List of Other semiconductor manufacturing equipment products

  • classification:Other semiconductor manufacturing equipment

226~270 item / All 1997 items

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Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!

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  • Glass

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Introducing noise control tubes, conductive gaskets, and more! We also offer wiring protection products against chemicals, heat, and wear.

  • Other semiconductor manufacturing equipment
  • Wiring materials

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Automatically distill 1ppb grade hydrochloric acid, hydrofluoric acid, and nitric acid to 10ppt grade, reducing the procurement costs of high-purity acids.

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  • Other semiconductor manufacturing equipment
  • Distillation Apparatus

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We provide fully customized production equipment based on your requests.

  • Other semiconductor manufacturing equipment

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Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!

  • Other semiconductors
  • Other semiconductor manufacturing equipment
  • Semiconductor inspection/test equipment

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Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17

■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, more sophisticated material design for encapsulants is required than ever before. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulants. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials

Sintering device equipped with a patented micro punch press. Capable of sintering dies of different heights and substrates of various shapes.

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  • Other semiconductor manufacturing equipment

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Responding promptly to small lot production of various types, from resin cases and covers in various industries to precision machining and assembly!

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  • Processing Contract
  • Rubber
  • Other semiconductor manufacturing equipment

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Low-loss filter using fiber elements with proprietary technology from Mott Corporation.

  • Other semiconductor manufacturing equipment

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The best filter for the vaporization line of liquid sauce.

  • Other semiconductor manufacturing equipment

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High-performance, easy-to-use filter capable of handling inert gases and special gases.

  • Other semiconductor manufacturing equipment

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Flow controller using porous metal technology (for high purity).

  • Other semiconductor manufacturing equipment

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Flow controller using porous metal technology (for general industry).

  • Other semiconductor manufacturing equipment

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Sintered metal sprayer.

  • Other semiconductor manufacturing equipment

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Providing high-quality sintered discs made from various materials.

  • Other semiconductor manufacturing equipment

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High-performance inline filters for the semiconductor industry and various high-tech industries.

  • Other semiconductor manufacturing equipment

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Low-cost, low-pressure loss inline filter using nickel elements.

  • Other semiconductor manufacturing equipment

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Filter for accumulation gas boxes

  • Other semiconductor manufacturing equipment

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Low-cost inline filter using fiber elements

  • Other semiconductor manufacturing equipment

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Demonstrates high particle removal performance despite large flow rates.

  • Other semiconductor manufacturing equipment

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Prevention of particle disturbance during atmospheric recovery of the vacuum chamber.

  • Other semiconductor manufacturing equipment

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The sprayer part can be quickly replaced.

  • Other semiconductor manufacturing equipment

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Sintered metal filters suitable for low-cost solvent suction applications.

  • Other semiconductor manufacturing equipment

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We provide sintered metal products tailored to your needs.

  • Other semiconductor manufacturing equipment

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"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.

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  • Other processing machines
  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.

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  • Other processing machines
  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.

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  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Semiconductor inspection/test equipment

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We relentlessly pursue customer satisfaction and technical expertise, contributing to society. We have extensive experience in contract manufacturing for OEMs and prototype machines.

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  • CVD Equipment
  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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Using conductive PP! Suitable for prototypes and small-scale transportation, shipping, and storage.

  • Racks and Cases
  • Other semiconductor manufacturing equipment
  • cabinet

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Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.

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  • Other semiconductor manufacturing equipment

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We will be exhibiting at the Kyoto Pulse Plaza, which will be held in Kyoto from February 18, 2026.

This time, Orte Corporation will exhibit at "Kyoto Pulse Plaza" again this year, following our participation in last year's semiconductor exhibition. The latest cutting-edge collets that can only be seen here will be on display! Our specialists in chip transport collets will unveil the latest lineup that solves on-site "troubles"! Be amazed by our rubber collet that achieves a contact width of less than 0.1mm! Of course, we have rubber collets that address ionizer countermeasures, as well as patented holder mechanisms that perfectly accommodate high-aspect and large chips. You will surely find yourself thinking, "This is the collet I wanted!"... We plan to showcase many actual samples! You can actually hold, touch, and experience the performance on the spot. Please come and visit our booth! We are confident that you will definitely think, "I'm glad I came to see this!" 【Exhibition Contents】 - Pickup collets (rubber/plastic/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays)

High-performance, cost-effective RF/DC magnetron sputtering device for research and development.

  • Other semiconductor manufacturing equipment
  • Sputtering Equipment

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4-Yen Multi-Sputtering Device 【MiniLab-S060】

4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.

The micro heater can be easily wrapped around pipes and can be used even in a vacuum.

  • Other semiconductor manufacturing equipment
  • Food Packaging Machinery

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Various shapes can be produced according to the shape of the heated object. We can manufacture even from just one piece!

  • Other semiconductor manufacturing equipment
  • Other processing machines

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Support yield improvement through pressure management!

  • Other semiconductor manufacturing equipment
  • Other measurement, recording and measuring instruments

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Support yield improvement through pressure management!

  • Other semiconductor manufacturing equipment
  • Other measurement, recording and measuring instruments

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The layout and operability of the NS series remain unchanged, achieving stable low-temperature measurements.

  • Tester
  • Other semiconductor manufacturing equipment

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It is a top-grade fluid transfer solution that achieves visibility and flexibility.

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  • Piping Materials
  • hose
  • Other semiconductor manufacturing equipment

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Control the specific resistance of ultrapure water to solve electrostatic interference in precision cleaning.

  • Other semiconductor manufacturing equipment

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