List of Semiconductor Manufacturing Equipment products

Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

• air conditioning

Silicone sponge with improved heat resistance. Covers a temperature range up to 260°C.

• Other semiconductor manufacturing equipment
• Food Processing Equipment
• Drying Equipment

A larger indoor space than the SMAP-II type! The workspace is more than three times larger, and both rough and finished work can be done with this one machine.

• Wafer processing/polishing equipment

Shortening processing time with overwhelming projection power! Capable of handling large workpieces that other models cannot.

• Wafer processing/polishing equipment

By adopting a pencil-type nozzle, it is possible to precisely process fine details!

• Wafer processing/polishing equipment

Successfully developed a movable nozzle that leverages the characteristics of SMAP media! It accommodates polishing for sizes that cannot be held by hand.

• Wafer processing/polishing equipment

It's an entry-level model, but it has high versatility! It can handle both rough and finished work with just this one machine.

• Wafer processing/polishing equipment

Numerous adoption results worldwide. We propose suitable solutions for automatic plating solution analysis in various electroplating and electroless plating processes, as well as in the Cu damascene p...

• Other semiconductor manufacturing equipment
• Analytical Equipment and Devices

We perform ultra-high precision inner surface polishing processing for nozzle components of injection molding machines!

• Hand polishing and filing
• Wafer processing/polishing equipment
• Processing Contract

A high-speed drawing device compatible with 300x300mm square substrates has been added to the VPG series.

• Other semiconductor manufacturing equipment

If it's about mold mirror polishing, leave it to us.

• Wafer processing/polishing equipment

It is possible to install light and power supply together.

• LAN/Optical cable
• Other semiconductor manufacturing equipment

Vibration is not transmitted to the hand, and safety is further enhanced with high efficiency from circuit optimization and heat protection features!

• Wafer processing/polishing equipment
• Ultrasonic Oscillator

From badge processing in small baskets to deburring of large parts, we manufacture a variety of automatic machines!

• Wafer processing/polishing equipment

A lineup of polishing equipment that can automatically perform everything from micro deburring to mirror polishing!

• Wafer processing/polishing equipment

Comprehensive proposals for coatings that are not limited by membrane types or methods!

• Capacitor
• Other semiconductor manufacturing equipment

The high-quality shine polished by artisans! The elevator belt has been widened and the spray volume has been doubled.

• Wafer processing/polishing equipment

Dicing frame sizes 200mm and 300mm. Takt time and transport time are 180 seconds for 13 pieces or less.

• Other semiconductor manufacturing equipment

An arc spraying device boasting high productivity, simplicity, and reliability!

• Other semiconductor manufacturing equipment

Suitable for thermal spraying and fused coatings! Certain types of plastics can also be thermally sprayed, allowing for economical coating production.

• Other semiconductor manufacturing equipment

It is possible to stop production in conjunction with external automatic devices! PC control with distributed I/O.

• Other semiconductor manufacturing equipment

Highly unique compact design! The interface is equipped with an Intel Dual Atom processor!

• Other semiconductor manufacturing equipment

Equipped with an Intel Dual Atom Processor! It excels in operability, integration, and communication.

• Other semiconductor manufacturing equipment

Easy to handle! Various types of plastic materials can be sprayed, and yield rates are improved!

• Other semiconductor manufacturing equipment

We have delivered many dust collection devices ranging from small ones with a processing air volume of about 50 m³/min to those exceeding 300 m³/min!

• Other semiconductor manufacturing equipment

Easy setting of the thermal spray current! Using the patented "coaxial drive" system for metallization!

• Other semiconductor manufacturing equipment

A high-purity coating enhances the corrosion resistance, wear resistance, and impact resistance of metal components!

• Other semiconductor manufacturing equipment

Compact and easy to operate! Achieves high adhesion and a low porosity film.

• Other semiconductor manufacturing equipment

Ideal for use in the configuration of long supply packages! Provides a fast spraying speed.

• Other semiconductor manufacturing equipment

It is possible to spray molybdenum from a soft bonding film to a very hard wear-resistant film!

• Other semiconductor manufacturing equipment

Coating on parts is possible! This extension is often used for complex shapes.

• Other semiconductor manufacturing equipment

Adopting all the features of the conventional plasma and HVOF equipment's concise control and operator interface!

• Other semiconductor manufacturing equipment

Corrosion-resistant coating: Save time and costs! Flame spraying equipment using oxygen and propane as fuel.

• Other semiconductor manufacturing equipment

Introducing examples of stainless steel machining. We accommodate various parts processing across industries, not limited to machining, including turning, sheet metal work, and welding.

• Processing Contract
• Other machine elements
• Semiconductor inspection/test equipment

Multi-Wafer Handling Die Bonder (Auto)

• Bonding Equipment

Eagle AERO is a high-throughput wire bonding device.

• Bonding Equipment

CoS (Chip on Submount) is a high-precision die/flip chip bonder.

• Bonding Equipment

ICA1205 is a multi-laser dicing device that employs a multi-beam structure.

• Other semiconductor manufacturing equipment

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

• Bonding Equipment

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

• Bonding Equipment

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

• Bonding Equipment

We will introduce hand clean rolls made of silicone-based and non-silicone-based materials.

• Other cleaning tools
• Special labels, etc.
• Evaporation Equipment

Supports work widths of 255, 350, 450, 550, 600, and 750 mm!

• Sputtering Equipment
• Food Packaging Machinery
• Beverage Production Equipment

The CMX series is great news for those who had given up on web cleaners due to space constraints.

• Coater
• Vacuum Packaging Machine
• Processing Contract

Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.

• Sputtering Equipment
• Bag making machine/slitter
• Special labels, etc.