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microscope Product List and Ranking from 41 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

microscope Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. フローベル Kanagawa//Optical Instruments
  3. 一般財団法人材料科学技術振興財団　MST Tokyo//Testing, Analysis and Measurement
  4. 4 サーモフィッシャーサイエンティフィック株式会社／Thermo Fisher Scientific K.K. Tokyo//Testing, Analysis and Measurement
  5. 5 アズサイエンス 松本本社 Nagano//Trading company/Wholesale
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microscope Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. White interference microscope equipped with laser microscope 'VK-X3000'
  2. Bilateral Microscope System "TOMOS Series" フローベル
  3. All-in-one fluorescence microscope 'BZ-X1000 Series'
  4. 4 All-in-one fluorescence microscope 'BZ-X800'
  5. 5 White interference microscope equipped with laser VK-X3000

microscope Product List

91～105 item / All 647 items

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.

Here is an example of the analysis of BGA (Ball Grid Array). In the observation using a microscope, both optical microscopy and SEM are employed. In the crystal analysis using the EBSD method, we utilize the Phase map, Sn Grain map, Sn IPF map, and Sn GROD map, which allow for the inference of crystal states and residual stresses. 【Overview】 ■ Crystal analysis using the EBSD method - Phase map - Sn Grain map - Sn IPF map - Sn GROD map *For more details, please refer to the PDF materials or feel free to contact us.

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  • Analytical Equipment and Devices
  • Analysis Services

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[Contract Analysis] Laser Microscope (High-Precision 3D Measurement & Color Observation)

[Contract Analysis] Laser Microscope (High-Precision 3D Measurement & Color Observation)

It is possible to perform 3D measurements of the surface roughness of samples and surface shape measurements through transparent objects!

We offer contract analysis using the shape measurement laser microscope "VK-X200." Observations and measurements are conducted using a 408nm laser. The measurement results are based on a traceability system that connects to national standards, allowing the measurement equipment to be used for non-destructive testing. The laser microscope enables 3D measurement of the surface roughness of samples, as well as measurement of the thickness of transparent films and surface shapes through transparent materials. 【Features】 ■ Capable of 3D measurement of surface roughness of samples ■ Capable of measuring the thickness of transparent films and surface shapes through transparent materials ■ Observations and measurements are conducted using a 408nm laser ■ Measurement results are based on a traceability system that connects to national standards ■ Can be utilized as non-destructive testing equipment *For more details, please refer to the PDF document or feel free to contact us.

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  • Contract Inspection
  • Contract Analysis
  • Contract measurement

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Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.

Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.

Even with SiC power devices, we can provide consistent support for cross-section preparation of specific areas, observation of diffusion layer shapes, as well as wiring structure and crystal structure analysis!

Our company conducts observations of the diffusion layer of SiC MOSFETs using LV-SEM and EBIC methods. We can perform cross-section fabrication of specific areas using FIB, shape observation of the diffusion layer using LV-SEM/EBIC, and further through analyses of wiring structures and crystal structures using TEM, all applicable to SiC power devices. In "LV-SEM diffusion layer observation," secondary electrons (SE2) influenced by the built-in potential of the PN junction are detected with the Inlens detector. The shape of the diffusion layer can be visualized through SEM observation of the FIB cross-section. [Analysis methods using EBIC] ■ PEM/OBIRCH defect location identification ■ FIB cross-section processing ■ Low acceleration SEM ■ EBIC analysis ■ TEM *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services
  • Contract Analysis

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Crack observation using a tabletop SEM (scanning electron microscope).

Crack observation using a tabletop SEM (scanning electron microscope).

Fine cracks are easy to see! No conductive treatment is required, allowing for quick and detailed observation.

Introducing "Crack Observation Using Tabletop SEM (Scanning Electron Microscope)." In the evaluation of product reliability, cross-sectional observation of cracks is essential. While optical microscopy may overlook small cracks, SEM observation allows for clear identification. Moreover, with a tabletop SEM, no conductive treatment is necessary, enabling quick and detailed observation. 【Features】 ■ No need for deposition ■ Easy visibility of crystal grains ■ Fine cracks are easily visible *For more details, please refer to the PDF document or feel free to contact us.

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  • Electron microscope
  • Contract Analysis
  • Contract Inspection

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[Data] Cross-sectional observation of neodymium magnets using a tabletop SEM (scanning electron microscope)

[Data] Cross-sectional observation of neodymium magnets using a tabletop SEM (scanning electron microscope)

We have published cross-sectional observations in clear vision mode and normal/standard mode!

This document introduces the cross-sectional observation of neodymium magnets using a tabletop SEM (scanning electron microscope). Samples with magnetic properties, such as neodymium magnets, cannot be observed in a magnetized state using SEM; however, by applying demagnetization treatment, SEM observation and elemental analysis can be performed. Please take a moment to read it. 【Contents】 ■ Demagnetization of neodymium magnets and cross-sectional observation using SEM (Hitachi High-Tech TM3030Plus) - Demagnetization treatment (SEM observation of the magnet in a magnetized state is not possible, so demagnetization is performed) - Cross-sectional observation - Elemental analysis using EDX *For more details, please refer to the PDF document or feel free to contact us.

  • Electron microscope
  • Contract Analysis
  • Contract Inspection

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Cross-sectional observation of large samples (expansion valve)

Cross-sectional observation of large samples (expansion valve)

Introducing a case study on the cross-section preparation of a large sample (65mm × 28mm) and the observation of its internal structure!

We present an observation case of a large sample (expansion valve) measuring 65mm × 28mm. This sample uses magnetic materials, and due to distortion in the images during SEM observation, we primarily conducted observations using an optical microscope. From the appearance and X-ray radiographic observation, it was found that there are some areas that are not visible in the X-ray. [Overview] ■ Appearance and X-ray radiographic observation ■ Cross-sectional observation using an optical microscope *For more details, please refer to the PDF document or feel free to contact us.

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  • Other contract services
  • Contract Analysis
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Differences in appearance due to SEM observation conditions

Differences in appearance due to SEM observation conditions

Introducing SEM images taken under various conditions! An explanation of the differences in appearance based on SEM observation conditions.

SEM observation involves detecting secondary electrons and backscattered electrons generated when electrons irradiate the surface of the sample and scatter in the outermost layer of the sample. These are captured by a detector and displayed as an image on a monitor. There are various types of detectors for capturing electrons, each producing images that leverage their unique characteristics, and the appearance can change by varying the acceleration voltage. In this document, we introduce SEM images captured under various conditions. We encourage you to read it. [Contents] ■ Backscattered Electron Images - Backscattered electron images at high acceleration voltage (AsB detector) - Backscattered electron images at low acceleration voltage (EsB detector) ■ Secondary Electron Images - Differences in appearance based on acceleration voltage - Differences in appearance based on detector position *For more details, please refer to the PDF document or feel free to contact us.

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  • Other contract services

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FE-SEM observation (Crystal grain observation of Al wire bonding section)

FE-SEM observation (Crystal grain observation of Al wire bonding section)

High-brightness electron gun for detailed SEM images! Equipped with an in-lens SE detector sensitive to surface information.

The ZEISS "FE-SEM ULTRA55" is equipped with a GEMINI column, allowing for high-resolution observation at extremely low acceleration voltages. It also features multiple detectors, enabling the observation of various samples. Composition information can be obtained using two types of backscattered electron detectors, and high-resolution EDX analysis can be performed even at low acceleration voltages. 【Features】 ■ High-brightness electron gun for detailed SEM images ■ Ultra-surface analysis at extremely low acceleration voltages ■ In-lens SE detector sensitive to surface information ■ Composition information obtained from two types of backscattered electron detectors ■ High-resolution EDX analysis even at low acceleration voltages ■ Observation without deposition *For more details, please refer to the PDF document or feel free to contact us.

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  • Analytical Equipment and Devices
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Observation of the coating film

Observation of the coating film

Introducing examples of observation and analysis of coating films used in various products, including "microtomes" capable of planar inclined cutting!

We will introduce examples of observation and analysis of coating films used in various products such as automobiles and mobile phones. The "Triple Ion Polisher (CP)" can process samples containing both hard and soft materials without causing damage, while the "Microtome" is capable of not only producing cross-sections but also performing planar inclined cutting. Additionally, the "Desktop Inclined Cutting Machine" can extract sample surfaces that are 6 to 300 times the original thickness as surface information, and the "Desktop SEM (Scanning Electron Microscope)" has a mode for observation under low vacuum (charge reduction), allowing for the observation and elemental analysis of samples that release volatile components. [Observation of Plastic Coating (Mobile Phone Case)] ■ Triple Ion Polisher (CP) ■ Microtome ■ Desktop Inclined Cutting Machine ■ Desktop SEM (Scanning Electron Microscope) *For more details, please refer to the PDF document or feel free to contact us.

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  • Analytical Equipment and Devices
  • Other environmental analysis equipment

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Ultrasonic Microscope 'SAM'

Ultrasonic Microscope 'SAM'

Non-destructive observation is possible! It is effective in detecting defects in internal conditions and adhesion states!

We would like to introduce our ultrasonic microscope, the SAM (Scanning Acoustic Microscope). It is highly effective in detecting defects in the internal conditions and adhesion states of semiconductor packages, substrates, and electronic components. Observation can be performed non-destructively, and defects such as delamination can be detected from the reflected waves of the ultrasonic waves incident on the sample. 【Specifications (excerpt)】 ■ Pulse Receiver: 500MHz ■ Observation Methods: Compatible with both reflection and transmission methods ■ Acoustic Lenses / Reflection Method: 15, 25, 30, 50, 80, 100, 230MHz ■ Acoustic Lenses / Transmission Method: 15, 25, 30, 50, 100MHz *For more details, please refer to the PDF document or feel free to contact us.

  • Other microscopes

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Cross-sectional observation of substrate-mounted components (1) to (6)

Cross-sectional observation of substrate-mounted components (1) to (6)

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Announcement of the introduction of Talos F200E

Announcement of the introduction of Talos F200E

Improved resolution for TEM and STEM! Performance has been significantly enhanced, allowing for EDS analysis with four detectors.

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution of TEM and STEM has improved, and performance has been significantly enhanced, including the capability for EDS analysis with four detectors. Additionally, it is equipped with Drift Corrected Frame Integration (DCFI), which allows for the integration of multiple frames while correcting for drift. 【Specifications (excerpt)】 ■ Acceleration Voltage: 200kV, 80kV ■ TEM Information Limit: ≦0.11nm ■ STEM Resolution: ≦0.14nm ■ Drift Corrected Frame Integration (DCFI) ・Integration of multiple frames while correcting for drift *For more details, please download the PDF or feel free to contact us.

  • Other microscopes
  • Transmission electron microscope

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Wireless Digital Microscope '3R-WM601WIFI'

Wireless Digital Microscope '3R-WM601WIFI'

Achieving wireless operation! It performs well even in environments where the cord made it difficult to use the microscope.

The "3R-WM601WIFI" is a wireless digital microscope that displays images captured by the microscope on a tablet or smartphone with WiFi functionality. Captured data can also be saved directly within the device. Additionally, it supports both wireless and wired connections, allowing you to choose the connection method according to the usage environment, such as using a wired connection in environments with wireless restrictions. 【Features of the dedicated app】 ■ Can compare with dual screen display ■ Allows continuous measurement within the same image ■ Measured values can be used in other images ■ Can save correction results ■ Scale display is possible *For more details, please refer to the PDF document or feel free to contact us.

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