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substrate(aln) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
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substrate Product List

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AlN slice substrate

AlN slice substrate

Various types of metallization are possible! Introducing AlN substrates with unique firing and processing technologies.

We would like to introduce the "AlN Slice Substrate" handled by Furukawa Electric. It has high electrical insulation properties and supports various metallizations. It has a thermal expansion coefficient that matches silicon, making it resistant to thermal shock and capable of withstanding rapid heating and cooling. 【Features】 ■ High thermal conductivity and emissivity, providing excellent heat dissipation ■ Thermal expansion coefficient that matches silicon ■ Resistant to thermal shock and capable of withstanding rapid heating and cooling ■ High electrical insulation properties ■ Supports various metallizations *For more details, please refer to the PDF document or feel free to contact us.

  • others

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High thermal conductivity ceramic substrate

High thermal conductivity ceramic substrate

High thermal conductivity alumina (Al2O3) substrate, AlN substrate

● Alumina (Al2O3) substrate Thickness: 0.38mm and above Metallization: MoMn, W, Ni, Ag, Au ● AlN substrate Thermal conductivity 170W/m·k and above Thickness: 0.38mm and above Metallization: Cu, Ti/W, Pt, Ag, Au We will challenge at a low cost.

  • Company：ルータ
  • Price：Less than 10,000 yen
  • Fine Ceramics

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Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Application of film formation technology and thin film processing technology to submounts with increasing demand!

Our company applies and develops the film formation and thin film processing technologies cultivated in the manufacturing of thin film magnetic heads (HDD, FDD) and optical prism components to create thin film electrodes, resistive films, and solder films tailored to substrates such as ceramic substrates, forming them into high-precision fine circuit patterns. We are also capable of patterning on three-dimensional surfaces and thick film Cu plating. Our customers use our products not only in Japan but also in various countries around the world, including Asia and Europe and the Americas. We will continue to develop new technologies in the future. ■ Standard substrate materials (thermal conductivity W/m·K) AlN (170~230) AlN/Cu (~270) SiC (~370) ■ Applications Laser diode (LD) mounting substrates Light-emitting diode (LED) mounting substrates Photodiode (PD) mounting substrates ■ Laser market applications Visible light semiconductor lasers Optical communication (FTTx, data centers, mobile base stations) Consumer industrial applications (sensors, LiDAR, laser processing, medical) Lighting (projectors, automotive headlights), etc.

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  • Circuit board design and manufacturing

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[Research Material] Global Market for Active Metal Brazing (AMB) Substrates

[Research Material] Global Market for Active Metal Brazing (AMB) Substrates

World Market for Active Metal Brazing (AMB) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Silicon Nitride (Si3N4), ...

This research report (Global Active Metal Brazed (AMB) Substrates Market) investigates and analyzes the current state and future outlook of the global active metal brazed (AMB) substrates market over the next five years. It includes information on the overview of the global active metal brazed (AMB) substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the active metal brazed (AMB) substrates market by type include alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), and others, while the segments by application cover power electronics, automotive electronics, home appliances, aerospace, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of active metal brazed (AMB) substrates. It also includes the market share of major companies in the active metal brazed (AMB) substrates market, product and business overviews, and sales performance.

  • Other services

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AMB substrate

AMB substrate

High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.

The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) 　　　　Aluminum nitride (AlN) 　　　　Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board

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Composite Material MMC for Solar Cell Manufacturing Equipment

Composite Material MMC for Solar Cell Manufacturing Equipment

High thermal conductivity surpassing ceramics! Achieving low thermal expansion comparable to silicon!

By combining SiC ceramics with metallic silicon, we have achieved high thermal conductivity that surpasses ceramics and low thermal expansion comparable to silicon. Thermal conductivity that exceeds SiC and AlN! By changing the composite ratio, various properties can be realized. Surface treatment (plating) is possible, and it can also be used for electrostatic chucks. It can be made larger than ceramics. We also offer a combination of SiC and aluminum. For more details, please refer to the PDF catalog.

  • Ceramics
  • Fine Ceramics
  • Other metal materials

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High-Temperature Co-fired Ceramic Multilayer Substrate (HTCC)

High-Temperature Co-fired Ceramic Multilayer Substrate (HTCC)

Solder with excellent heat resistance for plating electrodes! Achieving high reliability, high density, and multifunctional products for various applications!

We realize the commercialization of various high-density and multifunctional products for applications such as ceramic heaters, optical communication packages, LED packages, sensor packages, and SMD packages.

  • High frequency/microwave parts

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DPC substrate

DPC substrate

High heat resistance and high strength! Ceramic wiring board using DPC plating method.

The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Electronic Ceramics (Thin film integrated circuit components & Substrates)

Electronic Ceramics (Thin film integrated circuit components & Substrates)

A thin film integrated circuit pattern will be formed on a ceramic substrate.

By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.

  • High frequency/microwave parts
  • Fine Ceramics
  • Circuit board design and manufacturing

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Characteristics and Applications of Various Ceramic Substrates

Characteristics and Applications of Various Ceramic Substrates

Consistent production from manufacturing ceramics substrates with low dielectric loss in the microwave band, microwave dielectric substrates, to the formation of thin film patterns.

【High-Quality Alumina Substrate】 ○ Dense ○ The three-point bending strength is 660 MPa, which is significantly higher, about twice that of conventional products ○ Excellent electrical properties with low dielectric loss in the high-frequency range 【Zirconia Substrate】 ○ High strength and high toughness ○ Large elastic deformation capacity in bendable ceramics 【High Dielectric Substrate】 ○ Due to its high relative permittivity, it enables miniaturization of high-frequency circuits compared to alumina substrates ○ Low dielectric loss even in the high-frequency range 【Thin Film Integrated Circuit】 (Circuit formation on various ceramic substrates) ○ Formation of air bridges, side patterns (0.5t or more), and AuSn solder patterns is possible ○ Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors is possible ○ By combining a unique 99.9% alumina substrate with fine patterns, it enables the formation of low-loss and low-noise circuits in the high-frequency range ○ Substrate materials also include high dielectric substrates, aluminum nitride substrates (AlN substrates), and quartz substrates.

  • High frequency/microwave parts
  • Fine Ceramics

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Thin-film integrated circuit components

Thin-film integrated circuit components

Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

  • Other electronic parts

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[Data] Shirutoku Report No. 94 # Component Selection for Low Noise Amplifier (LNA)

[Data] Shirutoku Report No. 94 # Component Selection for Low Noise Amplifier (LNA)

What criteria should be used for selecting components? Introducing the selection criteria for LNA!

★★Shirutoku Report: Useful Information You Should Know★★ One of the important components that affects the receiving characteristics of wireless communication is the LNA (Low Noise Amplifier). We often receive requests from customers asking, "What criteria should we use to select this component?" Therefore, this time, we will discuss the selection criteria for LNA. Please take a moment to read it. [Contents] ■(1) Selection of devices considering power-saving requirements ■(2) Selection focusing on NF and P1dB ■(3) Selection focusing on Gain and IP3 *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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GNSS High Gain LNA NJG1187A-A

GNSS High Gain LNA NJG1187A-A

AEC-Q100 grade 2 and VDA 6.3 automotive component standard compliant GNSS high-gain LNA

We have strengthened our lineup of products that comply with AEC-Q100*1 grade 2 and VDA6.3*2, capable of realizing GNSS multi-band. The NJG1187A-A is a low noise amplifier (LNA) product characterized by high gain and low noise figure, supporting the 1.5 GHz band (1559–1610 MHz) and the 1.1–1.2 GHz band (1164 MHz–1300 MHz), contributing to improved reception sensitivity and reduced positioning time for GNSS receivers. Additionally, since the matching of the first and second stage LNAs is done outside the package, the circuit configuration can be flexibly changed according to the application. The package of this product adopts a wettable flank package, making it easier to implement automatic visual inspection. *1 AEC-Q100 is a global standard for the reliability of automotive electronic components. *2 VDA6.3 is a process audit standardized by the German Automotive Industry Association.

  • Other semiconductors

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