Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
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High thermal conductivity alumina (Al2O3) substrate, AlN substrate
● Alumina (Al2O3) substrate Thickness: 0.38mm and above Metallization: MoMn, W, Ni, Ag, Au ● AlN substrate Thermal conductivity 170W/m·k and above Thickness: 0.38mm and above Metallization: Cu, Ti/W, Pt, Ag, Au We will challenge at a low cost.
Various types of metallization are possible! Introducing AlN substrates with unique firing and processing technologies.
We would like to introduce the "AlN Slice Substrate" handled by Furukawa Electric. It has high electrical insulation properties and supports various metallizations. It has a thermal expansion coefficient that matches silicon, making it resistant to thermal shock and capable of withstanding rapid heating and cooling. 【Features】 ■ High thermal conductivity and emissivity, providing excellent heat dissipation ■ Thermal expansion coefficient that matches silicon ■ Resistant to thermal shock and capable of withstanding rapid heating and cooling ■ High electrical insulation properties ■ Supports various metallizations *For more details, please refer to the PDF document or feel free to contact us.
Application of film formation technology and thin film processing technology to submounts with increasing demand!
Our company applies and develops the film formation and thin film processing technologies cultivated in the manufacturing of thin film magnetic heads (HDD, FDD) and optical prism components to create thin film electrodes, resistive films, and solder films tailored to substrates such as ceramic substrates, forming them into high-precision fine circuit patterns. We are also capable of patterning on three-dimensional surfaces and thick film Cu plating. Our customers use our products not only in Japan but also in various countries around the world, including Asia and Europe and the Americas. We will continue to develop new technologies in the future. ■ Standard substrate materials (thermal conductivity W/m·K) AlN (170~230) AlN/Cu (~270) SiC (~370) ■ Applications Laser diode (LD) mounting substrates Light-emitting diode (LED) mounting substrates Photodiode (PD) mounting substrates ■ Laser market applications Visible light semiconductor lasers Optical communication (FTTx, data centers, mobile base stations) Consumer industrial applications (sensors, LiDAR, laser processing, medical) Lighting (projectors, automotive headlights), etc.
High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.
The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) Aluminum nitride (AlN) Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.
Proposal for stable procurement of overseas-made ceramic substrates!
Narasaki Sangyo Co., Ltd. will propose overseas-manufactured ceramic substrates through our overseas subsidiaries! ● Domestic procurement is unstable ● We would like to consider new procurement sources ● We want to reduce costs with lower-grade overseas products If you are facing any of these issues, please feel free to contact us! Customers who download our materials will receive alumina substrate samples free of charge!
High thermal conductivity surpassing ceramics! Achieving low thermal expansion comparable to silicon!
By combining SiC ceramics with metallic silicon, we have achieved high thermal conductivity that surpasses ceramics and low thermal expansion comparable to silicon. Thermal conductivity that exceeds SiC and AlN! By changing the composite ratio, various properties can be realized. Surface treatment (plating) is possible, and it can also be used for electrostatic chucks. It can be made larger than ceramics. We also offer a combination of SiC and aluminum. For more details, please refer to the PDF catalog.
Solder with excellent heat resistance for plating electrodes! Achieving high reliability, high density, and multifunctional products for various applications!
We realize the commercialization of various high-density and multifunctional products for applications such as ceramic heaters, optical communication packages, LED packages, sensor packages, and SMD packages.
High heat resistance and high strength! Ceramic wiring board using DPC plating method.
The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.
Leave it to us for circuit boards for power modules! We manufacture thick copper base wiring boards and boards that bond thick copper to ceramics using the AMB method.
We would like to introduce the "Thick Copper Base Wiring Boards" and "AMB Boards" that we handle. The "Thick Copper Base Wiring Board" is available with three grades of insulation layers. We manufacture thick copper base boards for power modules as an alternative to DBC boards and AMB boards (high thermal conductivity and high current). We also handle "AMB Boards," which are thick copper boards bonded to ceramics using the AMB method. These thick copper ceramic boards are designed for power devices and offer high insulation, heat dissipation, and reliability. We can accommodate small quantities, so please feel free to consult with us. 【Specifications of Thick Copper Base Wiring Boards (Partial)】 <Insulation Layer> ■ Thermal Conductivity: 10.0 W/m·K Thickness: 120 μm ■ Young's Modulus: 53 GPa ■ Copper Thickness (Base): 0.5, 1.0, 1.5, 2.0, 3.0 mm ■ Copper Thickness (Wiring): 0.2, 0.3, 0.5, 0.8, 1.0 mm *For more details, please download the PDF or feel free to contact us.
A thin film integrated circuit pattern will be formed on a ceramic substrate.
By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.
Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.
We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.
Consistent production from manufacturing ceramics substrates with low dielectric loss in the microwave band, microwave dielectric substrates, to the formation of thin film patterns.
【High-Quality Alumina Substrate】 ○ Dense ○ The three-point bending strength is 660 MPa, which is significantly higher, about twice that of conventional products ○ Excellent electrical properties with low dielectric loss in the high-frequency range 【Zirconia Substrate】 ○ High strength and high toughness ○ Large elastic deformation capacity in bendable ceramics 【High Dielectric Substrate】 ○ Due to its high relative permittivity, it enables miniaturization of high-frequency circuits compared to alumina substrates ○ Low dielectric loss even in the high-frequency range 【Thin Film Integrated Circuit】 (Circuit formation on various ceramic substrates) ○ Formation of air bridges, side patterns (0.5t or more), and AuSn solder patterns is possible ○ Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors is possible ○ By combining a unique 99.9% alumina substrate with fine patterns, it enables the formation of low-loss and low-noise circuits in the high-frequency range ○ Substrate materials also include high dielectric substrates, aluminum nitride substrates (AlN substrates), and quartz substrates.
It is possible to produce a "super high quality" aluminum nitride film on inexpensive sapphire substrates!
Ultraviolet light-emitting devices are widely attracting attention as next-generation light sources for applications such as alternatives to fluorescent lamps, high-density DVDs, biochemical lasers, decomposition of pollutants using photocatalysts, He-Cd lasers, and alternatives to mercury lamps. These ultraviolet light-emitting devices consist of AlGaN-based nitride semiconductors, known as wide-gap semiconductors, which are layered on heterogeneous substrates such as sapphire. However, there have been challenges with the AlN films grown on sapphire, which contain numerous threading dislocations and exhibit poor quality. The present invention significantly improves the crystallinity of the AlN films through a simple method of thermally treating substrates with AlN films grown on sapphire in an N2/CO mixed gas.
AEC-Q100 grade 2 and VDA 6.3 automotive component standard compliant GNSS high-gain LNA
We have strengthened our lineup of products that comply with AEC-Q100*1 grade 2 and VDA6.3*2, capable of realizing GNSS multi-band. The NJG1187A-A is a low noise amplifier (LNA) product characterized by high gain and low noise figure, supporting the 1.5 GHz band (1559–1610 MHz) and the 1.1–1.2 GHz band (1164 MHz–1300 MHz), contributing to improved reception sensitivity and reduced positioning time for GNSS receivers. Additionally, since the matching of the first and second stage LNAs is done outside the package, the circuit configuration can be flexibly changed according to the application. The package of this product adopts a wettable flank package, making it easier to implement automatic visual inspection. *1 AEC-Q100 is a global standard for the reliability of automotive electronic components. *2 VDA6.3 is a process audit standardized by the German Automotive Industry Association.
Contributing to energy efficiency with film formation technology and thin film processing technology!
In the energy industry, energy conservation and efficient power supply are required. In particular, high-performance electronic components are essential in fields such as solar power generation and energy storage systems. Thin-film circuit boards contribute to the miniaturization and high performance of devices in these systems, supporting improvements in energy efficiency. 【Usage Scenarios】 - Solar power generation systems - Energy storage systems - Power converters 【Benefits of Implementation】 - Enhanced device performance - Miniaturization of systems - Improved energy efficiency
![[Research Material] Global Market for Direct Bonding Copper (DBC) Substrates](https://image.mono.ipros.com/public/product/image/07b/2001468226/IPROS36719060859120934293.jpeg?w=280&h=280)
World Market for Direct Bonding Copper (DBC) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Beryllia (BeO), Home Appliances, Communication ...
This research report (Global Direct Bonding Copper (DBC) Substrate Market) investigates and analyzes the current status and outlook for the global market of Direct Bonding Copper (DBC) substrates over the next five years. It includes information on the overview of the global Direct Bonding Copper (DBC) substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the Direct Bonding Copper (DBC) substrate market by type include alumina (Al2O3), aluminum nitride (AlN), and beryllium oxide (BeO), while the segments by application cover home appliances, telecommunications, industrial, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of Direct Bonding Copper (DBC) substrates. It also includes the market share of major companies in the Direct Bonding Copper (DBC) substrate market, product and business overviews, and sales performance.
![[Research Material] Global Market for Active Metal Brazing (AMB) Substrates](https://image.mono.ipros.com/public/product/image/dfe/2000844074/IPROS23328008115402903548.jpeg?w=280&h=280)
World Market for Active Metal Brazing (AMB) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Silicon Nitride (Si3N4), ...
This research report (Global Active Metal Brazed (AMB) Substrates Market) investigates and analyzes the current state and future outlook of the global active metal brazed (AMB) substrates market over the next five years. It includes information on the overview of the global active metal brazed (AMB) substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the active metal brazed (AMB) substrates market by type include alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), and others, while the segments by application cover power electronics, automotive electronics, home appliances, aerospace, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of active metal brazed (AMB) substrates. It also includes the market share of major companies in the active metal brazed (AMB) substrates market, product and business overviews, and sales performance.
High-precision thin-film circuit boards that support high-speed data communication.
In the telecommunications industry, especially in areas where high-speed data transmission is required, it is important to minimize signal delay and noise. Thin-film circuit boards address these challenges with high-density wiring and excellent thermal conductivity. Our thin-film circuit boards are ideal for laser diode (LD) mounting substrates and optical communication applications. 【Usage Scenarios】 * Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Implementation】 * Stabilization of high-speed data transmission * Improvement in signal quality * Enhanced product reliability
Substrate, submount substrate
1) If you are having trouble with heat generation and dissipation on the substrate due to the integration of heating chips, please consult Toyo Seimitsu Kogyo. 2) We will support you from development design to mass production.
Thin film circuit boards that achieve weight reduction and high performance.
In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. Particularly for electronic devices used in outer space or harsh environments, there is a demand for high reliability and durability while being compact and lightweight. Thin-film circuit boards have been developed to meet these requirements. 【Application Scenarios】 - Electronic devices for aircraft and spacecraft - Satellite-mounted equipment - Drones 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction - Effective use of space through miniaturization - Increased longevity of devices due to high reliability
Thin film circuit boards that achieve high-density implementation. Contributes to miniaturization and high performance.
In the wearable device industry, there is a demand for both miniaturization and high performance. In particular, high-density implementation technology is essential to pack many functions into a limited space. Thin-film circuit boards have been developed to address this challenge. Our thin-film circuit boards achieve high-density implementation through high-precision fine circuit pattern formation technology, contributing to the miniaturization and high performance of wearable devices. [Use Cases] - Smartwatches - VR/AR devices - Healthcare devices [Benefits of Implementation] - Miniaturization of devices - Enhanced performance - Improved reliability
Thin film circuit boards supporting high-precision robot control.
In the robotics industry, advanced motion control and precise sensor information processing are required. Particularly, as robots become smaller and more high-performance, high-density mounting of circuit boards and high reliability are crucial. Thin-film circuit boards have been developed to meet these demands. 【Usage Scenarios】 - Robot arms requiring high-precision positioning control - Robots processing fine sensor information - Mobile robots that require miniaturization and lightweight design 【Benefits of Implementation】 - Miniaturization and lightweight design through high-density mounting - Performance improvement through high-precision circuit patterns - Increased longevity due to high reliability
Thin film circuit boards contribute to the slimming down of displays!
In the display industry, there is a constant demand for thinner and more functional products. In particular, space-saving and lightweight designs are crucial factors that influence product competitiveness. To achieve thinness, it is essential to reduce the thickness of the substrate while simultaneously ensuring high reliability and performance. Our thin-film circuit substrates utilize advanced thin-film processing technology to contribute to the thinning of displays. 【Usage Scenarios】 - Thin displays - High-density mounting substrates - High heat dissipation substrates 【Benefits of Implementation】 - Increased added value of products through thinning - Realization of high-precision circuit patterns - High reliability and durability
Thin film circuit board contributing to the performance improvement of high-frequency measuring instruments.
In the high-frequency measurement instrument industry, accurate signal transmission and noise suppression are essential. Particularly in measurements within the high-frequency range, the dielectric properties of substrate materials and the precision of circuit patterns significantly influence the reliability of measurement results. Inadequate substrate or pattern design can lead to signal attenuation and reflection, hindering accurate measurements. Our thin-film circuit substrates contribute to the performance enhancement of high-frequency measurement instruments by using materials with high-precision fine circuit patterns and excellent thermal conductivity. 【Application Scenarios】 - High-frequency signal measurement - Testing of wireless communication devices - Development of radar systems - Evaluation of various sensors 【Benefits of Implementation】 - Improvement of high-frequency characteristics - Reduction of signal transmission loss - Enhanced noise resistance - Increased measurement accuracy
Thin film circuit boards support the high performance of semiconductors.
In the semiconductor industry, as devices become more high-performance, substrates that allow for heat dissipation and high-density mounting are in demand. Particularly in the mounting of laser diodes and LEDs, fine circuit patterns and high thermal conductivity are crucial. Inappropriate substrates can lead to decreased device performance and shortened lifespan. Our thin-film circuit substrates apply film formation and thin-film processing technologies to achieve highly precise fine circuit patterns and excellent thermal conductivity. 【Application Scenes】 Laser Diode (LD) mounting substrates Light Emitting Diode (LED) mounting substrates Photodiode (PD) mounting substrates Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Introduction】 Contributes to high performance of devices Achieves high reliability Contributes to miniaturization and high-density mounting of products
![[Data] Shirutoku Report No. 94 # Component Selection for Low Noise Amplifier (LNA)](https://image.mono.ipros.com/public/product/image/77c/2000719406/IPROS3824613710880724661.jpg?w=280&h=280)
What criteria should be used for selecting components? Introducing the selection criteria for LNA!
★★Shirutoku Report: Useful Information You Should Know★★ One of the important components that affects the receiving characteristics of wireless communication is the LNA (Low Noise Amplifier). We often receive requests from customers asking, "What criteria should we use to select this component?" Therefore, this time, we will discuss the selection criteria for LNA. Please take a moment to read it. [Contents] ■(1) Selection of devices considering power-saving requirements ■(2) Selection focusing on NF and P1dB ■(3) Selection focusing on Gain and IP3 *For more details, please refer to the PDF document or feel free to contact us.
