List of Electronic Components products
- classification：Electronic Components
2251～2295 item / All 28808 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
Non-contact detection of wind turbine blade angle!
- Sensors
Detects rotation angles without contact! Ideal for aerospace applications.
- Sensors
We realize electronics with thin, lightweight, and flexible substrates. The design philosophy of flexible hybrid electronics in response to changes in social structure.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Reduce manufacturing processes by applying functional ink only where necessary! A new manufacturing technology that contributes to energy savings and material waste reduction.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Wireless communication sends data to smartphones and the cloud! FHE system configuration that allocates roles appropriately.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
We expand the possibilities of product design with flexible substrates! FHE enhances design freedom and creates new applications.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Solving technical challenges for large-scale deployment of IoT sensors! We propose low-cost dataization for society as a whole.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Microwave Level Sensor for General-purpose Tanks
- Sensors
The brightness of the outdoor display reaches 4000 nits, allowing it to be read in direct sunlight, providing clear and engaging content no matter where the audience is.
- LCD display
- Other electronic parts
Accurately detect the angle of solar panels! Improve reliability with non-contact.
- Sensors
Since it's a basic component, I want to focus on quality! akane:ohm's passive components.
- Resistors
Demonstrating automotive quality and excellent long-term stability with data! Major renewal of product information for the high current shunt resistor 'APS Series'.
Thank you for always viewing our product information. We have renewed the product information for our high-current shunt resistors, the "APS Series," which achieve both miniaturization of the circuit board and thermal management, as well as high-precision current detection. To facilitate smoother design considerations and replacements from other companies' products (cross-references) than ever before, we have newly expanded and published detailed reliability test data that supports the strict automotive reliability standard "AEC-Q200 compliant," including ultra-high ratings of up to 15W and ultra-low resistance specifications of at least 0.1mΩ, as well as the rate of change in resistance ΔR during temperature fluctuations and high-temperature life tests. Furthermore, we cover "specific adoption and application examples" ranging from automotive fields such as engine control and battery management systems (BMS) to industrial and power equipment fields such as inverters and DC/DC converters.
Introducing an AC adapter with input: 100VAC, output: 12VDC 1A.
- Surveillance Camera System
- AC adapter
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The scientific management method proposed by Frederick W. Taylor, which made significant contributions to the industry, will finally become a true weapon thanks to IoT technology!
- Sensors
- Other Sensors
3.2×4.5×1.5mm ultra-small SMD trimmer capacitor | Suitable for high Q and high-frequency circuit adjustments
- Capacitor
For optical components and electronic components, leave it to Sinkland Corporation!
- Other optical parts
- Other electronic parts
It is possible to thin down to 0.2mm! There are proven applications in various products such as mobile phones and digital cameras, both domestically and internationally!
- antenna
- Sensors
- Other electronic parts
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Overwhelming adoption results in smartphones and digital cameras both domestically and internationally. Supports thicknesses down to 0.2mm, contributing to product miniaturization and slimming!
- Other electronic parts
UV-CCL that resolves the issues of conventional sterilization lamps.
- Water quality improvement
- Light source/lighting
- Lamps and light emitting devices
We will exhibit at the Osaka Industrial Exhibition 2026. [Exhibition of UV lamps that are long-lasting, strong against ON/OFF, compact, and in special shapes.]
Our company will be exhibiting cold cathode UV lamp-related products at Booth A-06 on the 3rd floor. "Osaka Industrial Exhibition 2026" Official Website https://kangyo.osaka.cci.or.jp/ Event Name: Osaka Industrial Exhibition 2026 Date and Time: October 14, 2026 (Wednesday) 10:00 AM - 5:00 PM October 15, 2026 (Thursday) 10:00 AM - 4:00 PM Location: MyDome Osaka Exhibition Hall (2-5 Honmachi-bashi, Chuo Ward, Osaka City) https://www.mydome.jp/mydomeosaka/access/ Admission Fee: Free Organizers: Osaka Chamber of Commerce and Industry, Sakai Chamber of Commerce and Industry, Osaka Prefectural Federation of Chambers of Commerce Co-organizers: Chambers of Commerce and Industry and Associations within Osaka Prefecture By registering in advance, you can enter without waiting in line at the reception on the day of the event. https://kangyo.osaka.cci.or.jp/visitor/regist
Non-contact floor leak detection equipment monitoring sensor. Start leak monitoring without the need for construction.
- Sensors
We will quickly detect abnormal liquid leakage and support stable operation of the equipment!
- Sensors
- Surveillance Camera System
FPC optimal for environments where cutting oil is being sprayed.
- Other electronic parts
FPC optimal for environments where cutting oil is being sprayed.
- Other electronic parts
A waterproof tactile switch with waterproof functionality and LED illumination achieved through innovative structural design.
- switch
Early detection of chemical leaks in semiconductor manufacturing equipment. Supporting risk reduction of equipment downtime and stable operation.
- Sensors
- Surveillance Camera System
Agilex 5 FPGA SOM Second Edition. Low-cost and small Comet A13 SoM.
- Embedded Board Computers
- Other electronic parts
- Other semiconductors
A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
This is an introduction to a power supply device for semiconductor lasers that adopts a multi-phase drive switching method.
- Switching Power Supply
- power supply
- Circuit board design and manufacturing
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
- Other electronic parts
- Printed Circuit Board
- Circuit board design and manufacturing
Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.
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We have compiled terms used in meetings related to FPC manufacturing. Please use it as an introductory mini-dictionary and an offline search tool.
- Printed Circuit Board
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
- Other electronic parts
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!
- Printed Circuit Board
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine patterns make the wiring inconspicuous.
- Other electronic parts
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
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[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!
- Printed Circuit Board
- Other electronic parts
- Other cable related products
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniq...
- Printed Circuit Board
- Circuit board design and manufacturing
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aeros...
- Printed Circuit Board
- Circuit board design and manufacturing
- Other electronic parts
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
For tension management of fibers. Achieving high-precision position detection without contact.
- Sensors
- Liquid level control/level switch
MACOME Construction Machinery Solutions
At Makome Laboratory, we have a variety of robust sensors suitable for construction machinery. We have prepared a page with examples, so please take a look.
65W AC adapter for medical devices, a carefully crafted power supply that balances high quality and low price.
- AC adapter
- power supply
- Other power sources
AC ADAPTER | CEATEC 2026 Makuhari Messe, October 13th to 16th.
We will showcase high‑quality power solutions—including AC adapters, switching power supplies, and power cables—at CEATEC 2026 (Makuhari Messe). Our exhibit features a wide range of PSE, UL, CE, KC, CCC, and BSMI‑certified power products, allowing visitors to check actual units on site. Details: https://www.tokitrading.co.jp/news/event/12168/ High‑Quality AC Adapters (5W–600W)｜Reliable External Power Supplies for Consumer, Industrial, and Medical Devices. Our AC adapters deliver stable performance across 5W to 600W, supporting output voltages such as 5V, 9V, 12V, 15V, 24V, and 36V. We have extensive supply records with major electrical manufacturers and medical device companies. Key safety features include: OVP (Overvoltage Protection) OCP (Overcurrent Protection) SCP (Short‑Circuit Protection) Our lineup includes models compliant with IEC62368‑1, IEC60601‑1, IEC61558‑1, and IEC60335‑1, ensuring global‑standard reliability. We support OEM/ODM production, as well as custom‑designed AC adapters tailored to your specifications. From in‑stock items with same‑day shipping to large‑volume manufacturing, we provide full end‑to‑end support. See Our Power Solutions Firsthand at CEATEC 2026. This exhibition is the perfect opportunity to evaluate our AC adapters and switching power supplies in person. We look forward to welcoming you at CEATEC 2026, Makuhari Messe.
18mm square, thin type - high static pressure! A blower fan that achieves both localized cooling and cost reduction.
- Fan motor
- fan
Non-contact, high-precision detection of turbine vibration and displacement. Supports stable operation.
- Sensors
- Liquid level control/level switch
Achieve high-speed matching with a unique matching algorithm! High-speed, high-precision EH-type automatic matcher. Available in a maximum 6kW specification with high power durability! Made in Japan f...
- High frequency/microwave parts
Equipped with TEMP alarm function! EH stub-type manual matcher compatible with up to 6kW!
- High frequency/microwave parts
The ideal form of motor rotation detection using resolver signals!
- Converters and Transducers