List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

1396~1440 item / All 4987 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.

  • Other machine tools

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Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.

The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.

If it's about mold mirror polishing, leave it to us.

  • Wafer processing/polishing equipment

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It is possible to install light and power supply together.

  • LAN/Optical cable
  • Other semiconductor manufacturing equipment

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The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.

  • Bonding Equipment

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Vibration is not transmitted to the hand, and safety is further enhanced with high efficiency from circuit optimization and heat protection features!

  • Wafer processing/polishing equipment
  • Ultrasonic Oscillator

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From badge processing in small baskets to deburring of large parts, we manufacture a variety of automatic machines!

  • Wafer processing/polishing equipment

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A lineup of polishing equipment that can automatically perform everything from micro deburring to mirror polishing!

  • Wafer processing/polishing equipment

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We will make it possible to regrind tools with small diameters that were difficult to regrind!

  • Wafer processing/polishing equipment

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Comprehensive proposals for coatings that are not limited by membrane types or methods!

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  • Capacitor
  • Other semiconductor manufacturing equipment

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The high-quality shine polished by artisans! The elevator belt has been widened and the spray volume has been doubled.

  • Wafer processing/polishing equipment

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Dicing frame sizes 200mm and 300mm. Takt time and transport time are 180 seconds for 13 pieces or less.

  • Other semiconductor manufacturing equipment

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An arc spraying device boasting high productivity, simplicity, and reliability!

  • Other semiconductor manufacturing equipment

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Suitable for thermal spraying and fused coatings! Certain types of plastics can also be thermally sprayed, allowing for economical coating production.

  • Other semiconductor manufacturing equipment

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It is possible to stop production in conjunction with external automatic devices! PC control with distributed I/O.

  • Other semiconductor manufacturing equipment

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Highly unique compact design! The interface is equipped with an Intel Dual Atom processor!

  • Other semiconductor manufacturing equipment

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Equipped with an Intel Dual Atom Processor! It excels in operability, integration, and communication.

  • Other semiconductor manufacturing equipment

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Easy to handle! Various types of plastic materials can be sprayed, and yield rates are improved!

  • Other semiconductor manufacturing equipment

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We have delivered many dust collection devices ranging from small ones with a processing air volume of about 50 m³/min to those exceeding 300 m³/min!

  • Other semiconductor manufacturing equipment

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Easy setting of the thermal spray current! Using the patented "coaxial drive" system for metallization!

  • Other semiconductor manufacturing equipment

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A high-purity coating enhances the corrosion resistance, wear resistance, and impact resistance of metal components!

  • Other semiconductor manufacturing equipment

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Compact and easy to operate! Achieves high adhesion and a low porosity film.

  • Other semiconductor manufacturing equipment

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Ideal for use in the configuration of long supply packages! Provides a fast spraying speed.

  • Other semiconductor manufacturing equipment

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It is possible to spray molybdenum from a soft bonding film to a very hard wear-resistant film!

  • Other semiconductor manufacturing equipment

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Coating on parts is possible! This extension is often used for complex shapes.

  • Other semiconductor manufacturing equipment

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Adopting all the features of the conventional plasma and HVOF equipment's concise control and operator interface!

  • Other semiconductor manufacturing equipment

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Corrosion-resistant coating: Save time and costs! Flame spraying equipment using oxygen and propane as fuel.

  • Other semiconductor manufacturing equipment

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Introducing examples of stainless steel machining. We accommodate various parts processing across industries, not limited to machining, including turning, sheet metal work, and welding.

  • Processing Contract
  • Other machine elements
  • Semiconductor inspection/test equipment

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Multi-Wafer Handling Die Bonder (Auto)

  • Bonding Equipment

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Eagle AERO is a high-throughput wire bonding device.

  • Bonding Equipment

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CoS (Chip on Submount) is a high-precision die/flip chip bonder.

  • Bonding Equipment

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ICA1205 is a multi-laser dicing device that employs a multi-beam structure.

  • Other semiconductor manufacturing equipment

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It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

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  • Bonding Equipment

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AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

  • Bonding Equipment

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Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

  • Bonding Equipment

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We will introduce hand clean rolls made of silicone-based and non-silicone-based materials.

  • Other cleaning tools
  • Special labels, etc.
  • Evaporation Equipment

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Supports work widths of 255, 350, 450, 550, 600, and 750 mm!

  • Sputtering Equipment
  • Food Packaging Machinery
  • Beverage Production Equipment

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The CMX series is great news for those who had given up on web cleaners due to space constraints.

  • Coater
  • Vacuum Packaging Machine
  • Processing Contract

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Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.

  • Sputtering Equipment
  • Bag making machine/slitter
  • Special labels, etc.

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Supports work widths from 300 to 1500 mm! Single-sided and double-sided narrow applications.

  • Coater
  • Bag making machine/slitter
  • Processing Contract

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To customers considering wide-width equipment for roll-to-roll production lines.

  • Bag making machine/slitter
  • Injection Molding Machine
  • Semiconductor inspection/test equipment

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High quality low cost colloidal silica

  • Coating Agent
  • Wafer processing/polishing equipment

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To customers considering ultra-wide equipment for roll-to-roll production lines.

  • Evaporation Equipment
  • Extrusion Machine
  • Food Packaging Machinery

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The ULT roll-to-roll web cleaner device stably removes dust even at a converting production line speed of 300m/min.

  • Sputtering Equipment
  • Bag making machine/slitter
  • Food Packaging Machinery

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"High-precision microfabrication" is a new method that achieves a balanced total of processing accuracy, productivity, compatible materials, and cost!

  • Wafer processing/polishing equipment

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Excellent burr removal performance! It cleansly removes small gaps and burrs.

  • Wafer processing/polishing equipment

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Advanced technologies that have been uniquely developed to support the industries of this country.

  • Other semiconductor manufacturing equipment

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