ジャパンクリエイト Product Lineup

Japan Create Co., Ltd. is a manufacturer primarily dealing with semiconductor manufacturing equipment, as well as other equipment such as LCD manufacturing devices. Since all products are manufactured in-house, we can offer them at low prices. The "Automatic Wafer Cleaning System" consists of a sheet-type automatic cleaning device, with wafer transport configured using a 3-axis multi-joint clean robot and a uniaxial robot for front and rear transport. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette - Also available in a type that can use FOUP in addition to cassettes For more details, please contact us or download the catalog.

We are currently distributing a comprehensive catalog of our "sheet-type wafer processing equipment," which automatically processes wafers from 2 inches to 18 inches and 300mm substrates from the loader to the unloader cassette using a multi-joint robot through various stages, free of charge! We are also accepting inquiries for demonstrations at any time, so please feel free to contact us! *For more details, please download the catalog or contact us.

This machine is a dip-type single-sheet processing machine that vertically lifts the workpiece in the loader section and performs each processing step with a transport robot. After the final cleaning is completed, the workpiece is returned horizontally by the inversion mechanism, and spin drying is performed. It is a cassette-to-cassette cleaning machine. For more details, please contact us.

The sheet-type automatic cleaning device is a cleaning device that addresses spray-type cross-contamination in a sheet format. It is provided with cleaning methods tailored to various processes (hoop compatibility available). For more details, please contact us.

The 300mm wafer automatic cleaning device is a cassette-type batch cleaning system. It can accommodate up to Φ300. For more details, please contact us.

The cassette-less automatic cleaning device is a precision cleaning processing device that performs a consistent process from workpiece input to drying. The equipment can be selected with a cassette-less, boat transport method, and various designs can be manufactured according to user specifications. For more details, please contact us.

It is a method for cleaning the wafer surface with a high-pressure jet of pure water in a non-contact manner. 【Features】 ◯ Removal of particles ◯ Removal of particulate contamination ◯ Removal of burrs from the wafer surface

The "RCA Wafer Cleaning System" is an automatic cleaning device primarily based on the RCA cleaning method, widely adopted as a highly reliable cleaning method. With a "3-axis multi-joint clean robot" for wafer transport and "FOUP" used for loaders and unloaders, it achieves cleaning in a non-particle environment. 【Features】 ■ Quick response from estimates to customization ■ Support for our own equipment as well as other manufacturers' equipment ■ Detailed response to sudden specification changes *For more details, please download the catalog or contact us. 【Exhibition Information】 SEMICON Japan Location: Tokyo Big Sight Period: December 13-15, 2017 Booth Number: 3509, East Hall

The "RCA Wafer Cleaning System" is an automatic cleaning device primarily based on RCA cleaning, widely adopted as a highly reliable cleaning method. It features a "3-axis multi-joint clean robot" for wafer transport and a "FOUP" used in the loader and unloader, achieving cleaning in a non-particle environment. 【Features】 ■ Quick response from quotes to customization ■ Support for not only our own equipment but also for other manufacturers' equipment ■ Detailed response to sudden specification changes *For more details, please download the catalog or contact us.

We would like to introduce the "CVD equipment" that we handle. Starting with the "Oxide/Nitride Plasma CVD Equipment," which achieves low stress, high hardness, and high insulation through a two-frequency independent application method, we also offer a lineup that includes "DLC Coating Equipment" and "Carbon Nanotube Synthesis Equipment." We can also manufacture multi-chamber specifications and various custom orders. Please feel free to contact us when needed. 【Features of Oxide/Nitride Plasma CVD Equipment】 ■ Achieves excellent film thickness distribution and reproducibility ■ Reduces metal contamination through special surface treatment ■ Capable of controlling a wide range of film properties ■ Abundant accumulated data ■ Compatible with tray transport *For more details, please refer to the PDF materials or feel free to contact us.