Micro Point Pro ltd List of Products and Services

We would like to introduce the "Solder Jet Ball Dispenser Nozzle" that we handle. It is a standard technology in hard disk drive manufacturing and is also applicable to other major applications such as mobile phone camera assembly and wafer bumping. It features excellent materials and tool specifications to extend tool life, as well as special designs that support the development roadmap. 【Features】 ■ Excellent materials and tool specifications to extend tool life ■ Special designs that support the customer's development roadmap ■ Ultra-tight tolerances on critical dimensions that enable improved manufacturing yield ■ Unmatched quality and repeatability between tools ■ Support for all OEM machines, including Pactech, Laservall, and Hans Laser *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment

This document is an explanatory material about heavy wire wedges. It includes features of chip design aimed at reducing buildup, as well as key development activities. With MPP's unique chip design, buildup and wear are minimized, enhancing performance and durability. [Contents] - Challenge: Improvement of MTBA - Features of chip design to reduce buildup - Features of chip design to decrease buildup - Key development activities - Value proposition *For more details, please download the PDF or feel free to contact us.

• Other machine elements

We would like to introduce the "Micro Dispenser Nozzle" that we handle. It is used in industries such as electronics, biotechnology, and photonics, achieving excellent precision in the application of adhesives, coatings, and other fluids to small and delicate components. It enables the creation of complex patterns and precise placement in microelectronics, medical devices, and other high-tech applications. 【Features】 ■ Used in industries such as electronics, biotechnology, and photonics ■ Achieves excellent precision in adhesives for small and delicate components ■ Enables the creation of complex patterns and precise placement in microelectronics and medical devices *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

We would like to introduce the "Solder Jet Ball Dispenser Nozzle" that we handle. This is a standard technology used in hard disk drive manufacturing and is also applicable to other major applications such as mobile phone camera assembly and wafer bumping. It features excellent materials and tool specifications to extend tool life, as well as special designs that support development roadmaps. [Features] ■ Excellent materials and tool specifications to extend tool life ■ Special designs that support customers' development roadmaps ■ Ultra-tight tolerances for critical dimensions that enable improved manufacturing yields ■ Unmatched quality and repeatability between tools ■ Support for all OEM machines, including Pactech, Laservall, and Hans Laser *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment

We would like to introduce our "Precision Parts Processing." Pressing and sintering are fully vertically integrated from powder to raw materials, mastering the entire process of hard metals and ceramics. We also utilize our own designed compression system and leverage a pressure sintering system to provide high-quality products. 【Materials Used (Partial)】 ■ Tungsten carbide ■ Silicon carbide (SiC) ■ Silicon nitride (Si3N4) ■ Various grades of stainless steel (203, 316, 304, etc.) ■ Alumina/Aluminum oxide (Al2O3) *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

Micro Point Pro Co., Ltd. has 40 years of experience and expertise since its establishment, and offers a wide range of products for the semiconductor and microelectronics device assembly industry. Based in Israel, it is supported by 150 employees and 600 employees from group companies. MPP covers all manufacturing processes from raw materials to finished products and has numerous achievements with many global companies. 【Products Offered】 ■ Wedge bonding tools (fine wire and heavy wire wedge tools) ■ Die collet ■ Manual wire bonders ■ Pick & place and flip chip tools ■ Dispensers & solder jet ball tools ■ Surface mount dispensers & nozzles

• Other semiconductor manufacturing equipment

Micro Point Pro's "Heavy Wire Wedge Surface Treatment/Coating" maintains high-quality bonding performance while achieving reduced buildup and wear. As a countermeasure against buildup, we offer four types of coatings using carbon-based and silicon-based materials. 【Features】 ■ Long-term bonding and tool life ■ Attractive pricing ■ Support for consignment and custom products ■ Assistance with new tool development and design support for customers ■ Special tool marking options

• others

Micro Point Pro's "4-Needle Probe (Contact Probe)" features high-quality high-speed steel, characterized by extremely low resistance values. The tip uses carbide and osmium alloys, allowing for choices in durability and electrical contact properties. The probe body offers a reliable solution for resistivity measurement with the "Fell Probe (Chrome-Plated Body)," as well as two other types: "Disposable Probe (Plastic Body)" and "Al Probe (Aluminum Body)." 【Features】 ■ Low-friction upper guide ■ Wide selection of probe tip radii ■ Individual needle pressure adjustment ■ High breakdown voltage and low leakage

• probe

Micro Point Pro Co., Ltd. designs and manufactures the "Solder Jet Ball Dispenser," which is widely adopted in fields such as mobile phones, 5G, and IoT. We carefully select materials to achieve long life, and we provide high-quality products with strict dimensional tolerances. We also respond flexibly to delivery requests. ★Announcement of the Special Olympics Support Campaign★ During the period of the Olympic Games, we will offer all products handled by Micro Point Pro Co., Ltd. at special prices. ? For details, please contact us via email or phone. ? *You can download the English version of the catalog.*

• dispenser

Micro Point Pro Co., Ltd. is a supplier of Heavy Wire Wedges (HWW) and large ribbon wedges, supporting major manufacturers of power devices for various types of applications, including automotive, electric vehicles (EV), and semiconductors. Everything is done in-house, applying a uniquely designed and efficient manufacturing process, and implementing top-class integrated QC and QA for the next HWW tools. Our specialized engineering team continuously collaborates with customers to support cost reduction projects, improve uptime, and enhance MTBA without compromising on quality and performance. *For more details, please refer to the related links page.

• Bonding Equipment

The "IBOND5000" is an advanced tabletop manual wire bonding (die bonding) device used in process development, production, and research. It features an adjustable work holder height to enhance flexibility. It offers high yield and excellent reproducibility for all bonding applications, including optoelectronic modules, hybrid/MCM, microwave products, and chip-on-board. 【Product Lineup】 - Dual wire bonding device (easily switchable between wedge/ball settings) - Ball wire bonding device - Wedge wire bonding device 【Features】 - Adjustable work holder height for improved flexibility - Compatible with copper wire bonding - Ergonomically designed for ease of use - 24/7 online technical support

• Bonding Equipment

This product is an advanced tabletop ball wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It comes standard with ESD coating and is suitable for R&D and small-scale production. By using only the minimum necessary parameters, it allows for easy adjustment of bonding parameters. 【Features】 ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height enhances flexibility ■ Compatible with copper wire bonding * You can download the product documentation (PDF) from below. * If you have any questions about the product or require support after installation, please feel free to contact the person in charge below.

• Bonding Equipment

This product is an advanced tabletop dual (ball/wedge) wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It is suitable for R&D and small-scale production, equipped with a user-friendly touch panel. Bonding can be performed simply by clicking the mouse at the bonding position. Since it uses only the minimum necessary parameters, adjusting the bonding parameters is easy. 【Features】 ■ Supports copper wire bonding ■ Easy switching between wedge/ball settings ■ Adjustable work holder height for improved flexibility ■ Year-round online technical support *You can download the product documentation (PDF) from the link below.

• Bonding Equipment

This product is an advanced tabletop wedge wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It allows for Y-direction table movement settings via parameters, making bonding of pitch wires and parallel wires easy. Parameter import and export using USB is possible. 【Features】 ■ Supports copper wire bonding ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height for improved flexibility ■ Ergonomically designed for ease of use *You can download the product documentation (PDF) from the link below.

• Bonding Equipment

Micro Point Pro Co., Ltd. is a leading supplier of Four Point Probe (4PP) heads for measuring the resistivity of wafers and conductive thin films, equipped with 40 years of experience and expertise. All probe part head assemblies (body, wiring, needles) are manufactured in-house using proprietary high-precision customized equipment, and are assembled and tested internally. 【Features】 ■ High-quality probe heads with top-class dynamic performance ■ High precision and reproducibility ■ Strict QC/QA approach *If you have any questions about the products or require support after implementation, please feel free to contact the person in charge below.

• probe

Micro Point Pro Co., Ltd. is a major supplier of heavy wire wedges (HWW) and large ribbon wedges that support leading manufacturers of power devices for various applications, including automotive, electric vehicles (EVs), and semiconductors. All processes are carried out in-house using MPP's best-in-class quality control and assurance applied to HWW tools, utilizing an efficient self-designed manufacturing process. We continuously collaborate with our customers to support special "cost reduction" projects with our unique chip designs and proprietary TC materials that offer excellent "low build-up" performance, all while reducing costs and improving uptime and mean time between failures (MTBF) without compromising quality or performance. *You can download the English version of the catalog. *For more details, please refer to the related links page.

• Bonding Equipment

Micro Point Pro Inc. is an expert in the manufacturing of complex mechanical miniature parts with strict tolerances. We provide prototype development/small-scale research and development, components for mass production, assemblies, and tools. Our skilled creative personnel work seamlessly with the team to develop and deliver the most critical components, providing excellent technical solutions in a cost-effective manner, with short lead times and top-class quality requirements.

• Grinding Machine

The "liquid dispensing tool" is a product that provides excellent application performance to customers. It allows for the precise application of adhesive to the substrate, making it effective in preventing variations in epoxy resin, such as tearing, bridging, depressions, and insufficient epoxy coverage. Our company designs and manufactures a variety of dispensing nozzles that can be customized to meet specific needs.

• Other work tools

We introduce solutions specialized for the IoT industry offered by Micro Point Pro Co., Ltd. The "fine wire wedge bonding tool" guarantees high yield and stable bonding results. Continuous development of materials and design allows for the optimization of bonding performance.

• Other machine elements

We introduce solutions specialized for the home appliance industry handled by Micro Point Pro Co., Ltd. The "DaiColet Pick & Place Tool" accommodates special die shapes and other process constraints with high precision and strict specifications.

• Other machine elements

We introduce solutions specialized for the LED industry offered by Micro Point Pro Co., Ltd. The "liquid dispensing tool" allows for precise application of adhesive to substrates, effectively preventing variations in epoxy resin such as tailing, bridging, dimpling, and insufficient epoxy coverage.

• Other machine elements

We introduce solutions specialized for the precision parts industry handled by Micro Point Pro Co., Ltd. "Dedicated tools" are manufactured from various hard materials such as tungsten, stainless steel, high-speed steel, and tungsten carbide.

• Other machine elements

We would like to introduce our solutions specialized for the automotive industry. The "liquid dispensing tool" provides excellent application performance to our customers. It allows for precise application of adhesive to the substrate, effectively preventing variations in epoxy resin such as tearing, bridging, indentations, and insufficient epoxy area ratio.

• Other machine elements

We would like to introduce solutions specialized for the aerospace industry offered by Micro Point Pro Inc. The "DaiColet, Pick & Place Tool" is designed with high precision and strict specifications to accommodate special die shapes and other process limitations. It is a versatile tool made from various materials suitable for diverse applications, including plastic, ceramic, metal, and carbide. MPP provides solutions that support the growing demand for renewable energy to make the world cleaner.

• Other machine elements

We would like to introduce our solutions specialized for the semiconductor industry. The "liquid dispensing tool" can accurately apply adhesive to substrates, effectively preventing variations in epoxy resin such as tailing, bridging, dimpling, and insufficient epoxy coverage. It provides excellent application performance to our customers. In addition, we offer a wide range of products including the "fine wire wedge bonding tool" and the "solder jet ball dispenser."

• Other machine elements

We introduce solutions specialized for the medical industry offered by Micro Point Pro Co., Ltd. "Cold HV Sputtering" provides anti-corrosion coatings and enhances surface protection under harsh environmental conditions. It improves wear resistance and extends the lifespan of bonding tools, cutting tools, machining tools, gears, bearings, and plastic molds.

• Other machine elements

Micro Point Pro Co., Ltd. has developed technology that handles a variety of materials, including ferroalloys, magnetic metals, non-magnetic metals, and alloys. The high-end custom machines from Micro Point Pro Co., Ltd. meet stringent precision requirements and support accurate production. They have high reproducibility and allow for the selection of material properties suitable for specific applications. Additionally, they can manufacture complex designs and shapes, enabling them to meet unique applications and stringent demands.

• Other metal materials

We would like to introduce the "DaiColet, Pick & Place Tool" handled by Micro Point Pro Co., Ltd. With high precision and strict specifications, it accommodates special die shapes and other process limitations. It is a tool made from various materials suitable for diverse applications, including plastic, ceramic, metal, and carbide.

• Other work tools

We would like to introduce the "DaiColet and Pick & Place Tools" handled by Micro Point Pro Co., Ltd. These tools are designed to meet high precision and strict specifications, accommodating special die shapes and other process limitations. They are made from various materials suitable for diverse applications, including plastic, ceramic, metal, and carbide.

• Other work tools