List of Semiconductors and ICs products
- classification:Semiconductors and ICs
766~810 item / All 4837 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
A device that changes the "quality" of circulating water and removes scale by performing special electrolysis on the circulating water without using chemical agents.
- Other semiconductors
High-performance aluminum structural materials that meet all the needs of FA, from LCD and semiconductor equipment to various industrial machinery.
- Other semiconductors
High heat resistance: SX-200 can be used continuously at 400°C! Radiation resistance: over 109 RAD.
- Other semiconductors
Further pursuit of lightweight and compact design. The inner diameter of the tube ranges from φ2.5 to φ250, allowing for a wide variety of uses from simple applications to more advanced ones.
- Other semiconductors
Equipped with a slow start, slow stop mechanism, speed controller, digital timer minimizer, and a linkage system for automatic spraying devices, etc.
- Other semiconductors
We guarantee consistently stable wraps and promise a magnificent mirror finish.
- Other semiconductors
Extremely uniform with minimal lot variation.
- Other semiconductors
It is a resin that can be cured in a short time by exposing it to ultraviolet light with a wavelength of 200 to 400 nm.
- Other semiconductors
PEEK is a thermoplastic super heat-resistant resin that combines excellent mechanical properties and functionality.
- Other semiconductors
Excellent corrosion resistance (e.g., hundreds of times that of stainless steel in the case of concentrated hydrochloric acid)
- Other semiconductors
It is an abrasive with strong crushing strength and thermal stability.
- Other semiconductors
A lineup of 5 types of grain sizes.
- Other semiconductors
As of April 1, 2016, the old product name YUPIMORE(R) has been changed to SEPLAS SA.
- Other semiconductors
We have assembled equipment that is strong in the analysis of organic materials such as resin and carbon composites.
- diode
- Contract measurement
- Composite Materials
Announcement of the Start of Non-Destructive Testing Services from April 2018
On April 2, 2018, MST will introduce the latest processing and analysis equipment and begin offering non-destructive analysis services. We will provide analysis services across a wide range of fields, including product development and quality control in electronic devices, pharmaceuticals, and food. Non-destructive analysis is a technology that visualizes the internal condition of a product without destroying it. With the introduction of the latest processing and analysis equipment, MST will now be able to conduct non-destructive analysis. We will offer analysis services on a contract basis.
GC/MS: Gas Chromatography-Mass Spectrometry
- Contract Analysis
- Memory
AFM: Atomic Force Microscopy Method
- Contract Analysis
- Wafer
You can investigate the changes in degassing intensity while maintaining the temperature.
- Contract Analysis
- Memory
The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).
- Contract Analysis
- Transistor
The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.
- Contract Analysis
- magnet
- Memory
Microscopic structural analysis of amorphous films is possible through simulation.
- Contract Analysis
- Memory
It is possible to confirm the stress distribution in the sample cross-section.
- Contract Analysis
- Wafer
It is possible to evaluate trace metals in ppm orders.
- Contract Analysis
- Ceramics
- Wafer
Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.
- Contract Analysis
- Transistor
- Power storage device
Non-destructive three-dimensional observation of the internal structure of a discrete package.
- Contract Analysis
- Other semiconductors
Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.
- Contract Analysis
- Other semiconductors
Evaluation of microscopic atomic structures is possible through computational simulation.
- Contract Analysis
- Other semiconductors
Reverse engineering of DRAM on the product's internal substrate.
- Contract Analysis
- Memory
It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.
- Contract Analysis
- Memory
It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.
- Contract measurement
- Transistor
- Memory
Simultaneous measurement of inorganic and organic components in minute specific areas.
- Contract measurement
- Wafer
- Memory
We evaluate abnormalities inside the device non-destructively.
- Contract Analysis
- Other electronic parts
- Transistor
Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.
- Wafer
- Contract measurement
- Other semiconductors
Shape observation and simple quantitative analysis using SEM-EDX.
- Contract Inspection
- Wafer
- Other semiconductor manufacturing equipment
It is effective to differentiate between the two methods depending on the surface structure of interest.
- Contract Analysis
- Memory
High-sensitivity analysis of various solutions, such as pure water and wafer cleaning liquids, is possible.
- Contract Analysis
- Wafer
- Water quality testing
It is possible to evaluate the competitive adsorption of multiple molecules using the focus parameters for film formation (temperature, pressure).
- Contract Analysis
- Other electronic parts
- Memory
From semiconductor and LCD manufacturing equipment parts to nursing and welfare equipment parts. MINWA delivers high-precision and high-quality machining.
- Other semiconductors
- LCD display
- Other machine elements
The introduction of the laminated substrate reduces the degradation of the forward characteristics of the body diode!
- diode
The encapsulating materials for advanced semiconductor packages require various characteristics such as low stress, moisture resistance, and high reliability. Guidelines for the design and evaluation ...
- Other semiconductors
- Engineering Plastics
- Technical Seminar
A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...
- Other semiconductor manufacturing equipment
- Other semiconductors
- Technical Seminar
Achieve high current while minimizing losses during implementation with Power PKG (HSOP8)!
- Transistor
Liquid hazardous materials can also be safely transported with all-fiber solutions.
- Wafer
- Resist Device
- Photomask
For thermal management of medium-sized devices. You can specify the ideal length in 1mm increments, without being constrained by the fixed sizes in the catalog, to match the enclosure space.
- Other semiconductors