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Polishing machine Product List and Ranking from 249 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jan 21, 2026～Feb 17, 2026
This ranking is based on the number of page views on our site.

Polishing machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 21, 2026～Feb 17, 2026
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  3. アイエムティー Wakayama//Testing, Analysis and Measurement
  4. 4 田中インポートグループ Osaka//others
  5. 5 null/null
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Polishing machine Product ranking

Last Updated： Aggregation Period:Jan 21, 2026～Feb 17, 2026
This ranking is based on the number of page views on our site.

  1. Heat release and thermal conduction filler, cylindrical particles, thermal conductivity, zinc oxide. フジミインコーポレーテッド
  2. Belt Grinder "Bader Machine" 松田精機
  3. Vibration polishing machine (art pattern polishing machine) ナップ工業
  4. 4 Bending pipe polishing machine エス・ティ・エス
  5. 5 Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー

Polishing machine Product List

181～210 item / All 805 items

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Diamond Lapping Film "NEO" for Sample Grinding

Diamond Lapping Film "NEO" for Sample Grinding

Introducing diamond wrapping film suitable for fine polishing using fixed abrasives.

We would like to introduce our product "NEO." This product is a diamond wrapping film that can be used for fine polishing with fixed abrasive particles. We offer particle sizes of 0.5μm, 2μm, and 9μm. For more details, please refer to the related catalog. 【Sizes】 ■203 ■229 ■154 ■305 *For more information, please refer to the PDF document or feel free to contact us.

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  • Hand polishing and filing
  • Polishing machine

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Fully Automatic Sample Grinding Machine "Cyrex-8" [Made in Japan]

Fully Automatic Sample Grinding Machine "Cyrex-8" [Made in Japan]

Two-stage variable grinding conditions are possible! The grinding head can be adjusted left and right by ±50mm!

The "Cyrex-8" is a fully automatic polishing machine that can make two types of changes during a single polishing process. It is possible to set the machine to gradually increase pressure for a few seconds right after the polishing starts (e.g., 15 seconds) and then gradually decrease pressure for a few seconds before finishing (e.g., 10 seconds). We also accept requests for the production of holders with hole shapes tailored to the samples, such as leveling machines and sample holders, so please feel free to consult with us. 【Polishing Unit Specifications】 ■ Holder Size: MAX. φ200mm ■ Disc Size: φ250, 300, 310mm ■ Primary Side Air: Requires an air source of 0.5MPa or more ■ Power Supply: Three-phase 200-220V 50/60Hz ■ Dimensions/Weight: W830×D855×H1730mm / Approximately 450kg *For more details, please refer to the PDF document or feel free to contact us.

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  • Other physicochemical equipment
  • Polishing machine

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[Introduction] Sample Lab Center

[Introduction] Sample Lab Center

We will make proposals centered around polishing machines, polishing devices, and sample polishing machines, utilizing the know-how of all precision polishing technologies.

【Overview】 - Dedicated polishing staff available - Providing satisfactory polished surfaces based on accumulated polishing experience data - Proposing jigs as design and production are conducted in-house - Offering detailed polishing reports to clarify the polishing process 【Demo Process】 1. Preliminary meeting 2. Sample collection 3. Setting conditions 4. Demo (on-site or online)

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  • Wafer processing/polishing equipment
  • Polishing machine

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Special shapes such as porous types and irregular types are also possible! Information on custom holder production.

Special shapes such as porous types and irregular types are also possible! Information on custom holder production.

Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types and irregular types.

At IMT Corporation, we accept custom holder production. Based on our extensive data from past polishing achievements, we not only create but also deliver precise and reliable polishing. If you are a customer who wants to polish large samples, or if you want to polish many small samples, or if you have reasons that prevent embedding, please consult with us. 【Examples of polishers we can produce】 ■ Semiconductor wafer polishing machine ■ Surface polishing equipment for LCD panels ■ Shaft polishing equipment ■ Robot polishing machine *For more details, please refer to the related links or feel free to contact us.

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  • Wafer processing/polishing equipment
  • Polishing machine

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Reasons for choosing IMT

Reasons for choosing IMT

Meticulous work unique to Japanese manufacturers! Detailed follow-up visits by sales representatives even after installation.

Here are the reasons why our company is chosen. We primarily use domestic parts, which makes maintenance easy due to Japanese standards. It is also possible to dispatch dedicated technical staff on-site. Our meticulous work, characteristic of Japanese manufacturers, is complemented by prompt responses from sales staff who understand the technology. We thoroughly resolve customer dissatisfaction through close communication between sales and technical teams. 【Features】 ■ Detailed follow-up visits by sales representatives even after installation ■ Design and manufacturing at our headquarters in Wakayama Prefecture ■ Use of carefully selected domestic parts ■ Possibility of dispatching dedicated technical staff on-site ■ Prompt responses from sales staff knowledgeable in technology *For more details, please refer to the PDF materials or feel free to contact us.

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  • Wafer processing/polishing equipment
  • Polishing machine

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Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper.

Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper.

Guidance on wearing protective gear is necessary. We are accepting consultations for initiatives.

According to a notification from the Ministry of Health, Labour and Welfare, it is mandated that individuals engaged in work involving carcinogenic substances must retain work records and other documentation for a period of 30 years, effective from April 1, 2023. Workers engaged in the manufacture or handling of substances that are clearly hazardous to health must be instructed to wear the following protective equipment: (1) Dust mask (2) Safety goggles (3) Protective gloves Please adhere to the laws and regulations of your local municipality regarding wastewater. Disposal will be classified as industrial waste. ■ Measures to reduce exposure levels must be minimized. As part of future initiatives with IMT, we will consider the following: (1) Examination of alternative products (2) Proposals for overall ventilation systems and local exhaust systems (3) Improvement of work methods We welcome inquiries regarding initiatives like those mentioned above, so please feel free to consult with us. *For more details, please do not hesitate to contact us.*

  • others
  • Polishing machine

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Tohoku Univ. Technology : Method for producing spherical zinc oxide : T19-905

Tohoku Univ. Technology : Method for producing spherical zinc oxide : T19-905

Method for producing Monodispersed spherical zinc oxide having uniform particle diameter

　Zinc oxide is used as an ultraviolet shielding agent in cosmetics such as sunscreens. However, in the conventional manufacturing technology, it was difficult to control the particle size of zinc oxide, and it was considered that the texture was bad. Furthermore, there is concern about the effects on the environment and the human body due to toxic exhaust gas caused by treatment at high temperature and the use of inert gas in the manufacturing process. The present invention relates to a method for producing spherical zinc oxide with uniform particle size and monodisperse, and spherical zinc oxide with a simple, low cost and low environmental impact. The spherical zinc oxide is expected to be used as a cosmetic with high ultraviolet shielding effect, excellent soft focusing property and excellent usability.

  • others
  • Polishing machine

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Grinding device "Low-Speed Sander 76"

Grinding device "Low-Speed Sander 76"

Recommended polishing equipment by polishing professionals!

The "Low-Speed Sander 76" enables a wide range of processing when combined with our kits, such as "Polishing + Hairline" and "Deburring." It can be used both horizontally and vertically, making it suitable for various polishing tasks, and we offer a rich lineup including "Polishing PRO Set 1" and "Polishing PRO Set 2," which addresses various burrs. 【Kit Lineup】 ■ Polishing PRO Set 1: Polishing + Hairline ■ Polishing PRO Set 2: Deburring ■ Polishing PRO Set 3: Mirror Finish ■ Polishing PRO Set 4: Gloss Finish Specialist *For more details, please download the PDF or feel free to contact us.

  • Other abrasives
  • Other surface treatment equipment
  • Polishing machine

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Grinding device "Makenki"

Grinding device "Makenki"

A compact polishing device suitable for deburring and chamfering of machined parts!

The "Grinding Machine" is a polishing device that allows for angle adjustments of the disc surface by raising the stand. It is mainly suitable for applications such as deburring, chamfering, light grinding, and general polishing finishes of processed parts. We recommend the "Saving Series" discs, which allow for one-touch attachment and detachment for easy disc replacement. 【Specifications】 ■ Power Consumption: 150W (AC100V) ■ Spindle Speed - 3,275 min(-1) (50Hz) - 3,930 min(-1) (60Hz) ■ Main Unit Weight: 9.2 Kg *For more details, please download the PDF or feel free to contact us.

  • Other abrasives
  • Other surface treatment equipment
  • Polishing machine

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Nano Diamond

Nano Diamond

Nanodiamond - Explosion Method (Cluster)

Nanodiamonds are nanoscale diamonds that have a diamond crystal structure. They retain almost all the properties of diamonds. Due to their nanoscale size, they have the potential to exhibit these properties even more effectively. We offer three types of nanodiamonds depending on the manufacturing method.

  • Other metal materials
  • Polishing machine

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Introduction to Processing Technology: Double-Sided Polishing and Lapping Processing

Introduction to Processing Technology: Double-Sided Polishing and Lapping Processing

We are performing high-precision polishing of micron plates using a double-sided polishing machine!

We perform high-precision polishing of micron plates using a double-sided polishing machine. We also handle mass production polishing and lapping of difficult-to-cut materials such as iron and Kovar, as well as non-magnetic materials like copper, aluminum, SUS, titanium, and resin. Please contact us for more details.

  • Processing Contract
  • Polishing machine

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Surface grinding processing using a horizontal axis rotary grinding machine

Surface grinding processing using a horizontal axis rotary grinding machine

Active in the automotive and semiconductor industries! Surface grinding processing using a horizontal axis rotary grinding machine.

The 'Surface Grinding Process Using a Horizontal Axis Rotary Grinding Machine' involves grinding the reference surfaces, specifically the end faces and both end surfaces, as the first step when high-precision machining of flanged round objects is required. The reference end face, when processed using a magnetic chuck, is a crucial point to ensure that no deformation occurs during cylindrical grinding and internal grinding due to clamping with chucks and other fixtures. Additionally, the NC horizontal axis rotary grinding machine is suitable for high-precision machining of round objects and can also perform grinding with a taper of a few microns to facilitate easy assembly of the items. Recently, it has shown particular effectiveness in machining titanium materials, contributing to reduced processing time and improved precision for this difficult-to-cut material. [Features] - Materials: S45C, SUS304, A7075, SKD11, Titanium 64, etc. - Industries: Automotive parts prototyping, machine tool parts, semiconductor manufacturing equipment parts, etc. - Processing Machine: NC horizontal axis rotary grinding machine - Processing Accuracy: Flatness and parallelism of 0.001 to 0.005 - Work Size: Φ500×200L *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other machine elements
  • Wafer processing/polishing equipment
  • Polishing machine

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Syringe grinding device

Syringe grinding device

Are you having trouble with thin needles or finishing precision?

Our needle polishing machine may be able to meet your needs. We will customize the basic unit to your specifications. The standard machine accommodates needle sizes from 33G to 14G. Please feel free to consult us regarding other specifications or special needles.

  • Other processing machines
  • Polishing machine

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grinder

grinder

A device that can sharpen any needle! Developed and manufactured with the aim of creating a product that anyone can handle with the ease of an automatic machine.

We would like to introduce our "Grinding Machine" that we manufacture. To accommodate the grinding of a wide variety of injection needles, it can handle single-point (single-edged needles) and double-point (double-edged needles) options, and it is capable of grinding any blade shape with a bevel angle ranging from 9 to 40 degrees. Additionally, we offer a lineup of equipment configurations that allow for side hole processing to be performed inline, including punch processing and EMG processing. 【Specifications (Partial)】 ■ General: Fully automatic control of grinding conditions ■ Grinding Chuck: 480mm long ■ Compatible Gauge: 13G (φ2.2) to 32G (φ0.23) ■ Needle Length: 12.5mm to 120.0mm (80-120mm is optional) ■ Grinding Angle: 9-40 degrees *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines
  • Mechanical Design
  • Polishing machine

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Color Filter Full Surface Polishing Device [Correction of Protrusions & Improvement of RGB Surface Flatness]

Color Filter Full Surface Polishing Device [Correction of Protrusions & Improvement of RGB Surface Flatness]

A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!

We aim to correct the protrusions of various color filters and improve the flatness of the RGB surface. This method can absorb the warping of the glass substrate from the polishing tape side, achieving a uniform film thickness. Additionally, it is used to ensure the flatness of ribs in plasma displays and similar applications. Since it can be performed dry, cleaning is easy. Moreover, it is a device designed with inline considerations. 【Features】 ■ The surface roughness can be freely changed by replacing the tape. ■ The contact roller can closely adhere to the warping of the workpiece and perform polishing. ■ Since polishing is done from the high points of the workpiece, flatness is improved. *For more details, please request materials or view the PDF data available for download.

  • Wafer processing/polishing equipment
  • Polishing machine

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Tape-type centerless ultra-finish grinding machine CLP-300

Tape-type centerless ultra-finish grinding machine CLP-300

Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.

The tape-type centerless ultra-finish grinding machine CLP-300 enables management of roughness below 0.4z through tape grinding. There is no need for troublesome dressing work. With a setup change time of less than 5 minutes, it is ideal for a variety of products in small lots. Its main applications include various straight shafts for automobiles and construction machinery, motor shafts (single shafts), rollers for printers (rubber, resin, metal), and inspection pin gauges. If you would like to request a sample test, please feel free to contact us! For more details, please inquire or refer to the catalog.

  • Wafer processing/polishing equipment
  • Polishing machine

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Stamping Back Surface Polishing Device

Stamping Back Surface Polishing Device

Can be processed under suitable conditions! Even beginners can operate it easily.

The "Stamping Back Surface Polishing Device" can polish the back surface of a stamper using a wrapping film. The clamping (fixing) and unclamping (removal) of the workpiece is performed by the operator, while roll polishing, pad polishing, brush cleaning, and air blowing are done automatically. Various surface roughness requirements from different companies can be accommodated by selecting the appropriate wrapping tape and adjusting the parameters of the device to enable processing under optimal conditions. 【Features】 ■ It is possible to randomize the circumference of roll polishing with pad polishing. ■ Once the conditions are set, even beginners can operate it easily. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing machine

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Spherical Polishing Device

Spherical Polishing Device

Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.

This product is a device designed to improve the surface roughness of spherical parts using a tape polishing machine. The supply to the in-machine jig is performed by the operator, and the processing is done automatically via a start switch, making it a semi-automatic machine from which the operator retrieves the finished product. Additionally, the width of the polishing film can be selected based on the workpiece, enabling high efficiency and low-cost processing. 【Features】 ■ Capable of controlling roughness below Ra0.1μm ■ The width of the polishing film can be selected based on the workpiece ■ Achieves high efficiency and low-cost processing ■ Partial R polishing is also possible *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing machine

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Camwrap device

Camwrap device

A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!

The "Cam Wrap Device" can perform deburring of the cam outer peripheral edge of the camshaft and finish the cam section with tape wrapping. The supply to the in-machine jig is done by the operator, and processing is automatically carried out by the activation switch, with discharge through a chute, making it a semi-automatic machine from which the operator retrieves the finished product. The backup roller of the tape unit follows the shape of the cam through a mechanism driven by a servo motor, ensuring that the shape is not distorted. 【Features】 ■ Equipped with a mechanism that follows the shape using a servo motor, preventing distortion ■ Capable of adjusting parameters such as tape, processing time, and pressure ■ A combined device for tape polishing and brushing, offered at a reasonable price *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing machine

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基板平面研磨装置『FCMP-IIシリーズ』

基板平面研磨装置『FCMP-IIシリーズ』

装置の管理も簡単！ウエット・ドライの両用で使用可能です！

『FCMP-IIシリーズ』は、ラッピングテープの特徴を最大限に生かし、 目的とする研磨が容易に得られ、装置の管理も簡単な基板平面研磨装置です。 ウエット・ドライの両用で使用可能。 一度セットアップすると誰でも簡単に使用出来ます。 メッキ/ラミネート/レジスト塗布の前処理研磨などにご使用いただけます。 【特長】 ■テープ番手の選択にて、粗さの管理が容易 ■ウエット・ドライの両用で使用可能 ■一度セットアップすると誰でも簡単に使用出来る ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing machine

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Full Surface Grinding (Z-axis Control)

Full Surface Grinding (Z-axis Control)

A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.

This product is a device for polishing the upper surface of ribbed substrates. Until now, tape backup was performed using the pressing force of rollers, but we have introduced a Z-axis and adopted a mechanism that does not damage the workpiece. Polishing is done using a dry method. The workpiece is attached and detached by the operator, and the predetermined cycle is performed automatically in a semi-automatic machine. 【Features】 ■ Capable of Z-axis control, preventing damage to the initial polishing area ■ Adoption of a flat pad avoids concentrated loads, allowing for soft-touch polishing ■ Once set up, anyone can easily use it *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing machine

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[Presenting Case Studies for Problem Solving] Examples of Installation of Outer Diameter Grinding Equipment

[Presenting Case Studies for Problem Solving] Examples of Installation of Outer Diameter Grinding Equipment

We will introduce a case study of the installation of an outer diameter polishing device at a medical device manufacturer! We solve problems such as dirt on equipment that cannot use cleaning agents!

We would like to introduce a case study proposed by Sanshin Corporation that addresses on-site issues. A certain medical device manufacturer had the concern that "the outer diameter of the pipes used in medical devices has dirt on it after the final process. Since it is for medical use, strong cleaning agents cannot be used, and the dirt cannot be removed." In response, we proposed our "outer diameter polishing device," which allows for the polishing of the workpiece's outer diameter. As a result, by changing the buff polishing process to film polishing, we were able to reduce the cleaning process. This improved the appearance of the finish and contributed to quality enhancement. 【Case Study】 ■ Issues - The outer diameter of the pipes used in medical devices has dirt on it after the final process. - Due to being for medical use, strong cleaning agents cannot be used, and the dirt cannot be removed. ■ Proposal - Introduced the "outer diameter polishing device" that allows for the polishing of the workpiece's outer diameter. - Conducted sample tests, and modifications to specifications according to customer requests are also possible. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other abrasives
  • Polishing machine

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[Information] Basic Knowledge of Film Polishing - Introductory Edition

[Information] Basic Knowledge of Film Polishing - Introductory Edition

Automation of hand polishing, time reduction, and stabilization of quality are possible! Introducing the basic knowledge of film polishing.

"Film polishing" is a polishing method that uses a film-like sheet surface called wrapping film, to which fine abrasive particles are adhered. This document serves as an introductory guide to the basic knowledge of film polishing, covering topics such as "What is film polishing?", the "Differences between film polishing and buff polishing," and the "Differences between film polishing and lap grinding." Please take a moment to read through it. [Contents] ■ What is film polishing? ■ What is Sanshin's Super Finisher? ■ Differences between film polishing and buff polishing ■ Differences between film polishing and lap grinding ■ Next time (internal diameter polishing, ball screw polishing, spherical polishing) *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine tools
  • Wafer processing/polishing equipment
  • Polishing machine

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Robot-type film polishing device *with video*

Robot-type film polishing device *with video*

Challenge to a new film polishing method using multi-axis robots! You can watch it in the video.

- Improvement of surface accuracy in multi-process machining for axis shapes made possible with a single HEAD. - Enhancement of final surface accuracy for end faces of glass, ceramics, resin substrates, etc. - Improvement of surface accuracy for the outer diameter circumference of power semiconductors, silicon wafers, etc.

  • Other semiconductor manufacturing equipment
  • Grinding Machine
  • Polishing machine

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Flat grinding device

Flat grinding device

Flat finishing, flattening, and removal of protrusions for various flat surfaces.

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We offer a variety of film polishing machines tailored to our customers' needs. Our flat polishing equipment is primarily used in the final finishing processes of automotive parts and electrical and electronic components, contributing to improved roughness and flatness. It also has the capability for controlled depth polishing through numerical control. 【Applications】 ◆ Flattening of laminated substrates (such as 5G substrates) ◆ Cleaning of smartphone glass ◆ Flattening of mobile communication system substrates ◆ Flattening during power semiconductor manufacturing 　etc. <Reasons to Choose Sanshin's Polishing Machines> ■ Manufacturer specialized in film polishing equipment ■ Customization according to customer requests (special jigs) is possible ■ Sample testing before installation is possible with various demo machines ■ We can propose suitable polishing conditions based on processing know-how.

  • Engine parts
  • Wafer
  • lens
  • Polishing machine

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Belt-type flat grinding machine

Belt-type flat grinding machine

Accelerating flat super finishing processing! Also for cutting.

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We are a manufacturer that designs and manufactures according to customer requests, based on our technology, experience, and many years of achievements. Our belt polishing machine was developed with the aim of reducing polishing time, which has been a challenge with conventional film-type flat polishing machines. 【Applications】 ◆ Flat polishing of various metal plates ◆ Flat polishing of various resin plates ◆ Flat polishing and trimming of substrates ◆ Flattening of epoxy laminated substrates, etc.

  • Grinding Machine
  • Polishing machine

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BS-type small rail grinding machine

BS-type small rail grinding machine

Removal of crimped leaves and rust from the rail head surface! Lightweight and compact electric small grinder.

We offer the "BS-type small rail grinding machine," which can be operated by one person to remove stuck fallen leaves. It features a large-capacity battery [36V 4.0Ah] and is a quiet model with no noise during non-working times. The continuous grinding distance is approximately 200m. Additionally, the use of a special resin brush ensures that the rails are not damaged. 【Features】 ■ Compact and lightweight, allowing one person to load, transport, and operate it ■ Capable of removing fallen leaves and coverings, as well as rust from the rail head ■ Utilizes a special resin brush ■ Reduces dust, vibration, and noise, easing the burden on the operator ■ Considers short-circuit prevention and protection of rail joints *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment
  • Polishing machine

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Chip saw grinding machine "Body grinder" "Gliding machine" etc.

Chip saw grinding machine "Body grinder" "Gliding machine" etc.

Widely adopted by domestic and international saw manufacturers and regrinding companies. A rich lineup ranging from dedicated machines to multifunctional machines.

Our company manufactures and sells various types of chip saw grinding machines that pursue "high-precision finishing," including body polishing machines that maintain a balance of sharpness and strength, and chip saw grinding machines that can grind triple-blade types in a single process. 【Recommended Products】 Chip Saw Body Polishing Machine 'TN-30' ■ Can grind even with chip chipping controlled by the indexing device ■ Easy operation with a touch panel ■ Automatic cutting in 0.1mm increments, with automatic stop after grinding is complete ■ Freely adjustable boundary between the chip and the body, as well as the height of the chip Chip Saw Grinding Machine 'TN-85/85D' ■ Supports various controls with servo motors (grinding wheel motor, tooth feed motor, etc.) ■ Significantly improved grinding wheel shaft rigidity and slide part rigidity compared to our conventional products ■ Shortened grinding time by adjusting the up-and-down stroke of the grinding wheel *In addition, we also offer a lineup of "breaker grinding machines" and "notch grinding machines." For more details, please refer to the materials. Feel free to contact us as well. Currently, inquiries can be made through our company website. You can find the website at the related link URL below. 　　　　　　↓↓↓

  • Wafer processing/polishing equipment
  • Other abrasives
  • Polishing machine

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Side Grinding Machine "TN-51"

Side Grinding Machine "TN-51"

Side polishing machine with left and right clam shell available for polishing! Uses a servo motor.

The TN-51 is a surface grinding machine capable of simultaneous double-sided grinding. It allows for switching between oscillation and single-pass grinding. The grinding wheel infeed and the forward and backward movement of the grinding wheel utilize servo motors. Additionally, the oscillation speed, number of grindings, number of zero grindings, and infeed amount can all be freely set (numerical settings via the screen). 【Features】 ■ Simultaneous double-sided grinding ■ Ability to switch between oscillation and single-pass grinding ■ Capable of grinding with left and right taper ■ Oscillation speed, number of grindings, number of zero grindings, and infeed amount can be freely set (numerical settings via the screen) ■ Grinding wheel infeed and forward and backward movement use servo motors *For more details, please refer to the PDF materials or feel free to contact us. Inquiries and requests for materials can be made through our company website. You can find the website through the related link URL below. 　　　　　　↓↓↓

  • Wafer processing/polishing equipment
  • Polishing machine

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Chip saw body polishing machine "TN-30"

Chip saw body polishing machine "TN-30"

Easy to operate with a touch screen! A chip saw body grinder that allows you to adjust the chip height as you wish.

The "TN-30" is a chip saw body grinding machine that maintains balance and allows for beautiful and efficient shaping of the base material. It can grind even if there are chips, thanks to the control of the indexing device without using feeding claws. It can automatically cut in increments of 0.1mm and will stop automatically after grinding is completed. Additionally, the boundary between the chip and the base material can be freely adjusted, and the height of the chip can also be easily modified. 【Features】 ■ Maintains balance and allows for beautiful and efficient shaping of the base material ■ Can grind even with chips due to control of the indexing device without using feeding claws ■ Easy operation with a touch screen interface ■ Automatically cuts in increments of 0.1mm and stops automatically after grinding is completed ■ The boundary between the chip and the base material can be freely adjusted, and the height of the chip can be easily modified *For more details, please refer to the PDF materials or feel free to contact us. You can currently download it from our company website. We apologize for the inconvenience, but please request 【TN-30】 from the yellow tab on the right side of the homepage labeled "Materials and Catalog Downloads." You can access the homepage from the related link URL below. 　　　　　　↓↓↓

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing machine

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