List of Technical Seminar products
- classification：Technical Seminar
46～90 item / All 2187 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
Create drawings with online tools! The 5th KTR Japan Web Seminar will be held.
- Technical Seminar
[7th Web Seminar] ROTEX/ROTEX GS Drawing Creation Master Seminar
We are pleased to announce the 7th KTR Japan Web Seminar "ROTEX/ROTEX GS Drawing Creation Master Seminar." You will learn the basics of flexible jaw couplings and how to create drawings for ROTEX/ROTEX GS. 【Seminar Content】 ■ Basic structure of ROTEX/ROTEX GS ■ Understanding product model types and hub types ■ Explanation of the operation flow of the drawing creation tool & drawing creation demo We sincerely look forward to your participation!
![[Technical Seminar] Thermal Managem...](https://image.mono.ipros.com/public/product/image/2008760/IPROS4609906218942799944.png?w=280&h=280){kind=small}
Heat dissipation approach from both circuit and mechanism perspectives
- Technical Seminar
![[Technical Seminar] Design of Batte...](https://image.mono.ipros.com/public/product/image/2008760/IPROS6520126623033648843.png?w=280&h=280){kind=small}
Teaching a design approach that balances the safety and high performance of battery packs.
- Technical Seminar
![[Technical Seminar] Easy Drawing Te...](https://image.mono.ipros.com/public/product/image/2008760/IPROS6961756449083963022.png?w=280&h=280){kind=small}
Strategies for Dimension Tolerances to Accurately Convey Design Intent!
- Technical Seminar
Solving issues such as 'missing signs of abnormalities' and 'being unable to identify the cause when problems occur'!
- Technical Seminar
- Statistical analysis
- Other analysis software
![[Technical Seminar] Shape Recogniti...](https://image.mono.ipros.com/public/product/image/2008760/IPROS12085393526849060916.png?w=280&h=280){kind=small}
The First Step to Learning Drawings
- Technical Seminar
Clarifying the reaction mechanism through atomic and molecular level analysis of the catalyst surface. Learning about the enhancement of catalyst performance and rational design through kinetics analy...
- Technical Seminar
- Chemicals
- Scanning Tunneling Microscope
![[Technical Seminar] Fluid Mechanics...](https://image.mono.ipros.com/public/product/image/2008760/IPROS16879003999889682857.png?w=280&h=280){kind=small}
(Machine Engineering for Working Professionals 2)
- Technical Seminar
![[Technical Seminar] Practical Desig...](https://image.mono.ipros.com/public/product/image/2008760/IPROS12411303871046198181.png?w=280&h=280){kind=small}
Circuit Design and Compliance Assessment
- Technical Seminar
![[Technical Seminar] Latest Trends i...](https://image.mono.ipros.com/public/product/image/2008760/IPROS16902968150901207926.png?w=280&h=280){kind=small}
Industry trends, material technology for dry electrodes, and dispersion, rolling, and transport process technologies.
- Technical Seminar
A course that not only focuses on calculation-centered exercises like those learned in school but also provides hints for improving problem-solving skills for technical issues that engineers are likel...
- Technical Seminar
Explanation of Japan's Major Regulations Along the Chemical Substance Life Cycle
- Technical Seminar
![[Technical Seminar] Tips for Genera...](https://image.mono.ipros.com/public/product/image/2008760/IPROS9393994976384912064.png?w=280&h=280){kind=small}
- Practical Methods for Information Analysis and Future Forecasting -
- Technical Seminar
To help you learn more about robots! Kyouji will assist you.
- Technical Seminar
![[Technical Seminar] Spotting on Sit...](https://image.mono.ipros.com/public/product/image/2008760/IPROS11623555460272675583.png?w=280&h=280){kind=small}
Explanation of key points from preparation to on-site investigation in internal audits, self-inspections, and supplier audits.
- Technical Seminar
A systematic explanation from the fundamentals of computational science simulations that lead to successful MI to practical materials design.
- Software (middle, driver, security, etc.)
- Material Evaluation Test
- Technical Seminar
11/13 Web Seminar Computational Science Simulation Technology
■Event Details Date and Time: November 13, 2026 (Friday) 10:30 AM - 4:30 PM Participation Fee: 57,200 yen (tax included, including materials preparation fee) *Materials will be distributed in booklet form *Newsletter subscribers: 51,700 yen (tax included) Instructor: Dr. Momoshi Kubo (Director and Professor, Center for Computational Materials Science, Tohoku University Institute for Materials Research) Lecture Method: Live seminar via Zoom This seminar will comprehensively explain the corporate utilization of computational science simulations, collaboration with materials informatics, various simulation methods, and practical material design examples for semiconductors, batteries, polymers, and more.
Explaining semiconductor encapsulation materials in the AI era. Learning about the latest trends in low dielectric, high thermal conductivity, and optoelectronic integration technologies.
- Other semiconductors
- plastic
- Technical Seminar
11/11 Webinar on Sealing Material Technology for Data Centers
■Title: "Technological Trends in Packaging for Data Centers and Design/Evaluation Techniques for Encapsulation Materials" This presentation will explain the packaging technologies and encapsulation materials that support semiconductor devices for data centers, which continue to evolve with the proliferation of AI. We will organize the trends of the latest packaging technologies, such as chiplets and wafer-level packaging, while systematically learning the design requirements and evaluation techniques for encapsulation materials, including high purity, moisture resistance, low stress, low dielectric loss, and high thermal conductivity. Additionally, we will introduce the latest trends in optoelectronic integration technologies that support next-generation data centers. - Technical trends in packaging for data centers - Design techniques for semiconductor encapsulation materials - Evaluation techniques for semiconductor encapsulation materials - Wafer-level packaging and chiplet technology - Latest trends in optoelectronic integration technology - Designers of semiconductor encapsulation materials - Engineers using semiconductor encapsulation materials - Developers of epoxy resins and hardeners - R&D personnel from semiconductor material manufacturers
Water-repellent and oil-repellent technologies in the era of PFAS regulation. An explanation of the fundamentals, materials, and application trends of non-fluorinated coatings.
- Coating Agent
- Food/beverage functional materials
- Technical Seminar
11/10 Webinar Non-fluorinated Water and Oil Repellent Coating
■Title: "Fundamentals and Applications of Non-Fluorinated Water-Repellent and Oil-Repellent Coatings, Development Trends" In light of the strengthened PFAS regulations, this presentation will clearly explain non-fluorinated water-repellent and oil-repellent coatings, covering the basics of water-repellent and oil-repellent technologies, the trends in PFAS regulations in various countries, and the latest developments in alternative technologies. It will also introduce the characteristics and application examples of various materials such as silicone-based, urethane-based, polyolefin-based, and hybrid materials, providing knowledge that will be useful for product development and material selection. - Basic knowledge of water repellency and oil repellency - Fundamentals of fluorinated water-repellent and oil-repellent coatings - Overview of PFAS regulations in Europe, the United States, and Japan - Technical trends in non-fluorinated water-repellent and oil-repellent coatings - Characteristics and application examples of various non-fluorinated materials - Planning and development personnel considering the adoption of water-repellent and oil-repellent coatings - Engineers involved in products utilizing coatings - Personnel considering fluorinated alternative materials - Young engineers and students who want to learn about water-repellent and oil-repellent technologies
An overview of advanced packaging technologies from 2.5D/3D chiplets to thermal management, reliability evaluation, and PFAS compliance.
- Other semiconductor manufacturing equipment
- Other semiconductors
- Technical Seminar
11/10 Webinar Advanced Semiconductor Packaging Technology
■Title: "The Complete Picture of Advanced Semiconductor Packaging Technology - From 2.5D/3D and Chiplets to Thermal and Power Solutions, Reliability Evaluation, and PFAS Compliance -" ――A systematic explanation of advanced packaging technologies that support the evolution of AI semiconductors. In addition to the latest technological trends in 2.5D/3D packaging, chiplets, CoWoS, TSV, and glass core substrates, you will learn broadly about manufacturing processes, yield improvement, failure analysis, reliability evaluation, PFAS regulatory compliance, and thermal and power design. Practical case studies and evaluation analysis techniques directly related to work will also be explained in detail. - Basics of semiconductor packaging technology and the evolution of trends - Latest trends in 2.5D/3D and chiplet technology - Reliability testing and failure analysis techniques - Key points for yield improvement - PFAS regulatory compliance and sustainable materials - Thermal and power design technologies for advanced packaging aimed at AI - Engineers and researchers from chemical, electronics, electrical, and automotive manufacturers - Personnel involved in semiconductor backend processes and assembly technologies - Personnel involved in materials and equipment development - Those who want to systematically learn about advanced packaging technologies
![[December Seminar] Learning Project...](https://image.mono.ipros.com/public/product/image/312172/IPROS12066340092267565142.jpg?w=280&h=280){kind=small}
- A New Approach to Addressing Project Delays and Cost Overruns - ~Improving Productivity through AWP and PMDX and Its Utilization in Japanese Companies~
- Technical Seminar
- Reading the massive investments flowing into power, liquid cooling, construction, and components from the latest trends and cases in the United States -
- Technical Seminar
![[Technical Seminar] Troubleshooting...](https://image.mono.ipros.com/public/product/image/2008760/IPROS7984187600069790880.png?w=280&h=280){kind=small}
Basics and know-how for using a bioreactor.
- Technical Seminar
![[Technical Seminar] Key Points of A...](https://image.mono.ipros.com/public/product/image/2008760/IPROS10859540841040092155.png?w=280&h=280){kind=small}
Focused on strengthening chemical substance management.
- Technical Seminar