List of Wafer products

Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

• air conditioning

It is attracting attention for power LSI, high-brightness LEDs, and high-performance lasers.

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This is a device that supports the automatic transport of large substrates and can be applied from research and development to mass production. We will design it to meet your company's requirements.

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We provide blanket films and patterned wafers for material and device evaluation.

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Superior lubrication and cooling performance, high grinding efficiency, excellent surface treatment quality, better finishing, easy to use.

• Rust Inhibitor
• Grinding Machine
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Ideal for handling and cleaning semiconductor wafers and substrates.

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The world's first cooling water composite treatment agent formulated with "non-chlorine inorganic sterilizing components" developed through Organo's unique manufacturing technology.

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We will handle mass production testing (CP test / FINAL test) and test development (test programs, boards).

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We will handle mass production testing (CP test / FINAL test) and test development (test programs, boards).

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Numerous achievements: Various wafer processing options are available. From bare die shipment to package assembly, you can also choose the shipping method.

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Wafer processing contract service

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We will accommodate various stud bump processing according to your specifications.

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Supports high-difficulty processing of hard materials! Dicing processing of fragile chips like Low-k wafers can be done without damage.

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Utilized in many products around us! An introduction to the manufacturing processes and applications of semiconductors.

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We will be exhibiting at 'SEMICON JAPAN' held at Tokyo Big Sight (East Exhibition Hall) from December 13 (Wednesday) to 15 (Friday), 2023!

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With a commitment to high quality and short delivery times, we will expand our business to meet the diverse needs of our customers!

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• Other semiconductors

Achieving high-aspect-ratio trench pattern wafers with deep etching technology.

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Full cut and step cut compatible with dual spindle! Processing track record for wafer thickness of 725 to 100 μm and chip sizes of 0.5 mm or less!

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In the state of the sheet after dicing, it cannot be picked up by the device, and we want to change to tray specifications; we can accommodate even just with die sorting according to the application!

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Polysilicon, multicrystalline silicon

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Silicon ingot, ingot

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It has the characteristic of small output fluctuations due to temperature, making it possible to expand into various fields! Custom manufacturing is also available.

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Precise cleaning from washing to drying.

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Prevention of damage from shock and vibration!!

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Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car floss. Compared to conventional methods, it reduces the footprint.

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• LCD display
• Fine Ceramics

Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car flows. Compared to conventional methods, it has a smaller footprint.

• Wafer
• LCD display
• Fine Ceramics

Leave the semiconductor silicon wafers to us.

• Processing Contract
• Wafer

The system features modular design! It can accommodate long-term changes according to technology and productivity.

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Low cost and high productivity! With modular design, the equipment can be configured to meet customer requirements.

• Other electronic parts
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The laser head and controller are integrated. There is also a water-cooled model.

• Laser marker
• Wafer
• Secondary Cells/Batteries

A versatile marking device equipped with the latest picosecond and femtosecond lasers.

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• diode
• Laser marker

Proposal for semiconductor manufacturing: We offer cost-effective materials as alternatives to traditional thick epitaxy and inverted epitaxy for IC and MEMS applications.

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Adopts a mechanism that discharges exhaust upward. It picks up and transfers surrounding chips non-contact without blowing them away with the ejected gas.

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• CVD Equipment
• Wafer processing/polishing equipment

Next-generation power semiconductor SiC wafer

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A Bernoulli chuck for non-contact transport of ultra-thin, long workpieces measuring 1.4 mm in width and 55 mm in length.

• Wafer processing/polishing equipment
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• Separation device

We offer custom products such as 100-200mm bonded wafers (SOI, SiSi), dielectric separation, and deep trench etching with a high aspect ratio.

• Wafer

[Demo unit available for loan] This lighting is suitable for inspecting transparent and translucent compound semiconductor wafers, defect inspection on non-transparent silicon wafer surfaces, and scra...

• LED lighting
• Work Light
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Providing epitaxial wafers for various optical semiconductor devices such as semiconductor lasers, VCSELs, PDs, and DBRs.

• Laser Components
• Other optical parts
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2-inch epitaxial wafers of semiconductor lasers and RCLEDs

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• Laser Components

Natural silica is the raw material. A new material that emits terahertz waves, applied in various fields due to its performance.

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Ultra-high vacuum - compatible with pressurized atmospheres! A bonding system equipped with uniform heating and pressurization functions!

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• Other machine elements

193 nm, 213 nm, 244 nm, 257 nm, 266 nm FHG generation semiconductor laser system

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Utilizing its characteristics, it is used in various fields including optical fibers! A detailed introduction to the main types and more.

• Glass
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Introducing products for semiconductors, such as silicon wafers and CZ/FZ ingots!

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• Other semiconductors

We handle various types of membrane-coated wafers. We also accept inquiries regarding specially processed wafers.

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