List of 基板 実装/ products
1576～1620 item / All 3719 items
It is a PCB-mounted low to medium pressure sensor using DIP.
- Sensors
- Other electronic parts
- Sensors
For electronic and electrical equipment. FN 410 is a high attenuation 2-stage PCB filter.
- filter
We accept orders from any process style!
- Other electronic parts
- Contract manufacturing
If you have the actual item, it's all good! We contribute to extending the life of equipment through advanced reverse engineering technology.
- Printed Circuit Board
Implement further solutions with space-saving! Achieve maximum versatility and utilization efficiency from valuable floor space.
- Mounter
- Other mounting machines
- Circuit board processing machine
We have a large number of substrate assembly-related equipment! We provide high-quality services that go a step further.
- Circuit board design and manufacturing
- Circuit Board Inspection Equipment
- Other mounting machines
Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.
- Printed Circuit Board
We provide consistent manufacturing of surface mount and discrete component assembly to meet our customers' needs.
- Printed Circuit Board
- Circuit board design and manufacturing
Thinner, lighter, and space-saving compared to board substrates! We offer structural added value through membranes.
- Contract manufacturing
A trading company that handles many manufacturers both domestically and internationally, with manufacturing capabilities that cover procurement to implementation and assembly!
- Other electronic parts
- Soldering Equipment
- others
We will produce at our manufacturing facility, which has accumulated its know-how for over half a century based on established manufacturing techniques and methods.
- Printed Circuit Board
- Contract manufacturing
As a total supporter, Ai Electronic Industry Co., Ltd. provides reliable technology.
- Circuit board design and manufacturing
Can be manufactured according to the specifications of the substrate shape and the splitting machine. It suppresses substrate deflection and prevents misalignment of the splitting trajectory.
- Processing Jig
- Circuit board processing machine
Single-sided board (double-sided non-TH board) completed in as fast as 12 hours!
- Visual Inspection Equipment
- Printed Circuit Board
We have established a reliable production line that is compatible with lead-free standards!
- Control Panel
- Other contract services
We respond to diverse needs.
- Printed Circuit Board
- Other electronic parts
We support our customers with a one-stop service! Leave the development of hardware and software, design and manufacturing of sheet metal and enclosures, and assembly to us.
- Printed Circuit Board
- Circuit board design and manufacturing
- Other electronic parts
Are you looking for space-saving switches for multilayer PCBs? With an ultra-thin thickness of 2 millimeters, high-density mounting is possible!
- switch
We would like to propose a new Pop implementation.
- Printed Circuit Board
- Other semiconductors
- Prototype Services
We accommodate everything from small lots to a wide variety of products!
- Printed Circuit Board
- Circuit board design and manufacturing
Visualize noise characteristics! A new simulator has arrived to make noise countermeasures for printed circuit boards easier!
- Magnetic field analysis/electromagnetic wave analysis
- Software (middle, driver, security, etc.)
- Other embedded systems (software and hardware)
Notice of S-NAP Electromagnetic Field Simulator Seminar on May 11, 2016 (Wednesday)
In this seminar, we will provide a session on "Utilization Techniques of Electromagnetic Field Simulators for Noise Analysis/RF Circuits/Wireless Power Transfer." We sincerely invite you to participate in this opportunity. We look forward to your attendance. 【Seminar Overview】 ○ Date and Time: May 11, 2016 (Wednesday) 14:00–16:45 (Reception starts at 13:30) ○ Venue: BIZ Shinjuku (Shinjuku City Industrial Hall) / Training Room C ○ Instructor: Takahiro Ogawa, President of our company (Doctor of Engineering) ○ Capacity: 15 participants (First-come, first-served basis. Registration will close once capacity is reached.) ○ Seminar Organizer: IMC Co., Ltd. 【Program】 ○ Session 1: 14:00–15:00 "Utilization Methods and Basic Analysis Techniques of Wireless Power Transfer, RF, and Microwave Simulators" ○ Break: 15:00–15:10 ○ Session 2: 15:20–16:20 "Effective Utilization Methods of Electromagnetic Field Simulators in Noise Analysis - Part 2" ○ Q&A: 16:20–16:30
We provide a semiconductor development environment tailored to meet utilization needs!
- Public Testing/Laboratory
Shinano Camera is confident in its adaptability and reliability.
- Circuit board design and manufacturing
- Contract manufacturing
- Other electronic parts
Turning possibilities (ideas) into products (forms)
- Printed Circuit Board
- Circuit board design and manufacturing
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If there is no reference image recognition mark, it also supports alignment in the normal teaching mode.
- Other semiconductor manufacturing equipment
Covers a wide range from 360 to 740 nm in the near ultraviolet region! Uses light-resistant white ink!
- Printed Circuit Board
- Other electronic parts
We provide consistent support from design to manufacturing and delivery.
- EMS
MID enables wiring formation that does not rely on circuit boards or harnesses, contributing to thinner, smaller, and lighter designs through the reduction of component count.
- Other CAD
- Other contract services
TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.
- Chemicals
We will exhibit at the 1st [Kyushu] Semiconductor Industry Exhibition.
Our company will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka Hall B from September 25 (Wednesday) to 26 (Thursday), 2024. At our booth, we will showcase the latest surface treatment chemicals and process technologies for wafers and package substrates, so please stop by. For more details, please check the related link [We will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition].
Impedance control of flexible substrates and UL certification can be achieved with short lead times and the ability to manufacture small quantities.
- others
Easy productization without selecting an axis! Introduction of MEMS gyroscopes for implementation.
- Sensors
Ideal for multilayer structure implementation combined with semiconductor substrates, including MEMS.
- Glass
Notice of Participation in Ceatec Japan 2018
This time, Technisco will be exhibiting at "CEATEC JAPAN 2018," which will be held at Makuhari Messe from October 16, 2018. [Booth Number] Small Package H023, Hall 5 (near the entrance) Electronic Components/Devices Zone *We sincerely look forward to your visit.