Resin Product List and Ranking from 448 Manufacturers, Suppliers and Companies

Carbon infusion laminate resin "NM-300A/B-F"

Infusion-grade laminated resin that does not contain IPDA (isophoronediamine).

The "NM-300A/NM-300B-F" is a fast-curing type of infusion resin for carbon laminates. It cures quickly and has good production cycle characteristics. It has low viscosity and does not contain IPDA (isophorone diamine). Additionally, it can cure at room temperature, and secondary curing is required if heat resistance is necessary. 【Main Applications】 ■ Infusion resin for laminates *For more details, please download the PDF or feel free to contact us.

Company：テムコファイン
Price：Other

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Carbon hand lay-up laminating resin "NM-350A/B"

Low viscosity with good workability! Long pot life type resin for carbon.

"NM-350A/NM-350B" is a hand lay-up laminating resin for standard hardening type carbon. It can cure at room temperature. (Secondary curing is required if heat resistance is necessary.) It also has good adhesion to carbon cloth. Additionally, it has excellent heat resistance and does not contain IPDA (isophoronediamine). [Main Applications] ■ Laminating resin for hand lay-up *For more details, please download the PDF or feel free to contact us.

Company：テムコファイン
Price：Other

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Carbon hand lay-up laminating resin "NM-350A/B-F"

Excellent heat resistance! Carbon resin without IPDA (isophoronediamine)

The "NM-350A/NM-350B-F" is a fast-curing type of resin for hand lay-up applications with carbon. It has low viscosity and excellent workability. It can cure at room temperature, but secondary curing is required if heat resistance is necessary. Additionally, it has excellent adhesion to carbon cloth. [Main Applications] ■ Resin for hand lay-up *For more details, please download the PDF or feel free to contact us.

Company：テムコファイン
Price：Other

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Rigid polyurethane foam resin "PRO-FORM Hard"

Long pot life rigid polyurethane resin

"PRO-FORM Hard" is a low-shrink type of rigid polyurethane resin that does not use TDI or ozone-depleting substances. This product is a rigid polyurethane foam with a foaming ratio of 18-20 times, but we also offer a soft polyurethane foam called "PRO-FORM Soft" with a foaming ratio of 7-8 times. 【Product Overview】 ■Color of the cured material: Yellow-brown ■Features: Rigid with a foaming ratio of 18-20 times *For more details, please download the PDF or feel free to contact us.

Company：テムコファイン
Price：Other

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A thorough explanation of the characteristics of acrylic resin. Proposing window materials and gaskets together.

Acrylic resin suitable for device covers. The reasons for being chosen for its "transparency" and "safety" that surpass glass.

In the design of industrial machinery and analytical instruments, selecting the right materials for "covers" and "windows" to ensure internal visibility is crucial. Glass poses a risk of breaking and is too heavy, while polycarbonate does not fit the budget. In such cases, "acrylic resin (PMMA)" becomes a balanced option. This time, we will introduce three technical features that make acrylic suitable for industrial equipment, as well as precision processing services provided by Daiko Co., Ltd. *For detailed content of the column, you can view it through the related links. For more information, please download the PDF or feel free to contact us.*

Company：ダイコー本社
Price：Other

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【ダイフロン（PCTFE）】PTFEの弱点を克服した「フッ素樹脂

PTFEの弱点を克服したこの高機能素材の特長と、難削材であるPCTFEを自在に操る株式会社ダイコーの加工力についてご紹介

フッ素樹脂といえば「PTFE」が有名ですが、万能に見えるPTFEにも明確な弱点があります。それは「柔らかすぎて、強い圧力がかかると変形してしまう（コールドフロー）」ことです。高圧ガスのバルブや、高い寸法精度が求められる配管ラインで「変形しては困る」場合に選ばれるのが、「ダイフロン」の通称で知られるPCTFE（3フッ化樹脂）です。今回は、PTFEの弱点を克服したこの高機能素材の特長と、難削材である PCTFEを自在に操る株式会社ダイコーの加工力についてご紹介します。 ※コラムの詳細内容は、関連リンクより閲覧いただけます。　詳しくはPDFをダウンロードしていただくか、お気軽にお問い合わせください。

Company：ダイコー本社
Price：Other

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High-performance insulating material refers to PEEK resin.

Thin and flexible product form! Excellent sliding properties, with a smooth surface finish and low dust generation.

"High-performance insulating materials" are high-functionality thermoplastic film products that possess the characteristics of PEEK resin. They are certified for electrical properties at a long-term usage temperature of 200°C. Additionally, their thin and flexible product form promotes miniaturization and lightweight design. They excel in sliding properties, with a smooth surface finish that generates low dust. Please feel free to contact us if you have any inquiries. [Examples of Applications] ■ Power Equipment and Energy Sector - Power distribution equipment, solar power generation, bus bars, transmission lines, generators ■ Automotive and Transportation Sector - Motors, sensors, harnesses, solenoid coils, power supplies ■ Industrial Machinery and Electronic Equipment Sector - FA robots, audio equipment, optical devices, electronic components, semiconductors, switches *For more details, please refer to the PDF document or feel free to contact us.

Company：澤村電材
Price：Other

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Yasuhara Chemical Co., Ltd. Company Profile

We will contribute to the realization of a sustainable lifestyle by merging the blessings of nature with science and technology.

At Yasuhara Chemical, since the era when mass consumption was celebrated, we have pursued the potential of terpene chemistry using natural materials such as turpentine and orange oil as primary raw materials, developing safe and high-quality products. We continue to seek further possibilities so that nature and humanity can coexist and lead a rich life, and to play a role in connecting the natural cycle with your daily life. By merging the blessings of nature with scientific technology, we contribute to the realization of a sustainable lifestyle. 【Business Activities】 ■ Terpene Resin Business (Terpene-based Resins) ■ Chemical Products Business (Synthetic Fragrance Raw Materials, Terpene Solvents, Waxes) ■ Hot Melt Adhesives Business (Hot Melt Adhesives) ■ Laminated Film Business (Glossy Laminated Films) *For more details, please refer to the PDF materials or feel free to contact us.

Company：ヤスハラケミカル
Price：Other

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High thermal conductivity epoxy resin TE-7900 (3Wm/k)

Low viscosity high thermal conductivity epoxy resin. It is ideal for potting electrical and electronic components that require heat dissipation.

TE-7900 Two-component heating curing epoxy resin Features: High thermal conductivity (heat dissipation), excellent workability of 3W/mK, low viscosity, environmentally friendly (non-lead, non-halogen), low thermal expansion *The linear expansion coefficient is low at 16, making it less prone to cracking. Applications: Heat dissipation insulation sealing for industrial motors, coils, transformers, capacitors, etc. ■ Thermal conductivity: 3.0 (W/mK) *For more details, please download the PDF from below or feel free to contact us.

Company：寺田
Price：Other

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General-purpose potting resin TE-3106 low viscosity/high strength product

It is a low viscosity, high strength general-purpose potting resin. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-3106 Two-component heating curing epoxy resin Features: Acid anhydride curing, low viscosity, high strength, crack resistance Applications: Potting for various electronic components ■ Mixing viscosity: 1,800 at 25℃ ■ Flexural strength: 150 (MPa) ■ Recommended curing conditions: 80℃ for 2 hours + 100℃ for 4 hours *For more details, please download the PDF below or feel free to contact us.

Company：寺田
Price：Other

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Low viscosity UV-curable resin TRU-0201K

It is a radical-type UV-curable resin. It has anaerobic and heat-curing properties. It is a low-viscosity type.

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

Company：寺田
Price：Other

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UV-curable resin, high glass transition temperature type TRU-0251

It is a cationic UV-curable resin. It has a Tg of 150°C and excellent heat resistance.

TRU-0251 Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 10,500 (mPa·s) at 25°C ■ Glass transition temperature: 150°C ■ Shear adhesion strength: Substrate failure GL/GL at 25°C Substrate failure GL/GL after 1,000 hours at 85°C/85% RH ■ Recommended curing conditions: UV metal halide lamp 3,000 mJ/cm²

Company：寺田
Price：Other

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UV-curable resin, high thixotropic type TRU-0250K

Cationic UV-curable resin, providing high thixotropy.

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

Company：寺田
Price：Other

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300℃ High Heat Resistant Resin TE-2107

It is a heat-curing acrylic resin with high solder heat resistance of over 300℃.

TE-2107 is a heat-curable acrylic resin with high heat resistance. 【Features】 ■ High peel strength ■ High solder heat resistance (over 300℃) ■ High toughness resin ■ Non-silicone, non-fluorine type 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.

Company：寺田
Price：Other

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High transparency, high flexibility, room temperature curing epoxy resin TE-6408BL6

This is a two-component, room temperature curing liquid epoxy resin with very high transparency of over 95% transmittance and high flexibility of Shore A 60.

This is a highly transparent resin with a transmittance of over 95%. It has excellent weather resistance, is less prone to yellowing, and can be used widely from crafts to electronic components. Due to its high flexibility, it excels in conformity and crack resistance. Additionally, TE-6408BL6 absorbs ultraviolet light in the UV range (approximately below 450nm), making it a resin with low yellowing and high weather resistance. 【Features】 ■ High transparency ■ Room temperature curing two-component epoxy resin (25℃×20h) ■ Flexibility (Shore A 60) ■ High weather resistance 【Applications】 ■ Coatings ■ Adhesives ■ Crafts *For more details, please download the PDF below or feel free to contact us. *Samples are available, so please inquire.

Company：寺田
Price：Other

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[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

Easy to handle with one-component UV curing, high Tg epoxy resin equivalent to flame retardant V-0. Low viscosity of 1,300 mPa·s allows for penetration into fine details, ensuring reliable protection of electronic components.

"TRU-0251FR" is a one-component UV-curable epoxy resin suitable for coating and sealing applications of electronic components. It requires no mixing process, making it easy to handle, and allows for rapid curing through metal halide lamp irradiation (3,000mJ/cm²), significantly contributing to productivity improvements in mass production processes. This product has a low viscosity of 1,300 mPa·s, providing excellent workability and making it easy to apply to narrow spaces and complex-shaped parts. The cured material exhibits excellent mechanical properties with a Shore D hardness of 85, a bending strength of 50 MPa, and a bending modulus of elasticity of 1,400 MPa, along with a glass transition temperature of 91°C, demonstrating stable thermal characteristics. Its flame retardancy and low water absorption rate of 0.5% also ensure excellent moisture and heat resistance and safety. [Features] - One-component UV-curable epoxy resin - Rapid curing with UV irradiation (3,000mJ/cm²), suitable for mass production processes - Good workability with low viscosity (1,300 mPa·s) *For more details, a product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if needed.

Company：寺田
Price：Other

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[Newly Developed Product] UV-Curable Epoxy Acrylate TRU-0153K

UV-curable urethane acrylate that balances transparency and durability. It has low viscosity and low hardness, providing flexibility and is effective for stress relief.

"TRU-0153K" is a one-component UV-curable urethane acrylate resin developed for the coating of electronic components. It can be cured in a short time using metal halide lamp irradiation (1,500 mJ/cm²), demonstrating high productivity even in mass production processes. This product has a low viscosity of 1,300 mPa·s and low hardness (Shore A35), providing flexible properties that relieve stress and prevent crack formation. Furthermore, it shows no change in hardness even after high-temperature testing at 150°C for 1,000 hours and 1,000 cycles of thermal cycling between -40°C and 150°C, exhibiting excellent moisture and heat resistance and durability. It balances high insulation and flexibility. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Short curing time (UV: 1,500 mJ/cm²) ■ Low viscosity and low hardness (Shore A35) with flexibility, effective for stress relief ■ No change in hardness after 150°C for 1,000 hours and -40°C to 150°C for 1,000 cycles *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

Company：寺田
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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0500K2

One-component UV-curable urethane acrylate resin. Suitable for substrate coating. Excellent workability with low viscosity of 550 mPa·s and quick curing for mass production.

The 『TRU-0500K2』 is a one-component UV-curable urethane acrylate resin developed for moisture-proof coating applications on electronic circuit boards. Its one-component design, which requires no mixing, makes it easy to handle, and it allows for rapid curing through UV irradiation (1,500mJ/cm²), making it suitable for energy-efficient and effective mass production processes. This product features a low viscosity design of 550mPa·s (25°C), providing excellent workability and making it easy to coat complex part shapes and narrow areas. The cured material has a Shore D hardness of 58, balancing flexibility and strength. Additionally, it boasts excellent insulation properties with a dielectric breakdown strength of 30kV/mm and a volume resistivity of 2×10^15Ω·cm, supporting the long-term reliability of electronic devices. The appearance is transparent, allowing for use without compromising the aesthetics of circuit boards and electronic components. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Low viscosity (550mPa·s) for good workability ■ High moisture resistance (water absorption rate of 0.3%), ensuring long-term reliability *For more details, a product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

Company：寺田
Price：Other

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High Thermal Conductivity Epoxy Resin for Semiconductors TE-7163

For heat dissipation and insulation sealing of semiconductor devices. Excellent workability with quick curing and low viscosity.

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially shortening product lifespan. TE-7163 efficiently dissipates heat generated by semiconductor devices to the outside due to its high thermal conductivity, thereby improving device reliability. 【Application Scenarios】 - Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors. 【Benefits of Implementation】 - Prolonged device lifespan - Enhanced product reliability - Stable performance maintenance

Company：寺田
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High Thermal Conductivity Epoxy Resin TE-7163 for Automotive Applications

For automotive cooling systems. This epoxy resin is ideal for heat dissipation and insulation sealing.

In the automotive industry, there is a demand for improved cooling performance due to the increased performance of electronic devices. Particularly for components that tend to generate heat, such as engine control units and motors, effective heat dissipation measures are essential. If proper cooling is not implemented, it may lead to component failure or performance degradation. TE-7163 features high thermal conductivity, rapid curing, and low viscosity, contributing to the reliability of automotive cooling systems. 【Application Scenarios】 - Industrial motors - Coils - Capacitors 【Benefits of Implementation】 - Efficient heat dissipation due to high thermal conductivity - Increased productivity due to rapid curing - Improved workability due to low viscosity

Company：寺田
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High Thermal Conductivity Epoxy Resin TE-7900 for Robotics

Low-viscosity epoxy resin that solves the heat dissipation problem of high-output robots.

In the robotics industry, the increase in output power has led to a higher risk of performance degradation and failures due to heat generation. In particular, heat dissipation measures for motors and drive components are critical issues that affect the reliability and lifespan of robots. The TE-7900 addresses these challenges with its high thermal conductivity and low viscosity. 【Application Scenarios】 - Insulation and heat dissipation sealing for high-output motors - Heat dissipation measures for power electronics components - Thermal management for robotic arms and drive units 【Benefits of Implementation】 - Suppression of component overheating and stabilization of performance - Extension of product lifespan - Improvement of robot system reliability

Company：寺田
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High thermal conductivity epoxy resin for semiconductors TE-7127

Achieving both high thermal conductivity and ease of use. We solve the heat dissipation challenges of semiconductors.

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially compromising product reliability. TE-7127 achieves both high thermal conductivity and excellent insulation, contributing to improved heat dissipation performance of semiconductor devices and enhancing product reliability. 【Application Scenarios】 - High-performance processors such as CPUs and GPUs - Power semiconductor devices - LED lighting 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Stabilization of performance

Company：寺田
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High Thermal Conductivity Epoxy Resin TE-7127 for Automotive Applications

High thermal conductivity epoxy resin contributing to the improvement of automotive cooling performance.

In the automotive industry, as the miniaturization and high performance of electronic components progress, thermal management has become an important issue. In particular, for heat-generating components such as engine control units (ECUs) and power semiconductors, efficient cooling is essential. If appropriate thermal measures are not implemented, it can lead to component failure or performance degradation, potentially compromising the reliability and safety of the vehicle. TE-7127 balances high thermal conductivity and ease of use, contributing to the improvement of automotive cooling performance. 【Usage Scenarios】 - Sealing of ECUs - Heat dissipation of power semiconductors - Thermal management of in-vehicle electronic devices 【Benefits of Implementation】 - Extended lifespan of electronic components - Improved reliability of vehicles - Enhanced cooling efficiency

Company：寺田
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Two-component room temperature curing epoxy resin TE-6430 for automotive use

Room temperature curing type × high thermal conductivity! Contributing to the bonding of automotive parts.

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. This is particularly important in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, where the performance of adhesives is critical. Improper adhesion can lead to component detachment or malfunction, potentially resulting in serious accidents. TE-6430, with its high thermal conductivity and flame retardancy, contributes to enhancing safety and reliability in the adhesion of automotive parts. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - Improved heat dissipation due to high thermal conductivity - Enhanced safety due to flame retardancy - Improved workability due to low viscosity

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Two-component room temperature curing epoxy resin TE-6430 for electronic devices

Room temperature curing type × high thermal conductivity! Epoxy resin excellent in heat dissipation insulation.

In the electronics industry, as products become smaller and more high-performance, achieving both insulation and heat dissipation has become an important challenge. In particular, electronic components with high-density mounting tend to generate heat, and insulation failure can lead to product malfunctions. TE-6430 achieves both high thermal conductivity and excellent insulation, contributing to the reliability of electronic devices. 【Usage Scenarios】 - Insulation and heat dissipation measures for motors, coils, and sensors - Protection and insulation of electronic components - Component mounting on circuit boards 【Benefits of Implementation】 - Increased longevity of electronic devices - Improved product reliability - Enhanced design flexibility

Company：寺田
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TE-7901K High Reliability Heat Dissipation Epoxy Resin for Electronic Devices

One-liquid type × High thermal conductivity 6.5W/mK! Contributes to the reliability improvement of electronic devices.

In the electronics industry, thermal management is crucial to ensure the long-term reliability of products. Particularly for electronic components used in high-temperature environments or under heavy loads, heat dissipation performance becomes a key factor that influences product lifespan. If appropriate heat dissipation measures are not implemented, overheating of components can lead to performance degradation or failure, potentially compromising the overall reliability of the product. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, contributing to the improvement of electronic device reliability. 【Application Scenarios】 - Sealing of electronic components that generate heat, such as motors, coils, and power devices - Electronic devices used in high-temperature environments - Electronic devices where reliability is essential 【Benefits of Implementation】 - Suppression of component overheating, extending product lifespan - Improvement of product reliability - Assurance of stable quality

Company：寺田
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TE-7901K for semiconductors

One-liquid type × high thermal conductivity! For thermal management of high-density mounted substrates.

In the semiconductor industry, high-density packaging is advancing, and as a result, the amount of heat generated is also increasing. Heat can cause performance degradation and failure of semiconductor devices, making effective thermal management essential. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to heat dissipation measures for high-density packaging substrates. Its one-component nature ensures excellent workability and provides stable quality. 【Usage Scenarios】 - Sealing of high-density packaged semiconductor devices - Heat dissipation measures for power devices - Insulation and heat dissipation for motors and coils 【Benefits of Implementation】 - Prolonged device lifespan - Improved product reliability - Increased manufacturing process efficiency

Company：寺田
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[For Communication Speedup] TE-7901K

One-liquid type × high thermal conductivity! For thermal management in communication devices. Supports high-speed operation.

In the telecommunications industry, with the spread of high-speed communication such as 5G, the densification and high performance of communication devices are progressing. Consequently, the amount of heat generated inside the devices is increasing, making thermal management an important issue. Without appropriate thermal measures, there is a risk of performance degradation or failure of the devices. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to the reliability of communication equipment. 【Usage Scenarios】 * Base stations * Servers * Routers * Optical fiber communication devices 【Benefits of Implementation】 * Prolonged device lifespan * Stabilization of performance * Reduced risk of failure

Company：寺田
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Two-component heat-curing epoxy resin for automotive use TE-7814V

High thermal conductivity 2.5 W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. Particularly in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, the performance of adhesives is crucial. Improper adhesion can lead to component detachment or performance degradation. TE-7814V offers high reliability in the adhesion of automotive parts, featuring high thermal conductivity and excellent heat resistance. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - High adhesive strength - Excellent heat resistance - Assurance of long-term reliability

Company：寺田
Price：Other

Other polymer materials
Resin

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Two-component heat-curing epoxy resin for electronic devices TE-7814V

High thermal conductivity 2.5W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the electronics industry, high insulation is required to ensure the long-term reliability of products. Particularly for electronic components exposed to temperature changes and vibrations, maintaining insulation performance is essential for preserving product performance. Inadequate insulation can lead to component failure or performance degradation. TE-7814V has high insulation properties, ensuring the long-term reliability of electronic devices. 【Usage Scenarios】 - Insulation of electronic devices - Insulation of power modules 【Benefits of Implementation】 - Improved long-term reliability of electronic devices - Maintenance of product performance - Reduced risk of component failure

Company：寺田
Price：Other

Other polymer materials
Resin

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Resin Product List and Ranking from 448 Manufacturers, Suppliers and Companies | IPROS GMS

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