List of Semiconductors and ICs products
- classification：Semiconductors and ICs
361～405 item / All 4856 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
A wide range of products including ingots and 4-inch, 6-inch, and 8-inch wafers! Leave the procurement of high-quality, low-cost SiC wafers to us.
- Wafer
Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W215mm x H76mm
- Other semiconductors
Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W165mm x H84mm
- Other semiconductors
Silicone-based materials are not used, and electronic components (sensors) and electronic substrates that are susceptible to outgassing are thoroughly protected under a chemical atmosphere.
- Other semiconductors
It has a slew rate of over 200 kV/μs and can also be used for insulation testing!
- switch
- Other semiconductors
It is the 'Smart LCDC', an easy-to-understand and easy-to-use LCD controller that allows LCD display via RS-232C.
- Other semiconductors
It is an easy-to-understand and easy-to-use LCD controller 'Smart LCDC' that allows LCD display via RS-232C.
- Other semiconductors
Sales of the new LCD controller IC for WQVGA LCD Smart LCDC have begun.
We have started selling the new LCD controller IC "KS-WQCT-I1" compatible with the "Smart LCDC" series WQVGA LCD. 【Features of KS-WQCT-I1】 〇 The command system is fundamentally the same as that of the WVGA LCD controller ICs "KS-WVCT-I1" and "KS-WVCT-I2," allowing for a smooth transition from existing systems. 〇 Compared to the conventional WQVGA LCD controller IC "KS-430CT-I2," the drawing speed has significantly increased. 【Compatible LCDs】 4.3-inch WQVGA LCD → "S043HWQ50EG-DR12" (manufactured by CDTech) 5-inch WQVGA LCD → "AWY-480272T50P05" (manufactured by Maihai)
It is a "development tool" that allows you to master the basics of LCD and drawing methods in a short time.
- Other semiconductors
We always have over 1,000 types of SOI wafers in stock! We accept orders for stock SOI wafers starting from one piece.
- Other semiconductors
Round pin fin heat sink with large size and high heat dissipation performance.
- Other semiconductors
Thin design high thermal conductivity round pin fin heat sink compatible with forced air cooling.
- Other semiconductors
Φ50 round pin fin heat sink that exhibits high heat dissipation through forced air cooling.
- Other semiconductors
High thermal dissipation round pin fin heat sink ideal for forced air cooling of small machinery.
- Other semiconductors
45mm diameter x 30mm height round pin fin heat sink (Al99.5)
- Other semiconductors
Due to domestic supply shortages! Flexible response for PEI and PAI machining from prototype to mass production with direct overseas sales. On-site measurements without drawings are also acceptable!
- Semiconductors and ICs
- Engineering Plastics
- Wafer
2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!
- Technical and Reference Books
- Other semiconductors
11/5 Webinar: Basics of Semiconductor Packaging and Quality Control
■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors
Leave it to us for all kinds of test pattern wafers for 3D NAND flash memory.
- Wafer
By combining a hollow heat sink with dimensions of 92mm in width, 93mm in height, and 150mm in length with a DC 24V axial fan, efficient heat dissipation is achieved.
- Other semiconductors
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
- Analytical Equipment and Devices
- Wafer
- Semiconductor inspection/test equipment
A systematic explanation from the basics of semiconductor backend processes and packaging technology to 2.5D/3D packaging and chiplet technology.
- Other semiconductors
- Other semiconductor manufacturing equipment
- Technical Seminar
From chiplets and CoWoS to optoelectronic integration. A systematic explanation of semiconductor packaging technology from the basics to the latest trends.
- Other semiconductors
- Other semiconductor manufacturing equipment
- Technical Seminar
Lightweight and low-profile aluminum heat sink (W8mm x H6mm x L10mm) considering the load on devices and circuit boards.
- Other semiconductors
Round LED heat sink with a diameter of 45.7mm and a height of 16.51mm.
- Other semiconductors
It is a surface resistance value of less than 1×12Ω!
- Memory
- LCD display
- Wafer
Analytical methods essential for the processes and quality control in semiconductor manufacturing.
- Wafer
- Semiconductor inspection/test equipment
- Semiconductors and ICs