ジャパンクリエイト List of Products and Services

Japan Create Co., Ltd. is a manufacturer primarily dealing with semiconductor manufacturing equipment, as well as other equipment such as LCD manufacturing devices. Since all products are manufactured in-house, we can offer them at a low cost. The "Automatic Wafer Cleaning Device" is a single-wafer automatic etching device. The wafer transport is equipped with a 3-axis multi-joint clean robot located at the center of the device, and the loader and unloader can be either FOUP or cassette type. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette For more details, please contact us or download the catalog.

We are currently distributing a comprehensive catalog of our "sheet-type wafer processing equipment," which automatically processes wafers from 2 inches to 18 inches and 300mm substrates from the loader to the unloader cassette using a multi-joint robot through various stages, free of charge! We are also accepting inquiries for demonstrations at any time, so please feel free to contact us! *For more details, please download the catalog or contact us.

This machine is a device for cleaning and etching wafers. After pre-treatment in a cassette, automatic etching is performed in a dedicated barrel. For more details, please contact us.

This machine is a device that performs high-speed wafer etching processing. The wafers are loaded into a dedicated barrel for processing. For more details, please contact us.

This machine is a semi-automatic device that manually attaches a basket with cassettes to a hanger, transports it in an arc from the processing tank to the rinsing tank, and processes wafers. For more details, please contact us.

The spray-type wafer etching device performs a series of cleaning and etching processes, followed by pure water treatment and drying. For more details, please contact us or refer to the catalog.

The "Dry Etching Equipment" is a mass production device capable of fully automatic continuous processing of substrates up to φ12 inches. It features a dual-frequency independent application method that reduces metal contamination through special surface treatment. We also offer multi-chamber specifications and various custom-made options. This versatile device enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduction of metal contamination through special surface treatment ■ Compact footprint ■ Dual-frequency independent application method ■ Ultra-low temperature cooling stage *For more details, please refer to the PDF materials or feel free to contact us.

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "Dry Etching Equipment." We have a track record of "ICP Etching Equipment for Research and Development," "ICP Plasma Etching Equipment," "XeF2 Etching Equipment," and "Batch-type Ashing Equipment." Sample processing is being conducted using demo units. Please feel free to contact us when needed. 【Manufacturing Achievements】 ■ ICP Etching Equipment for Research and Development ■ ICP Plasma Etching Equipment ■ XeF2 Etching Equipment ■ Batch-type Ashing Equipment *For more details, please refer to the PDF materials or feel free to contact us.