resin Product List and Ranking from 449 Manufacturers, Suppliers and Companies

High thermal conductivity epoxy resin TE-7900 (3Wm/k)

Low viscosity high thermal conductivity epoxy resin. It is ideal for potting electrical and electronic components that require heat dissipation.

TE-7900 Two-component heating curing epoxy resin Features: High thermal conductivity (heat dissipation), excellent workability of 3W/mK, low viscosity, environmentally friendly (non-lead, non-halogen), low thermal expansion *The linear expansion coefficient is low at 16, making it less prone to cracking. Applications: Heat dissipation insulation sealing for industrial motors, coils, transformers, capacitors, etc. ■ Thermal conductivity: 3.0 (W/mK) *For more details, please download the PDF from below or feel free to contact us.

Company：寺田
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General-purpose potting resin TE-3106 low viscosity/high strength product

It is a low viscosity, high strength general-purpose potting resin. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-3106 Two-component heating curing epoxy resin Features: Acid anhydride curing, low viscosity, high strength, crack resistance Applications: Potting for various electronic components ■ Mixing viscosity: 1,800 at 25℃ ■ Flexural strength: 150 (MPa) ■ Recommended curing conditions: 80℃ for 2 hours + 100℃ for 4 hours *For more details, please download the PDF below or feel free to contact us.

Company：寺田
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Low viscosity UV-curable resin TRU-0201K

It is a radical-type UV-curable resin. It has anaerobic and heat-curing properties. It is a low-viscosity type.

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

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UV-curable resin, high glass transition temperature type TRU-0251

It is a cationic UV-curable resin. It has a Tg of 150°C and excellent heat resistance.

TRU-0251 Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 10,500 (mPa·s) at 25°C ■ Glass transition temperature: 150°C ■ Shear adhesion strength: Substrate failure GL/GL at 25°C Substrate failure GL/GL after 1,000 hours at 85°C/85% RH ■ Recommended curing conditions: UV metal halide lamp 3,000 mJ/cm²

Company：寺田
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UV-curable resin, high thixotropic type TRU-0250K

Cationic UV-curable resin, providing high thixotropy.

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

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300℃ High Heat Resistant Resin TE-2107

It is a heat-curing acrylic resin with high solder heat resistance of over 300℃.

TE-2107 is a heat-curable acrylic resin with high heat resistance. 【Features】 ■ High peel strength ■ High solder heat resistance (over 300℃) ■ High toughness resin ■ Non-silicone, non-fluorine type 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.

Company：寺田
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High transparency, high flexibility, room temperature curing epoxy resin TE-6408BL6

This is a two-component, room temperature curing liquid epoxy resin with very high transparency of over 95% transmittance and high flexibility of Shore A 60.

This is a highly transparent resin with a transmittance of over 95%. It has excellent weather resistance, is less prone to yellowing, and can be used widely from crafts to electronic components. Due to its high flexibility, it excels in conformity and crack resistance. Additionally, TE-6408BL6 absorbs ultraviolet light in the UV range (approximately below 450nm), making it a resin with low yellowing and high weather resistance. 【Features】 ■ High transparency ■ Room temperature curing two-component epoxy resin (25℃×20h) ■ Flexibility (Shore A 60) ■ High weather resistance 【Applications】 ■ Coatings ■ Adhesives ■ Crafts *For more details, please download the PDF below or feel free to contact us. *Samples are available, so please inquire.

Company：寺田
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Araldite Urethane System 94S 94SB (Flame Retardant Type)

Huntsman-made polyurethane resin for potting. It has a low hardness (Shore A60) and is equivalent to flame retardant V-2 type. TDS and SDS are available for distribution.

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 94S is characterized by its low hardness and flame retardancy. There is also a 94SB with a black main agent color (no change in properties other than color). For details, please check the property table below or contact us. 94S (Main agent color: light yellow) Main agent: Polyol 3006S Hardener: Isocyanate 2025-1 94SB (Main agent color: black) Main agent: Polyol 3006SB Hardener: Isocyanate 2025-1 *In 2024, due to a change in raw materials, Isocyanate 2025 was changed to Isocyanate 2025-1.

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Araldite Urethane System 96S 96SB (Flame Retardant Type)

Huntsman manufactured potting polyurethane resin. It has a high hardness (Shore D55) and is flame-retardant, equivalent to V-2 type. TDS and SDS are available for distribution.

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. The 96S is characterized by its high hardness and flame retardancy. There is also a 96SB with a black main agent color (no change in properties other than color). For details, please check the property table below or contact us. 96S (Main agent color: light yellow) Main agent: Polyol 3002S Hardener: Isocyanate 2025-1 96SB (Main agent color: black) Main agent: Polyol 3002SB Hardener: Isocyanate 2025-1 *In 2024, due to a change in raw materials, Isocyanate 2025 was changed to Isocyanate 2025-1.

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Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Low viscosity for thorough filling of details! An epoxy resin that can also be considered as a varnish alternative. Cures at room temperature and contributes to energy savings.

The "TE-6000" is a low-viscosity, high-strength epoxy resin suitable for encapsulating electronic and electrical components. It is a two-component system with a mixing ratio of 100:30, making it easy to handle, and it has low-temperature curing properties, allowing it to cure at 70°C for 3 hours or at room temperature. Additionally, it enhances flexibility in the production process and contributes to energy savings. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:30) ■ Low viscosity with excellent filling properties and workability ■ Low-temperature curing (70°C for 3 hours, room temperature curing also possible) ■ High strength (flexural strength 110 MPa, elastic modulus 3,000 MPa) ■ High insulation properties (dielectric breakdown strength 30 kV/mm, volume resistivity 1×10^16 Ω·cm) *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

Room temperature curing × high heat resistance × flame retardant V-0 equivalent! Epoxy resin for sealing electrical and electronic components. No heating equipment required! Contributes to energy savings with room temperature curing type.

"TE-6420FR" is a two-component, room temperature curing epoxy resin developed for the encapsulation of electrical and electronic components. It does not require heating equipment and can cure at 25°C, achieving an energy-efficient and effective working environment. This product features a low viscosity design with a mixing viscosity of approximately 2,000 mPa·s (25°C), allowing excellent filling capability for intricate details and accommodating complex component shapes and filler-less encapsulation. The curing conditions can be flexibly selected as 25°C for 6 hours, 40°C for 3 hours, or 50°C for 1 hour. 【Features】 - Room temperature curing type (no heating operation required, caution with heat generation), efficient short curing time - Low viscosity design suitable for precise filling - High heat resistance: Tg 126°C - Flame retardant: UL94 V-0 equivalent (5mm thickness) - High insulation: Volume resistivity > 1×10^15 Ω·cm *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

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[New Development] One-component Heat-Curing Epoxy Resin TE-5018

One-component × low-temperature curing × high insulation! Epoxy resin for encapsulating electronic components. Cures completely at 80°C in 1 hour! Low-temperature curing type enhances work efficiency.

TE-5018 is a one-component, heat-curing epoxy resin developed for bonding and insulating encapsulation applications of electronic and electrical components. While ensuring stability with refrigerated storage, it accommodates low-temperature curing at 80°C for 1 hour, making it suitable for heat-sensitive components and processes with temperature constraints. The cured material exhibits high mechanical strength with a bending strength of 95 MPa, a bending modulus of 3,300 MPa, and a Shore D hardness of 87. Additionally, it possesses excellent electrical properties with an insulation breakdown strength of 20 kV/mm and a volume resistivity of 5×10^15 Ω·cm, supporting the long-term reliability of electronic devices. Furthermore, it has balanced physical properties with a linear expansion coefficient of 61 ppm/K, a curing shrinkage rate of 2.5%, and a water absorption rate of 0.3%, reducing the risk of cracks and performance degradation. It also excels in workability and can be widely used for insulating encapsulation of electronic components, structural bonding, and ensuring reliability in heat and humidity-resistant environments. 【Features】 ■ One-component heat-curing epoxy resin (no mixing required) *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please inquire if needed.

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

UV-curable epoxy acrylate that balances transparency and high strength. Suitable for applications requiring reliability equivalent to UL94 V-0.

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

Easy to handle with one-component UV curing, high Tg epoxy resin equivalent to flame retardant V-0. Low viscosity of 1,300 mPa·s allows for penetration into fine details, ensuring reliable protection of electronic components.

"TRU-0251FR" is a one-component UV-curable epoxy resin suitable for coating and sealing applications of electronic components. It requires no mixing process, making it easy to handle, and allows for rapid curing through metal halide lamp irradiation (3,000mJ/cm²), significantly contributing to productivity improvements in mass production processes. This product has a low viscosity of 1,300 mPa·s, providing excellent workability and making it easy to apply to narrow spaces and complex-shaped parts. The cured material exhibits excellent mechanical properties with a Shore D hardness of 85, a bending strength of 50 MPa, and a bending modulus of elasticity of 1,400 MPa, along with a glass transition temperature of 91°C, demonstrating stable thermal characteristics. Its flame retardancy and low water absorption rate of 0.5% also ensure excellent moisture and heat resistance and safety. [Features] - One-component UV-curable epoxy resin - Rapid curing with UV irradiation (3,000mJ/cm²), suitable for mass production processes - Good workability with low viscosity (1,300 mPa·s) *For more details, a product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if needed.

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[Newly Developed Product] UV-Curable Epoxy Acrylate TRU-0153K

UV-curable urethane acrylate that balances transparency and durability. It has low viscosity and low hardness, providing flexibility and is effective for stress relief.

"TRU-0153K" is a one-component UV-curable urethane acrylate resin developed for the coating of electronic components. It can be cured in a short time using metal halide lamp irradiation (1,500 mJ/cm²), demonstrating high productivity even in mass production processes. This product has a low viscosity of 1,300 mPa·s and low hardness (Shore A35), providing flexible properties that relieve stress and prevent crack formation. Furthermore, it shows no change in hardness even after high-temperature testing at 150°C for 1,000 hours and 1,000 cycles of thermal cycling between -40°C and 150°C, exhibiting excellent moisture and heat resistance and durability. It balances high insulation and flexibility. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Short curing time (UV: 1,500 mJ/cm²) ■ Low viscosity and low hardness (Shore A35) with flexibility, effective for stress relief ■ No change in hardness after 150°C for 1,000 hours and -40°C to 150°C for 1,000 cycles *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0500K2

One-component UV-curable urethane acrylate resin. Suitable for substrate coating. Excellent workability with low viscosity of 550 mPa·s and quick curing for mass production.

The 『TRU-0500K2』 is a one-component UV-curable urethane acrylate resin developed for moisture-proof coating applications on electronic circuit boards. Its one-component design, which requires no mixing, makes it easy to handle, and it allows for rapid curing through UV irradiation (1,500mJ/cm²), making it suitable for energy-efficient and effective mass production processes. This product features a low viscosity design of 550mPa·s (25°C), providing excellent workability and making it easy to coat complex part shapes and narrow areas. The cured material has a Shore D hardness of 58, balancing flexibility and strength. Additionally, it boasts excellent insulation properties with a dielectric breakdown strength of 30kV/mm and a volume resistivity of 2×10^15Ω·cm, supporting the long-term reliability of electronic devices. The appearance is transparent, allowing for use without compromising the aesthetics of circuit boards and electronic components. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Low viscosity (550mPa·s) for good workability ■ High moisture resistance (water absorption rate of 0.3%), ensuring long-term reliability *For more details, a product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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High Thermal Conductivity Epoxy Resin for Semiconductors TE-7163

For heat dissipation and insulation sealing of semiconductor devices. Excellent workability with quick curing and low viscosity.

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially shortening product lifespan. TE-7163 efficiently dissipates heat generated by semiconductor devices to the outside due to its high thermal conductivity, thereby improving device reliability. 【Application Scenarios】 - Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors. 【Benefits of Implementation】 - Prolonged device lifespan - Enhanced product reliability - Stable performance maintenance

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High Thermal Conductivity Epoxy Resin TE-7163 for Automotive Applications

For automotive cooling systems. This epoxy resin is ideal for heat dissipation and insulation sealing.

In the automotive industry, there is a demand for improved cooling performance due to the increased performance of electronic devices. Particularly for components that tend to generate heat, such as engine control units and motors, effective heat dissipation measures are essential. If proper cooling is not implemented, it may lead to component failure or performance degradation. TE-7163 features high thermal conductivity, rapid curing, and low viscosity, contributing to the reliability of automotive cooling systems. 【Application Scenarios】 - Industrial motors - Coils - Capacitors 【Benefits of Implementation】 - Efficient heat dissipation due to high thermal conductivity - Increased productivity due to rapid curing - Improved workability due to low viscosity

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High Thermal Conductivity Epoxy Resin TE-7900 for Robotics

Low-viscosity epoxy resin that solves the heat dissipation problem of high-output robots.

In the robotics industry, the increase in output power has led to a higher risk of performance degradation and failures due to heat generation. In particular, heat dissipation measures for motors and drive components are critical issues that affect the reliability and lifespan of robots. The TE-7900 addresses these challenges with its high thermal conductivity and low viscosity. 【Application Scenarios】 - Insulation and heat dissipation sealing for high-output motors - Heat dissipation measures for power electronics components - Thermal management for robotic arms and drive units 【Benefits of Implementation】 - Suppression of component overheating and stabilization of performance - Extension of product lifespan - Improvement of robot system reliability

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High thermal conductivity epoxy resin for semiconductors TE-7127

Achieving both high thermal conductivity and ease of use. We solve the heat dissipation challenges of semiconductors.

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially compromising product reliability. TE-7127 achieves both high thermal conductivity and excellent insulation, contributing to improved heat dissipation performance of semiconductor devices and enhancing product reliability. 【Application Scenarios】 - High-performance processors such as CPUs and GPUs - Power semiconductor devices - LED lighting 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Stabilization of performance

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High Thermal Conductivity Epoxy Resin TE-7127 for Automotive Applications

High thermal conductivity epoxy resin contributing to the improvement of automotive cooling performance.

In the automotive industry, as the miniaturization and high performance of electronic components progress, thermal management has become an important issue. In particular, for heat-generating components such as engine control units (ECUs) and power semiconductors, efficient cooling is essential. If appropriate thermal measures are not implemented, it can lead to component failure or performance degradation, potentially compromising the reliability and safety of the vehicle. TE-7127 balances high thermal conductivity and ease of use, contributing to the improvement of automotive cooling performance. 【Usage Scenarios】 - Sealing of ECUs - Heat dissipation of power semiconductors - Thermal management of in-vehicle electronic devices 【Benefits of Implementation】 - Extended lifespan of electronic components - Improved reliability of vehicles - Enhanced cooling efficiency

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Two-component room temperature curing epoxy resin TE-6430 for automotive use

Room temperature curing type × high thermal conductivity! Contributing to the bonding of automotive parts.

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. This is particularly important in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, where the performance of adhesives is critical. Improper adhesion can lead to component detachment or malfunction, potentially resulting in serious accidents. TE-6430, with its high thermal conductivity and flame retardancy, contributes to enhancing safety and reliability in the adhesion of automotive parts. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - Improved heat dissipation due to high thermal conductivity - Enhanced safety due to flame retardancy - Improved workability due to low viscosity

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Two-component room temperature curing epoxy resin TE-6430 for electronic devices

Room temperature curing type × high thermal conductivity! Epoxy resin excellent in heat dissipation insulation.

In the electronics industry, as products become smaller and more high-performance, achieving both insulation and heat dissipation has become an important challenge. In particular, electronic components with high-density mounting tend to generate heat, and insulation failure can lead to product malfunctions. TE-6430 achieves both high thermal conductivity and excellent insulation, contributing to the reliability of electronic devices. 【Usage Scenarios】 - Insulation and heat dissipation measures for motors, coils, and sensors - Protection and insulation of electronic components - Component mounting on circuit boards 【Benefits of Implementation】 - Increased longevity of electronic devices - Improved product reliability - Enhanced design flexibility

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TE-7901K High Reliability Heat Dissipation Epoxy Resin for Electronic Devices

One-liquid type × High thermal conductivity 6.5W/mK! Contributes to the reliability improvement of electronic devices.

In the electronics industry, thermal management is crucial to ensure the long-term reliability of products. Particularly for electronic components used in high-temperature environments or under heavy loads, heat dissipation performance becomes a key factor that influences product lifespan. If appropriate heat dissipation measures are not implemented, overheating of components can lead to performance degradation or failure, potentially compromising the overall reliability of the product. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, contributing to the improvement of electronic device reliability. 【Application Scenarios】 - Sealing of electronic components that generate heat, such as motors, coils, and power devices - Electronic devices used in high-temperature environments - Electronic devices where reliability is essential 【Benefits of Implementation】 - Suppression of component overheating, extending product lifespan - Improvement of product reliability - Assurance of stable quality

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TE-7901K for semiconductors

One-liquid type × high thermal conductivity! For thermal management of high-density mounted substrates.

In the semiconductor industry, high-density packaging is advancing, and as a result, the amount of heat generated is also increasing. Heat can cause performance degradation and failure of semiconductor devices, making effective thermal management essential. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to heat dissipation measures for high-density packaging substrates. Its one-component nature ensures excellent workability and provides stable quality. 【Usage Scenarios】 - Sealing of high-density packaged semiconductor devices - Heat dissipation measures for power devices - Insulation and heat dissipation for motors and coils 【Benefits of Implementation】 - Prolonged device lifespan - Improved product reliability - Increased manufacturing process efficiency

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[For Communication Speedup] TE-7901K

One-liquid type × high thermal conductivity! For thermal management in communication devices. Supports high-speed operation.

In the telecommunications industry, with the spread of high-speed communication such as 5G, the densification and high performance of communication devices are progressing. Consequently, the amount of heat generated inside the devices is increasing, making thermal management an important issue. Without appropriate thermal measures, there is a risk of performance degradation or failure of the devices. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to the reliability of communication equipment. 【Usage Scenarios】 * Base stations * Servers * Routers * Optical fiber communication devices 【Benefits of Implementation】 * Prolonged device lifespan * Stabilization of performance * Reduced risk of failure

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Two-component heat-curing epoxy resin for automotive use TE-7814V

High thermal conductivity 2.5 W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. Particularly in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, the performance of adhesives is crucial. Improper adhesion can lead to component detachment or performance degradation. TE-7814V offers high reliability in the adhesion of automotive parts, featuring high thermal conductivity and excellent heat resistance. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - High adhesive strength - Excellent heat resistance - Assurance of long-term reliability

Company：寺田
Price：Other

Other polymer materials
resin

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Two-component heat-curing epoxy resin for electronic devices TE-7814V

High thermal conductivity 2.5W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the electronics industry, high insulation is required to ensure the long-term reliability of products. Particularly for electronic components exposed to temperature changes and vibrations, maintaining insulation performance is essential for preserving product performance. Inadequate insulation can lead to component failure or performance degradation. TE-7814V has high insulation properties, ensuring the long-term reliability of electronic devices. 【Usage Scenarios】 - Insulation of electronic devices - Insulation of power modules 【Benefits of Implementation】 - Improved long-term reliability of electronic devices - Maintenance of product performance - Reduced risk of component failure

Company：寺田
Price：Other

Other polymer materials
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High Durability Epoxy Resin for Home Appliances TE-7814V

Achieving long-term reliability of home appliances with high thermal conductivity and high Tg.

In the home appliance industry, long-term reliability of products is required, and protecting electronic components, especially those exposed to heat and vibration, is crucial. The TE-7814V addresses these challenges with its high thermal conductivity and high Tg, contributing to the durability of home appliances. 【Usage Scenarios】 - Heat dissipation measures for electronic components prone to heating, such as motors and coils - Protection of electronic devices used in high-temperature environments - Extending the lifespan of products 【Effects of Implementation】 - Suppression of component degradation due to heat - Reduction of product failure risks - Improvement of long-term product reliability

Company：寺田
Price：Other

Other polymer materials
resin

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High-reliability epoxy resin TE-7814V for communication equipment

Contributes to stable operation of communication devices with high thermal conductivity and high Tg.

In the telecommunications industry, stable operation over a long period is required. Particularly for electronic components that are susceptible to temperature changes and external influences, heat dissipation measures and high insulation properties are essential. The TE-7814V addresses these challenges and contributes to the reliability improvement of communication equipment. 【Application Scenarios】 - Base stations - Servers - Communication modules 【Benefits of Implementation】 - Extended lifespan of components due to improved heat dissipation - Realization of stable operation through high insulation properties - Reduction of equipment downtime

Company：寺田
Price：Other

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resin

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