List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
4456～4500 item / All 4975 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
Introduction to optimal circuit board design technologies for EMC/EMI, RF, and high-frequency applications.
- Other industrial robots
- Semiconductor inspection/test equipment
- power supply
Three times the brightness. Achieving both compactness and high luminosity!
- Visual Inspection Equipment
- Bonding Equipment
- Lighting for image processing
Easy to install! Wireless amplifier that does not require conversion cables or connection to a power source.
- Other semiconductor manufacturing equipment
High-performance limiting amplifier for sound collection
- Other semiconductor manufacturing equipment
We respond to a wide range of needs with our unique application technology, from standard technology products to one-of-a-kind items.
- Other machine tools
- Wafer processing/polishing equipment
- Other processing machines
We perform deburring processing that meets specifications using servo press molds and laser processing.
- Other semiconductor manufacturing equipment
High-precision positioning laser marking device
- Other semiconductor manufacturing equipment
We undertake precision processing of a wide variety of resins.
- Semiconductor inspection/test equipment
- Other machine elements
For groove inspection! A groove inspection device with an enhanced user interface for improved operability.
- Other semiconductor manufacturing equipment
Achieving a size almost the same as 5t! Ideal for precision press processing, deep drawing processing, and Thomson processing.
- Other machine tools
- Other semiconductor manufacturing equipment
High rigidity general-purpose servo press machine ideal for precision press processing, deep drawing processing, and Thomson processing.
- Other machine tools
- Other semiconductor manufacturing equipment
First, we will focus on the essential work and inspection items from the process and consider their introduction.
- Assembly Machine
- Other semiconductor manufacturing equipment
- Image Processing Board
Easy operation, high precision measurement! Inexpensive and user-friendly semiconductor parameter measurement software for beginners.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
- others
CVD coating equipment that can be used without restrictions on any shape of item.
- CVD Equipment
Preheating for soldering, resin curing, drying after cleaning, and other non-contact heating processes! Can be used up to 250°C.
- Other semiconductor manufacturing equipment
- Other heaters
Capable of supporting various applications such as heating processes and temperature evaluation! Maximum 400℃.
- Other heaters
- Heating device
- Bonding Equipment
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
- Other heaters
- Heating device
- Bonding Equipment
Measurement / Control / Measurement / Design and production of mechatronics
- Semiconductor inspection/test equipment
- Distance measuring device
- Optical Measuring Instruments
Currently, our company handles products from the former Kyodo Electric, such as counters and timers.
If you have any issues with after-sales service, please feel free to contact us; we are looking forward to your inquiries.
The transfer from the wafer maker's carrier to the process carrier can be easily done manually.
- Other semiconductor manufacturing equipment
We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
- Bonding Equipment
- Contract manufacturing
Non-contact 3D surface shape measurement system
- Semiconductor inspection/test equipment
Nanopulse laser irradiation analysis device
- Semiconductor inspection/test equipment
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
- Bonding Equipment
- Other semiconductor manufacturing equipment
Flash Memory Cycling Tester
- Tester
- Semiconductor inspection/test equipment
High-performance flip chip bonder for multi-variety cell production lines.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
- Bonding Equipment
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production purposes
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Elimination of coating unevenness and nozzle clogging with a unique nozzle.
- spray
- Circuit board processing machine
- Other semiconductor manufacturing equipment
IC bonding device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production use.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
LCD substrate terminal cleaning device
- Other semiconductor manufacturing equipment
- Surface treatment contract service
High-density plasma is generated over a large area by a unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Molding Equipment
- Circuit board processing machine
- Plasma surface treatment equipment
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High Power LED Aging Tester
- Semiconductor inspection/test equipment
- Optical Measuring Instruments
- Contract measurement
Implementation Solution Service
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Notice of Participation in the 22nd Fine Tech Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions
Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 22nd Fine Tech Japan, which will be held at Tokyo Big Sight from April 11 (Wednesday) to April 13 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (CO2 reduction) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, combining low capital investment with low running costs, which is its greatest economic advantage. On the day of the event, we will conduct a demonstration using the compact tabletop MyPL-Auto150, allowing you to experience actual large-area plasma irradiation. We sincerely look forward to your visit. 【Contact Information for Inquiries】 Well, Inc. Packaging Solutions Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-plasma.jp/
Real-time monitoring system for semiconductor packaging process anomalies
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Dispenser & UV irradiation device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Ultrasonic flip chip bonder
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Binary code signal input MP3 127ch audio playback board
- Other semiconductor manufacturing equipment
It is a 16-channel contact control type board compliant with RoHS.
- Other semiconductor manufacturing equipment
The sound quality achieves that of a music CD!!
- Other semiconductor manufacturing equipment
It is compatible with recent wireless devices equipped with modular plugs (condenser microphones).
- Other semiconductor manufacturing equipment
High-quality stereo audio playback board
- Other semiconductor manufacturing equipment
High-performance limiting amplifier for sound collection
- Other semiconductor manufacturing equipment