TE-7820FR3 for electronic devices
High Tg, flame retardant, improved copper adhesion! Enhancing the reliability of small electronic devices.
In the electronics industry, as products become smaller, the high-density mounting of components is advancing, leading to increased thermal and electrical stress. As a result, encapsulants are required to have high heat resistance, flame retardancy, and strong adhesion to copper substrates. TE-7820FR3 addresses these challenges and contributes to the reliability improvement of compact electronic devices. 【Application Scenarios】 - Power modules - Semiconductor packages - High-density mounting boards 【Benefits of Implementation】 - Improved product lifespan due to high heat resistance - Enhanced safety due to flame retardancy - Long-term reliability ensured by improved copper adhesion
- Company:寺田
- Price:Other