear oven to create specimens with varying heat treatment times. Additionally, tensile tests are performed on heated natural rubber (NR) to investigate changes in mechanical properties, while hardness is measured simultaneously. Changes in the characteristics of the rubber are also examined, confirming that rubber elasticity is lost and the material becomes harder with heating.
X-ray CT observation allows for the assessment of the winding condition of coil wiring! We will introduce examples of observing IC-type coils, which differ from X-ray transmission observation.
- X-ray inspection equipment
- Other inspection equipment and devices
Analysis case of faulty switch contacts
Since a malfunction was suspected in the switch section of the appliance that would not power on, we will introduce a case study along with the work flow. First, we check for any shape changes such as swelling, cracking, or discoloration through visual observation. In the electrical check, we confirm whether the malfunction can be reproduced and whether it is an open or short circuit. An internal observation using X-rays revealed that the contact terminals inside the switch had melted, scattered, and disappeared, resulting in an open failure. Ultimately, we will submit a report that includes the consideration of the cause. We also accept inquiries for analysis consultations after non-destructive testing, so please feel free to contact us.
[Comparison images available] Internal shape abnormalities can also be observed non-destructively! We compared X-ray CT and cross-sectional SEM.
- X-ray inspection equipment
- Other inspection equipment and devices
X-ray fluoroscopy observation, oblique CT observation, orthogonal CT observation, etc.! Introduction of BGA solder crack analysis cases.
- X-ray inspection equipment
- Other inspection equipment and devices
Analysis case of faulty switch contacts
Since a malfunction was suspected in the switch section of the appliance that would not power on, we will introduce a case study along with the work flow. First, we check for any shape changes such as swelling, cracking, or discoloration through visual observation. In the electrical check, we confirm whether the malfunction can be reproduced and whether it is an open or short circuit. An internal observation using X-rays revealed that the contact terminals inside the switch had melted, scattered, and disappeared, resulting in an open failure. Ultimately, we will submit a report that includes the consideration of the cause. We also accept inquiries for analysis consultations after non-destructive testing, so please feel free to contact us.
[Video Available] Captured the moment of defect occurrence! Introducing a case of X-ray observation using LED.
- X-ray inspection equipment
- Other inspection equipment and devices
![[Case Study] X-ray Fluoroscopy and ...](https://image.mono.ipros.com/public/product/image/644/2000512065/IPROS17385861556985486280.png?w=280&h=280){kind=small}
Numerous examples of "BGA solder crack analysis," "surface mount LEDs," and "chip resistor observation" using X-ray fluoroscopy and angled CT observation are included!
- X-ray inspection equipment
- Contract Inspection
- Contract Analysis
We offer a variety of measurement modes, including double cantilever beam bending and three-point bending with free support!
- Contract measurement
- Contract Analysis
- Weight related measuring instruments
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Observe the degree of endothermic/exothermic reaction of the sample! The temperature range is possible from -90°C to 550°C.
- Contract measurement
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
The analysis sensitivity of TOF-SIMS is high at the ppm level, making it effective for analyzing trace contamination!
- Contract Analysis
- Contract Inspection
- Contract measurement
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
High-resolution imaging with a micro probe! Achieving nano-level structural analysis.
- Contract Analysis
- Contract measurement
- Other microscopes
Depth-direction measurements using Raman spectroscopy! Material analysis of each layer is possible from the surface of multilayer films.
- Spectroscopic Analysis Equipment
- Analytical Equipment and Devices
- Contract Analysis
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.
Applicable to change observation, with support for additional analysis! We evaluate the subject in a time series and non-destructive manner.
- Contract Inspection
- Testing Equipment and Devices
- Other inspection equipment and devices
Observation of substrate deformation using a 3D shape measuring device (VR-6200)
I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.
![[Example of Analysis by EBSD] Screw](https://image.mono.ipros.com/public/product/image/d61/2000533368/IPROS90868083247351914914.png?w=280&h=280){kind=small}
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Visualize the features that appear in the graph! You can check the distribution of crystal sizes and the orientation of crystal directions.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of the analysis of EBSD patterns (Kikuchi patterns) at gold wire bond joints.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Achieve high processing precision and a wide processing area! Machining is also possible while reducing damage with cooling functions.
- Contract Inspection
- Processing Contract
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.
You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!
- Other contract services
- Contract Inspection
Observation of tracking camera cross-section by mechanical grinding.
I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.
Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!
- Analysis Services
- Contract Analysis
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
Even with SiC power devices, we can provide consistent support for cross-section preparation of specific areas, observation of diffusion layer shapes, as well as wiring structure and crystal structure...
- Analysis Services
- Contract Analysis
Check the quality status of LCD components and products! We will analyze the structures of the LCD panels using our analytical methods and expertise!
- Analysis Services
- Contract Analysis
Observation of Conductive Particle Shape in COG Implementation
We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.
We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!
- Analysis Services
- Contract Analysis
- Semiconductor inspection/test equipment
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
Analysis of inorganic compounds such as metal oxides is also possible!
- Analysis Services
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.