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Atmospheric Pressure Plasma Device Product List and Ranking from 59 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

Atmospheric Pressure Plasma Device Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. JFEプラントエンジ Tokyo//others
  3. ジャパンクリエイト Saitama//Testing, Analysis and Measurement
  4. 4 栗田製作所 本社・京都事業部 Kyoto//Industrial Electrical Equipment
  5. 5 魁半導体 Kyoto//Educational and Research Institutions
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Atmospheric Pressure Plasma Device Product ranking

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Handheld Atmospheric Pressure Plasma Treatment Device "Piezo Brush PZ3"
  2. Digital Oil Checker "Wendy" JFEプラントエンジ
  3. Liquid Pulse Plasma Generation Power Supply MPP-HV04 栗田製作所 本社・京都事業部
  4. 4 Single Leaf Spin Spray Cleaning Device SRC-15001 ジャパンクリエイト
  5. 5 Mass production compatible atmospheric pressure plasma device 'ILP series' Ito Corporation

Atmospheric Pressure Plasma Device Product List

91～105 item / All 169 items

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Organic EL evaporation device

Organic EL evaporation device

You can freely choose from the plasma cleaning chamber, organic deposition chamber, electrode deposition chamber, sealing chamber, and more!

The "Organic EL Deposition Device" is a multi-chamber system suitable for device and material development. It is capable of processing from pre-treatment to film formation and sealing without exposure to the atmosphere. Depending on the purpose, you can freely choose from a plasma cleaning chamber, organic deposition chamber, electrode deposition chamber, sealing chamber, etc. 【Features】 ■ Supports substrate sizes up to 300mm ■ Deposition cells can be selected from various materials and sizes ■ Can be combined with CVD chambers, sputtering chambers, etc. ■ Custom orders can also be manufactured ■ Sample processing is conducted using a demo machine *For more details, please refer to the PDF document or feel free to contact us.

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  • Evaporation Equipment

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Pressurized RTA device

Pressurized RTA device

Maximum substrate heating temperature of 1000℃! Reduces element loss specific to the substrate surface heating process!

The "Pressure RTA Device" is a product that can handle processes from vacuum to pressurization (0.9 MPaG). The heating source is a halogen lamp, and the heating rate can reach up to 150°C/sec, achieving excellent substrate temperature distribution and gas flow methods. This device can be used for applications such as semiconductors, MEMS, and electronic components, enabling high-speed thermal oxidation, crystallization, and annealing treatments on the substrate surface. 【Features】 ■ Reduces element loss specific to the heating process ■ Capable of handling processes from vacuum to pressurization (0.9 MPaG) ■ Enables high-speed thermal oxidation, crystallization, and annealing treatments on the substrate surface ■ Achieves excellent substrate temperature distribution and gas flow methods ■ Compatible with tray transport ■ Multi-chamber specifications can also be manufactured *For more details, please refer to the PDF document or feel free to contact us.

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  • Heating device
  • Annealing furnace

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Damage-free adhesion and wettability enhancement! Atmospheric pressure wide-width low-temperature plasma treatment machine.

Damage-free adhesion and wettability enhancement! Atmospheric pressure wide-width low-temperature plasma treatment machine.

Demo units available! We will create samples free of charge for the first time. Inline atmospheric pressure plasma treatment with low-temperature, damage-free using inexpensive gas!

If you are having trouble with surface treatment machines, please feel free to contact us. We have a variety of treatment devices including plasma treatment machines, corona treatment machines, and frame treatment machines. Axis Corporation's atmospheric pressure plasma is effective for improving adhesion, bonding, hydrophilicity, printability, coating, painting, and pre-treatment for adhesion on materials such as resins, glass, and metals, as well as for cleaning applications like the removal of organic substances. If you are interested in surface activation of metals, glass, or resins, please give it a try. We can quickly conduct wettability confirmation tests at our company. We always have various gases such as N2, O2, and H2 on hand, and if you bring samples, we can process them immediately. Small electrodes are easy to install on existing lines. Since it is potential-free, it can treat objects without causing damage, making it effective for processing delicate surfaces like optical films and metal foils. You can achieve uniform surface treatment without worrying about breakthrough. We also have various demo machines besides plasma. For more details, please visit our company website!

  • Plasma Generator
  • Plasma surface treatment equipment
  • Other surface treatment equipment

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Improved adhesion and wettability! Atmospheric pressure plasma treatment device ULS

Improved adhesion and wettability! Atmospheric pressure plasma treatment device ULS

The small nozzle allows for flexible installation locations. It can handle narrow spaces! Demo units are available! Sample creation is possible!

It is easy to install and handle with a market minimum class plasma nozzle. It weighs only 280g! Despite its small size, it can achieve high-speed plasma processing with a maximum output of 1000W. It operates using only compressed air, without the need for special gases. The touch panel allows for easy operation, and the output can be freely adjusted. A maximum of three nozzles can be mounted on a single transmitter. It is also possible to create samples with a demo unit or conduct on-site tests with a rental.

  • Other processing machines
  • Resin processing machine

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Surface modification with a plasma treatment machine! Achieving improved adhesion and wettability.

Surface modification with a plasma treatment machine! Achieving improved adhesion and wettability.

Nozzle widths from 10mm to 70mm can be easily replaced with simple work. One machine can accommodate a wide range of applications.

Plasma treatment is a surface modification technology that achieves adhesion effects by changing the chemical bonds through functional groups generated on the surface. By discharging in the air, the electrons, ions, and radicals generated by the plasma come into contact with the substrate surface. The molecules on the substrate surface react with the ions and electrons in the plasma, producing hydrophilic functional groups, activating the surface, and improving adhesion and wettability (i.e., the effects of intermolecular forces and van der Waals forces). By removing residual organic materials and oxides on the surface, surface activation and cleaning effects can also be obtained. RAantec's plasma treatment machines have two types of nozzles: Plasmajet (5 - 10mm) and Plasphere (20 - 70mm). The spot-type Plasmajet is suitable for processing narrow gaps and thin areas, as well as for pre-treatment before printing on cables and wires. The Plasphere is a nozzle for larger areas, allowing for easy replacement of the tip nozzle from 20mm to 70mm. It is suitable for surface modification and pre-treatment of larger resin and metal surfaces. For more detailed information, please visit our blog. https://www.kbrasch.co.jp/blog/2021/03/31/302

  • Other processing machines
  • Plasma surface treatment equipment

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Atmospheric Pressure Plasma Device MyPL-Auto Series

Atmospheric Pressure Plasma Device MyPL-Auto Series

High-density plasma is generated over a large area by a unique reactor head!

Facilitating the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving reductions in capital investment and running costs!

  • Plasma surface treatment equipment
  • Molding Equipment
  • Circuit board processing machine

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Atmospheric Pressure Plasma Device ILP-Inline Series

Atmospheric Pressure Plasma Device ILP-Inline Series

High-density plasma is generated over a large area by the unique reactor head!

Facilitates the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving a reduction in capital investment and running costs!

  • Molding Equipment
  • Circuit board processing machine
  • Plasma surface treatment equipment

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[Data] Atmospheric Pressure Plasma Generation Device

[Data] Atmospheric Pressure Plasma Generation Device

Publication of topics such as 'Mechanism of Atmospheric Pressure Plasma Generation' and 'Features of Atmospheric Pressure Plasma Devices'!

This document contains information about the "Atmospheric Pressure Plasma Generation Device." We have developed a new plasma head for the atmospheric pressure plasma device, which generates superior plasma compared to conventional methods. This surface treatment device is effective in dry processes such as improving adhesion for difficult-to-bond materials, enhancing wettability, and increasing cleaning effects. Please take a moment to read it. 【Contents (partial)】 ■ What is plasma? ■ Mechanism of atmospheric pressure plasma generation ■ Atmospheric pressure plasma treatment for improved printing ■ Features of atmospheric pressure plasma devices ■ Methods for confirming plasma treatment effects (contact angle measurement) *For more details, please refer to the PDF document or feel free to contact us.

  • Plasma Generator
  • Plasma surface treatment equipment

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Atmospheric pressure plasma treatment device for lead frames

Atmospheric pressure plasma treatment device for lead frames

We process at low temperatures and high speeds using an independent plasma source. It is possible to handle samples that were difficult to process conventionally, such as lead frames and films.

- Low-temperature treatment: Processing is possible even with substrates that have low heat resistance. - High-speed processing: High-speed processing is possible with a linear head up to 75mm wide. - Multi-head: Multiple heads can be selected, from large area heads to a 1.6mm mini-beam head and handheld types. Compatible with uneven shapes. - Mixed gas: Hydrogen gas can be mixed. - Resin and metal substrates: Nylon, polyimide, aluminum, titanium, etc. - Stable processing: Traceability can be achieved.

  • Printed Circuit Board

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Small equipment using plasma technology

Small equipment using plasma technology

We also support systems and equipment that include plasma technology.

Small equipment using plasma technology We also accommodate systems and equipment that include plasma technology. 【Example Specifications (Equipment Configuration)】 ◇ Touch panel control Film winding speed adjustment Tension control Plasma power adjustment Gas flow rate adjustment, etc. ◇ Continuous processing of film using R to R Primary processing with atmospheric pressure plasma Adjustable plasma irradiation position ◇ Secondary processing with a spray coater Adjustable coating amount Adjustable spray position ◇ Tertiary processing with heater heating Adjustable heating temperature Adjustable distance between heater and film Please feel free to consult us regarding specifications. Additionally, if you require experiments conducted by our technical staff, we can accommodate this for an optional fee. For any other questions, please do not hesitate to contact us.

  • Plasma Generator

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Plasma Technology Data Presentation (Kai Semiconductor)

Plasma Technology Data Presentation (Kai Semiconductor)

Technical documents on plasma, including surface changes of various materials (such as gold, resin, glass), surface composition from XPS measurements, and changes over time, are compiled.

Table of Contents 1. What is Plasma!? 2. Principles of Surface Modification 3. Effects of Plasma Treatment 4. Surface Composition 5. Time-dependent Changes 6. Introduction of Applications 7. Vacuum and Atmospheric Pressure Plasma 8. Tube Plasma 9. Powder Plasma Treatment 10. Technical Scope of Correspondence

  • Other cleaning machines

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Tabletop Direct-Type Atmospheric Pressure Plasma Device TK-50

Tabletop Direct-Type Atmospheric Pressure Plasma Device TK-50

Low-cost small device!

●Low cost ●Compact - Space-saving, easy to place in laboratories - Easy to combine with other equipment - Good maneuverability with integrated processing and operation units ●Simple structure - Easy maintenance and inspection - Easy replacement of electrodes (consumables) ●Uniformity - More uniform than handheld corona treatment ●Processing efficiency - No vacuum exhaust required compared to vacuum plasma treatment ●Running costs - Usable without gas supply

  • Other cleaning machines

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Low-temperature pen-type atmospheric pressure plasma device BARRIER-20

Low-temperature pen-type atmospheric pressure plasma device BARRIER-20

Low-temperature and low-flow atmospheric pressure plasma treatment is possible! Surface modification: Stable generation of plasma without charge damage in an atmospheric pressure environment!

- There is almost no damage from heat. - It can be used with various gases such as air, nitrogen, argon, and helium. - It operates on an AC100V outlet, making it usable in various situations. - It can also be used as a laboratory device. - Dimensions (excluding protrusions) (mm) 260(W) × 280(D) × 139(H) - Maintenance is also easy.

  • Plasma Generator

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Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

Processable substrate size 550×650 mm. Achieves zero waste liquid and low running costs.

The "PC-RIE series" can perform processing such as ashing, desmearing, surface modification, and F-type gas etching for medium-sized LCD substrates, printed circuit boards, and more. Customers can choose a version that suits their needs, ranging from a manually operated research and development type chamber to a fully automated system with an atmospheric gate, transport mechanism, and cassette station. 【Features】 ○ Vacuum plasma technology provides a better environment compared to conventional processing → Cleaning, no waste liquid ○ Low running costs ○ Usable substrate size: 550×650 mm For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment

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Vacuum device for plasma treatment for parallel plate evaluation

Vacuum device for plasma treatment for parallel plate evaluation

Widely used in fine anisotropic processing such as semiconductor, liquid crystal fine patterning, and DNA chip manufacturing.

You can choose a version that suits your needs, ranging from a manually operated research and development type chamber with atmospheric gates, transport mechanisms, and cassette stations to a fully automated system. We emphasize process reproducibility and standardly equip our systems with chillers for electrode temperature control and APC, and we can add turbo pumps compatible with high vacuum processes. 【Features】 ○ RIE plasma etching equipment ○ Capable of anisotropic etching of silicon wafers up to 6 inches and small square substrates ○ Equipment for 8 and 12 inches can also be designed For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment

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