ビオラ List of Products and Services

For various devices that have been used for many years, various issues such as the device not operating, error messages being displayed, communication failures, and power not turning on may occur. We identify the cause of these diverse issues, which arise from factors such as defective parts, aging deterioration, vibration, and temperature and humidity effects, pinpointing the exact location of the malfunction on the circuit board. We utilize our extensive experience, knowledge, and specialized equipment to repair the device, from sourcing parts to replacement. ● We perform failure analysis and repairs for various devices and individual circuit boards. ● Repairs can be conducted even without circuit diagrams or schematics. ● We also implement measures to extend product lifespan by replacing aging components.

• Other machine tools

Our company has several experienced hand soldering staff members. We can hand solder chip sizes up to 0402. We specialize in the assembly and rework of chip components, as well as QFPs and QFNs with thermal pads, and BGAs (up to 3000 pins). For SMD connector components such as those from Samtec, we solder them using infrared (IR) equipment, so there is no worry about the connector resin melting. For leadless components, we conduct inspections using X-ray (with a 60-degree tilt) after assembly. If you are short on labor and cannot meet soldering deadlines, or if you have a mix of eutectic (lead-containing) and lead-free components, please feel free to use our services. Please do not hesitate to consult us for projects that have been declined by other companies.

• Circuit board design and manufacturing
• Contract manufacturing
• Prototype Services

Our company has several experienced hand soldering staff members. We can hand solder components as small as 0402. If you only need to produce a few pieces for prototypes or have around 100 components, using hand soldering can reduce costs by eliminating programming and metal mask fees, providing a financial advantage. Of course, we can also work with loose components, and we can implement them onto universal boards by reading circuit diagrams. We can accommodate short lead times as well (please consult us). We can also handle machine assembly (IR infrared) for BGA, QFN (with thermal pads), Enpirion, connectors, and more. For leadless components, we will inspect them using X-ray (with a 60-degree tilt) after assembly. Please leave any corrections for assembly defects to us. We offer high quality to our customers along with cost and lead time benefits. Please consider our hand soldering services.

• Prototype Services

Printed circuit boards can experience various issues due to component defects, aging deterioration, vibrations, temperature and humidity effects, and more. We identify the specific locations on the board where problems are occurring and repair them using our years of experience, extensive knowledge, and specialized equipment, from sourcing parts to replacement. If desired, we also offer preventive maintenance by replacing consumable parts. We can also repair patterns on boards that have suffered partial burn damage. Additionally, if you encounter issues with rework, such as needing to correct just one board, not having the manpower to dedicate to rework, or facing high difficulty levels, we can provide quick turnaround, high-quality repairs without discarding the board or components. Using IR equipment and rework tools, we can add and retrofit all types of components (LEDs, connectors, and all surface-mounted and through-hole components). Please feel free to consult with us.

• Printed Circuit Board

Isn't there a need to measure data and record logs at regular intervals? When conducting product development, operational inspections, environmental tests, etc., measuring various data is essential. If measurements are taken at arbitrary intervals, even if you try to utilize the free time until the specified measurement time for other tasks, it ultimately leads to continuous measurement work, which does not improve efficiency. We propose a service that resolves such concerns through "automatic measurement," allowing for effective use of time. We will comprehensively handle everything from the control software necessary for automatic measurement and log acquisition to the creation of jigs. We look forward to discussing this with you. *For more details, please refer to the PDF materials or feel free to contact us.*

• Contract measurement

Remove the plated lead from the terminal sections such as QFP and SOP to make it usable with lead-free substrates.

• Other electronic parts
• Other semiconductors
• Prototype Services

We regenerate BGA, QFN, modules, QFP, SOP, connectors, and various surface mount components and discrete components. We also accept requests for changes in the composition of BGA solder (from eutectic solder balls to lead-free solder balls). Our company has been committed to creating a more environmentally friendly world through repair, reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.

• Other electronic parts
• Circuit board design and manufacturing
• Other semiconductors

Our company performs "BGA rework and reballing" using IPC-recommended IR rework equipment (7 units owned). We have a track record of reworking over 100,000 BGA components with pitches ranging from 0.35 to 1.27mm, as well as reballing over 50,000 BGA components with ball diameters from Φ0.2 to 0.76mm. We can also accommodate copper core balls. We can handle requests starting from just one piece, and we are capable of working on circuit boards with underfill applied, as well as replacing QFN and connector components. We can also address components that are difficult to replace. Please feel free to consult with us. 【Features】 ■ BGA and QFN Rework - Over 100,000 BGA rework achievements with pitches from 0.35 to 1.27mm - Achievements with 1,300 special QFN components - Capable of handling difficult-to-replace components - Analysis of soldering conditions using X-ray observation equipment with CT functionality ■ BGA Reballing - Over 50,000 reballing achievements for BGA components with ball diameters from Φ0.2 to 0.76mm - Capable of handling components with underfill applied - Can manage the entire process from BGA removal to reballing to rework *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Dedicated IC
• Prototype Services

In this document, we introduce the functions of rework and reballing equipment, including BGA rework and reballing. Our company offers BGA replacement, BGA repair, BGA rework, BGA reballing, circuit board modification, circuit board repair, soldering services, and X-ray inspection services with CT functionality. Details of our "BGA Rework and Reballing" include over 30,000 rework achievements for BGA with a pitch of 0.4 to 0.8mm, as well as over 20,000 reballing achievements for BGA with ball diameters ranging from Φ0.2 to 0.8mm. We can also accommodate copper core balls. We can handle requests starting from one piece, and we are capable of working on circuit boards with underfill applied, as well as replacement work for QFN and connectors. Prices are clearly stated, so please feel free to contact us. [Contents] ■ What is rework? ■ What is reballing? ■ The technical capabilities of Viola that meet diverse needs ■ Introduction to some functions of Viola's rework and reballing equipment *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Inspection

Our company offers X-ray inspection services using the X-ray inspection device "FX-300tRX" with CT functionality. We will check and analyze the soldering condition using the X-ray inspection device with CT functionality. The inspection images (CT images are video files) will be written to a DVD and provided to you. Please use this for confirming the mounting condition of BGA components and for identifying any defects. It can also be used to check the solder filling rate of inserted components. 【Features of FX-300tRX】 ■ Geometric magnification of 1000 times ■ Capable of canceling backside information using "X-ray stereo method" ■ Flat panel can be observed at a 60° tilt ■ Points do not shift even if the camera is tilted ■ Capable of displaying tomographic information (approximately 3-5mm up and down can be divided into 100 parts) *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Circuit board design and manufacturing
• Contract manufacturing

Our company offers a "Circuit Board Modification Service." For example, in the modification of BGA jumper wiring, we attach strap wires to the BGA balls and implement the BGA. After implementation, we guarantee quality through X-ray inspection. In addition, we handle all issues related to circuit board implementation, including prototype modifications, circuit board modifications, pattern cutting and jumper wiring, pattern repairs, circuit changes, manual implementation (chip sizes 0402 to 0603), and various component replacements. 【Circuit Board Modification Service】 ■ Circuit Board Modification ■ Pattern Cutting ■ Jumper Wiring ■ Pattern Repair ■ Pad Correction ■ Circuit Changes ■ Manual Implementation (compatible with chip sizes 0402 and 0603), etc. ■ Various Component Replacements Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment across the entire organization. *For more details, please refer to the PDF document or feel free to contact us.

• Prototype Services
• Other electronic parts
• Other services

Our company has been engaged in OEM manufacturing of security equipment for about 30 years since its establishment. We handle everything from circuit design to appearance design during the development stage and continue to provide integrated manufacturing services from mold production to parts procurement. We also offer assembly manufacturing (including quality control) leveraging our 25 years of experience in mobile phone repairs (including failure analysis), so please feel free to contact us regarding small lot production.

• Machinery and equipment installation/dismantling/relocation
• Circuit board design and manufacturing
• Prototype Services

Our company was established to contribute to shortening development timelines and addressing labor shortages by managing necessary engineers, equipment, and outsourcing partners, utilizing a network across all areas related to electronic devices from product planning to design work. In terms of manufacturing, we handle a wide range of services from prototypes to small-lot mass production boards and OEM supply of mass-produced products. In our mobile phone repair business, we launched the "Visual System" to achieve a "paperless process" (preventing dust and work omissions) and to manage all products by serial number (including delivery and inventory management), enabling prompt and accurate repair services. 【Business Activities】 ■ Mobile phone repairs ■ Advanced repair services (BGA IC replacement) ■ Printed circuit board pattern design, prototyping, mass production, and component mounting ■ OEM supply of electronic devices (including manufacturing management) *For more details, please refer to the PDF document or feel free to contact us.

• Prototype Services
• Other electronic parts
• Other services

We would like to introduce our company's "main equipment" that performs general electronic device repairs as well as BGA repair and rework. The "HR600" is equipped with a super high-efficiency hybrid heater, which is an evolution of the IR heater, and features an automatic component placement function through image processing, enabling fully automated rework operations. The modular type IR rework system "IR650A" supports safe rework operations in a lead-free environment and can handle a wide range of applications from large lead-free boards with high thermal capacity to delicate mobile phone boards and small PC boards, allowing for safe rework operations with simple operating procedures. Additionally, we possess lead-free compatible rework systems like the "IR550A," which guarantees uniform heating that was difficult with traditional hot air methods, and the X-ray observation device "FX-300tRX" with CT functionality. 【Main Equipment】 ■ HR600 Fully Automated Rework System ■ IR650A Rework System ■ IR550A Rework System ■ Hybrid Rework System ■ X-ray Observation Device FX-300tRX with CT Functionality *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Printed Circuit Board
• Circuit board design and manufacturing

We offer "Data Recovery and Internal Data Extraction Services." If you are having trouble retrieving internal data from your mobile phone or smartphone due to issues such as "the power won't turn on" or "it has been submerged in water," please leave it to us. After extracting the data, we will save it onto a medium and return it to you. Please consult with us first. 【Please leave it to us in the following situations!】 ■ The power won't turn on ■ The power cuts out ■ It is frozen ■ It has been submerged in water ■ The SD card is not recognized ■ The keys are unresponsive *For more details, please refer to the PDF document or feel free to contact us.

• Other services
• Other contract services

Our company also offers contract manufacturing (including quality control) that leverages our experience in mobile phone repairs. We have a track record of 10,000 units per month, providing comprehensive repair services that include disassembly, parts replacement, assembly, inspection, quality control, and parts management. Please feel free to inquire about small lot manufacturing as well. 【Features】 ■ Track record of 10,000 units per month ■ Comprehensive repair services ■ Assembly manufacturing utilizing our mobile phone repair experience ■ Consultation available for small lot manufacturing *For more details, please refer to the PDF document or feel free to contact us.

• Other services
• Other contract services

This document introduces the repair of LCDs and FPCs using the ACF crimping equipment conducted by Viola Corporation. It includes an introduction to our tabletop ACF attachment device "LD-02" and the FPC alignment thermal crimping device "BD-03," as well as approximately 150,000 repair case examples. [Contents] ■ Introduction of equipment ■ Repair cases *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Other contract services
• Other processing machines

This is an introduction document for the IR method BGA rework systems "IR550A" and "IR/PL650A" owned by Viola Corporation. It covers issues related to lead-free rework using hot air, comparisons between hot air methods and ERSA IR heaters during BGA rework, and various advantages of infrared heating. [Contents (excerpt)] ■ ERSA IR/PL IR Rework Station ■ Issues with lead-free rework using hot air ■ Comparison of hot air methods and ERSA IR heaters during BGA rework ■ Advanced technology from ERSA ■ RPC Reflow Observation Camera ■ Various advantages of infrared heating, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Other contract services

We process various types of cables (such as flat cables, coaxial cables, and harnesses). We also welcome transactions involving a wide variety of small lots. *For more details, please refer to the PDF document or feel free to contact us.

• Harness
• Other semiconductor manufacturing equipment
• cable

Compared to solder balls: ◎ Excellent strength, allowing for clearance in semiconductor packages ◎ Suppresses deformation of the balls, secures space, and enables the realization of a highly reliable component structure ◎ Allows for narrow pitch mounting similar to Cu pillars ◎ Enables high heat dissipation and measures against electromigration

• Other semiconductors
• Prototype Services
• Memory

◎ Capable of implementing, replacing, and reworking QFN (quad flat non-leaded) packages. ◎ Also capable of handling special packages that integrate LGA and QFN.

• Other semiconductors
• Circuit board design and manufacturing
• Prototype Services

◎Capable of implementing, replacing, and reworking module components ◎Compatible with LGA (Land Grid Array) packages

• Other electronic parts
• Circuit board design and manufacturing
• Prototype Services

Printed Circuit Board Assembly 【SMT Assembly】 We can assemble components ranging from tiny parts to large irregular parts. We can handle CSP, BGA (0.25mm pitch), QFP (0.2mm pitch), 0603 chips, and PLCC irregular parts. Nitrogen-compatible reflow is used. *0402 chips are currently a challenge! 【Lead Component Assembly】 We can assemble large components such as transformers, coils, electrolytic capacitors, cement resistors, and current sensors. 【Moisture-Proof Insulation Coating】 Coating agents (moisture-proof insulation materials) can be applied to both the front and back surfaces of the board. 【Board Aging】 Aging of printed circuit boards and assembled boards is possible. We can accommodate constant temperature chambers and temperature cycle testing machines.

• Contract manufacturing
• Prototype Services
• Processing Contract

We offer contract services for X-ray inspections using the X-ray inspection device "FX-300tRX" with CT functionality. The inspection images (CT images are video files) will be written to a DVD and provided to you. Please use this service to check the mounting status of BGA components, discover defects, and verify the solder filling rate of inserted components. Additionally, we also provide authenticity assessments for semiconductors and electronic components. We will inspect the internal markings and patterns of the components. Please utilize this service for authenticity verification of packaging before use when purchasing stock items. The inspection results will be reported in a report format. 【Features】 ■ Compact small X-ray device with a geometric magnification of 1000 times ■ "X-ray stereo method" allows for cancellation of backside information ■ Flat panel can be tilted at 60° for observation, maintaining magnification even at an angle ■ Automatic tracking of the observation position for angled observations (the point does not shift even if the camera tilts) ■ Stereo CT functionality allows for division of approximately 3-5mm of the upper and lower parts of the mounted board into 100 segments, enabling display of tomographic information *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Circuit board design and manufacturing
• Contract manufacturing

Our company performs "BGA Rework and Reballing" using 7 IPC-recommended IR rework devices. "BGA Reballing" refers to the process of regenerating the solder balls of a BGA. The process involves removing the BGA from the circuit board, removing the solder from the BGA, applying flux or solder paste, placing the solder balls, and then heating them with an IR heater to join the solder balls. You can trust us with your BGA reballing needs. We have a track record of reballing over 50,000 BGAs with ball diameters ranging from φ0.2 to 0.76mm. We assist in rescuing discarded circuit boards. Additionally, we also accommodate changes in solder composition (from eutectic solder balls to lead-free solder balls). 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder from the BGA ■ Solder Ball Placement: Apply flux or solder paste, then place the solder balls ■ Heating: Heat with an IR heater to join the solder balls *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Contract manufacturing

Our company performs "BGA Rework and Reballing" using IPC-recommended IR rework equipment (7 units). "BGA Rework" refers to the process of removing a BGA mounted on a circuit board and installing a new BGA. The process involves removing the BGA from the circuit board, cleaning the solder left on the pads (lands) of the circuit board, applying flux or solder paste, placing the BGA, heating it with an IR heater, and joining the solder balls. Finally, the soldering condition is checked using an X-ray inspection machine. If you need BGA rework, please leave it to us. We have a track record of reworking over 100,000 units of BGA with pitches ranging from 0.3 to 1.27 mm. We are here to assist in rescuing discarded circuit boards. 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder left on the pads (lands) of the circuit board ■ Placement: Apply flux or solder paste, then place the BGA ■ Heating: Heat with an IR heater to join the solder ■ X-ray Inspection: Check the soldering condition with an X-ray inspection machine *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Contract manufacturing

Our company offers a "Circuit Board Modification Service," including the removal of BGA and module components. We can handle all your needs related to circuit board modifications, including pattern cutting, jumper wiring, pattern repairs, circuit changes, and manual assembly (chip sizes from 0402 and up). For circuit board modifications, trust Viola. 【Service Details】 ■ Removal and installation of BGA and module components ■ BGA reballing, reinstallation, and transplanting to different boards ■ Replacement of ICs and components with underfill ■ POP (2-layer) IC replacement, reballing, pre-stacking ■ QFN rework, IC socket installation, connector replacement ■ Replacement and reballing of BGA with uneven ball pitch ■ DDR replacement, dual-layer installation ■ Jumper wiring from underneath the BGA *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Contract manufacturing

We would like to introduce the rework and reballing equipment we use. The "IR650A Rework System" is a modular type IR rework system designed for safe rework operations in a lead-free environment. Additionally, we have the lead-free compatible "IR550A Plus Rework System" using dynamic IR technology and a "Hybrid Rework System." 【Features (IR650A Rework System)】 ■ Modular type IR rework system ■ Supports safe rework operations in a lead-free environment ■ Compatible with a wide range of delicate mobile phone circuit boards to small PC circuit boards ■ Allows rework operations with simple operating controls *For more details, please refer to the PDF materials or feel free to contact us.

• Circuit board design and manufacturing
• Contract manufacturing