Ultra-fine striped plating
Minimizing soaring precious metals
We can minimize the use of precious metals. We are considering creating a nickel barrier.
- Company:信越理研シルコート工場
- Price:Other
Last Updated: Aggregation Period:Jul 30, 2025~Aug 26, 2025
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Jul 30, 2025~Aug 26, 2025
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Jul 30, 2025~Aug 26, 2025
This ranking is based on the number of page views on our site.
826~840 item / All 1246 items
Minimizing soaring precious metals
We can minimize the use of precious metals. We are considering creating a nickel barrier.
~Tin plating with semi-gloss finish considering the subsequent process~
Nickel-plated strips are pressed and used in camera and smartphone-related components.
Chemically extremely stable! Excellent corrosion resistance and electrical conductivity!
"Au/Au alloy plating" is a material for electronic components that is chemically very stable and has excellent corrosion resistance and electrical conductivity. When used as an electrical contact material, a hard Au alloy plating with additives such as Co, Ni, and Fe is employed. Hard Au plating using Fe is used as an environmentally friendly hard Au plating that does not use allergenic substances. 【Features】 ■ Chemically very stable ■ Excellent corrosion resistance ■ Excellent electrical conductivity *For more details, please refer to the PDF document or feel free to contact us.
Optimal for high-temperature lead-free solder materials! Achieved mass production of gold-tin alloy plating, reducing wafer loss costs!
Gold-tin alloy plating shows a eutectic point with a composition of gold 80: tin 20, and a melting point of 280°C. 【Points】 - Gold-tin alloy plating does not expose the wafer to high temperatures during the process, preventing thermal degradation. - It allows for control of film thickness and enables thin film formation (with a proven 33% cost reduction). - The alloy ratio can be changed arbitrarily, resulting in a wide range of coating compositions (with a proven range of Au 70 to 90 wt%). - Plating on fine patterns is possible. - It has good oxidation resistance and solderability, enabling highly reliable bonding. - There are few voids and impurities, and no flux is needed, so cleaning after reflow is unnecessary. We welcome any questions or consultations. Please feel free to contact us.
In the process, it is possible to have a thickness difference in Sn plating (reel to reel)! The amount of tin shavings during insertion and secondary pressing can be significantly reduced!
**Previous Issues** In conventional tin plating, it has been difficult to maximize the characteristics of both the press-fit and soldering areas, and the generation of tin shavings after secondary processing has been a challenge. **Effects** - Plating of varying thicknesses has become possible. - By reducing the thickness of the coating on the press-fit area, we can suppress tin shavings during insertion, while increasing the thickness of the soldering area helps maintain solderability. - When performing secondary processing, exposing the underlying nickel in the bent section significantly reduces the occurrence of tin shavings. - By conducting reflow treatment, we suppress the occurrence of whiskers. Additionally, by performing the treatment at an optimal temperature for the specified coating thickness, we can prevent the formation of wrinkles and rough surfaces in the plating. Please feel free to contact us with any questions, no matter how trivial!
Successfully conducted experiments aboard the NASA Space Shuttle!
Among glossy metals, silver plating is considered to have good reflection across a wide range of wavelengths. However, silver plating tarnishes quickly in the air. To solve this problem, Mitsuya developed high-reflective gold plating. Compared to our conventional gold plating, the reflectivity has improved by 4-6%. High-reflective gold plating is widely used in various applications, such as: - Marking on wafers during semiconductor manufacturing processes - Pulse laser welding - Laser cutting machines Astronaut Koichi Wakata conducted experiments to create alloys using an imaging furnace installed on NASA's Space Shuttle. The reflective mirror of this imaging furnace uses the high-reflective gold plating developed by Mitsuya. This mirror is the most critical component for the imaging furnace.
It is used as low-temperature joining materials and metal seals!
Indium is characterized by its soft material properties, low melting point, good water resistance, and good alkali resistance. Our indium plating comes in two types: inorganic acid bath and organic acid bath. Both are white, matte, with a hardness of Hv5 or lower, and a melting point within the range of 156.6±1℃.
You can impart various plating characteristics without heat treatment!
Titanium is a non-magnetic metal with a specific gravity between that of iron and aluminum, characterized by high strength and light weight. It has excellent corrosion resistance due to the formation of a stable oxide film on its surface, but this oxide film tends to result in a high contact resistance. While it excels in corrosion resistance, it has some weaknesses in wear resistance. 【Features】 - It is possible to apply a coating that adheres well to titanium materials without using heat treatment. - It supports various coatings, not only precious metal plating but also using a nickel base. - By applying copper or nickel plating, it can enhance the electrical conductivity and wear resistance of titanium materials. - Since adhesion can be secured without heat treatment, post-processing using an electric furnace after plating is unnecessary.
From prototype to mass production! We accept plating for various types of wafers!
This is an acidic copper plating used for circuit boards, silicon wafers, etc. (with gloss agent) ■ Platable wafer materials: GaAs, Si, etc. ■ Platable electrode materials: Seed layers of Cu, Au, etc. ■ Mass production wafer sizes: 3 inches, 4 inches ■ Mass production capacity: 1,000 wafers/month ■ Prototype wafer sizes: 3, 4, 8 inches ■ Types of plating: Electrodeposited copper plating, electrolytic and electroless nickel plating, electrolytic and electroless gold plating, electrolytic and electroless palladium plating, electrolytic and electroless tin plating Our achievements: Mounting components for smartphones We will provide proposals that meet your requirements. Please feel free to contact us for any inquiries, no matter how trivial.
It is widely used in the field of optical devices, such as cameras and anti-reflective applications!
This is a black nickel-based alloy plating that is widely used in various fields, including automotive and motorcycle parts, as well as in optical devices such as cameras and anti-reflective applications that dislike light. Our company offers both electrolytic and electroless options. ■ Black Electrolytic Nickel Plating The appearance is a metallic black, and the shade of black varies depending on the material and the gloss of the substrate. The corrosion resistance is not very high, and it does not possess the flexibility typical of regular metals. Typically, black nickel plating is applied over nickel plating. ■ Black Electroless Nickel Plating This process produces a black coating through electroless nickel plating. There are two types: the "deposition type," which deposits the black coating, and the "post-treatment type," which darkens the coating after plating. For more details, please feel free to contact us.
Introducing Mitsuya's recommended joining coatings!
■Gold-Tin Alloy Plating Gold-tin alloy plating, composed of 80% gold and 20% tin eutectic, is the optimal alloy plating for high-temperature lead-free solder materials with a melting point of 280°C. ■Tin-Antimony Alloy Plating Compared to regular tin plating, it excels in preventing tin pest and has superior heat cycle durability. ■Indium Plating Indium has a very soft, dull white appearance and is prone to scratching. Its hardness is below Hv5, and its melting point is 156.6°C. It has also proven effective in preventing contact failure as a joining tool for bundling similar vessels.
Examples of alternative supply for matte gold plating and partial nickel plating on ultra-thin stainless steel foil!
We would like to introduce case studies of problem-solving in alternative supply plating and surface treatment through Mitsuya's plating technology and management system. In the case of Company CC, which was investigating outsourcing due to the abolition of in-house plating processes, many of their products were one-of-a-kind items that strictly prohibited scratches and dents. They evaluated the corrosion resistance, hardness, thickness, and purity of the plating film. Additionally, we have posted examples such as "Glossy Gold Plating" and "Glossy Silver Plating" in the related links below. Please take a look. [Alternative Supply Plating and Surface Treatment] - Matte Gold Plating - Glossy Gold Plating, Glossy Silver Plating - Partial Nickel Plating on Ultra-Thin Stainless Foil - Gold-Tin Alloy Plating *For more details, please refer to the related links or feel free to contact us.
Examples of cost reduction related to nickel plating for wire bonding and gold-tin alloy plating!
We will introduce case studies on solving issues related to plating and surface treatment for cost reduction through Mitsuya's plating technology and management system. In the case of Company A in the automotive sector, we recommended nickel plating for bonding, and as a result of prototype testing, the yield improved to nearly 100%. This enabled hoop processing and contributed to overall cost reduction. Additionally, we have published examples such as "tin-lead alloy plating" and "glossy gold plating (hard gold plating)" in the related links below. Please take a look. [Plating and Surface Treatment Related to Cost Reduction (Partial)] ■ Nickel plating for wire bonding ■ Tin-lead alloy plating ■ Glossy gold plating (hard gold plating) ■ Nickel plating for sealing ■ Matte silver plating *For more details, please refer to the related links or feel free to contact us.
Introduction of case studies related to quality improvement, such as non-electrolytic nickel plating and burr removal techniques!
We would like to introduce examples of problem-solving related to plating and surface treatment for quality improvement through Mitsuya's plating technology and management system. In the case of a semiconductor-related company (Company M) that was struggling with quality issues such as complex plating specifications and liquid residue, the technical department immediately began examining the process, and stable quality was supplied from the samples. This led to mass production prototypes, and after introducing dedicated equipment, it progressed to mass production. Additionally, we have posted examples such as "Electroless nickel plating that does not produce pits" in the related links below. Please take a look. [Plating and Surface Treatment Related to Quality Improvement (Partial)] - Nickel plating for wire bonding - Gold-tin alloy plating - Electroless nickel plating that does not produce pits - Glossy gold plating (hard gold plating) - Plating for drilling equipment used in oil extraction *For more details, please refer to the related links or feel free to contact us.
Tin plating can be used in various fields!
Tin is a relatively soft metal, which makes it widely used as a material for cans for food and beverages due to its role in improving the familiarity of sliding parts in machines and protecting iron sacrificially against organic acids contained in food. It has excellent solderability and is also utilized in functional plating for automotive parts, electronic components, and contacts. It serves as an alternative to expensive gold plating and is used in various fields as a long-term reliable plating film.