[Analysis Case] Thermal Desorption Gas Analysis of Metal (Sn)
TDS analysis of low melting point metals
Sn is used as the main raw material for solder, which is also used in semiconductor manufacturing. The gases in the solder can cause void formation, so it is important to control the amount of encapsulated gas in the solder and its main raw material, Sn. The results of investigating the gases released by heating Sn to a temperature above its melting point using TDS analysis are shown below. By heating the sample above its melting point, it is possible to evaluate the surface-adsorbed components and the components of the encapsulated gas in the sample.
- Company:一般財団法人材料科学技術振興財団 MST
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