Semi Next List of Products and Services

With the increase in demand for communication data, optical communication transmission systems are required to have greater capacity. As a result, manufacturers of optical devices and network equipment are adopting coherent communication modules that use wavelength-variable lasers in transmission backbone networks. Currently, wavelength-variable lasers and coherent modules are also beginning to be used in metropolitan area networks (MAN) and access networks. For wavelength-variable lasers, accurate wavelength measurement and calibration are extremely important. The number of communication channels has increased from the initial 40 wavelengths to a maximum of 800 wavelengths, and the efficiency and accuracy of wavelength measurement are being demanded like never before.

• Optical Measuring Instruments

Semight Instruments is a global manufacturer providing advanced testing solutions in the fields of high-speed communication and semiconductors. We will be exhibiting the "1.6T high-speed interface evaluation solution," which will be unveiled for the first time in Japan at COMNEXT 2025. Key exhibition points: ▶ DCA1065 Sampling Oscilloscope (65GHz) Built-in 120GBaud clock recovery, sensitivity -5dBm, supports 1.6T ▶ CR3302 Clock Recovery Unit (120GBaud) Supports 25-120GBaud NRZ/PAM4 signals, strong against weak light ▶ 1.6T Desktop BERT (Bit Error Rate Tester) 53.125-106.25GBaud, MCB water-cooled, modular structure ▶ PXIe High-Precision SMU 4-quadrant operation, 1pA resolution, 1MS/s high-speed sampling, SCPI compatible Additionally, we plan to showcase many of Semight's best-selling products, including chip testers for semiconductors and optical communications. Experience Semight's innovative technology that meets the latest evaluation needs at the venue.

• oscilloscope

The S2035H is a high-precision, compact, and cost-effective single-channel benchtop SMU (Source/Measure Unit) that supports a voltage output of ±200V and a current output of ±1A (DC) / ±3A (pulsed). It boasts a minimum measurement accuracy of 1fA / 100nV and supports a 6½ digit display. Equipped with a highly visible color LCD and an intuitive GUI, it is an ideal device for research and development, material property evaluation, and microcurrent measurement.

• Power Supplies

The WAT6600 is a highly efficient parallel parametric test system that supports DC measurements and capacitance measurements, as well as high-frequency characteristic evaluations such as ring oscillator testing and flash memory testing. It can measure multiple channels simultaneously, significantly improving throughput in wafer processes. With a balance of accuracy and speed, it is ideal for mass production lines and evaluation processes. Key features: - Accurate DC/CV measurements - Support for high-frequency applications (such as ring oscillator measurements) - Capability for functional evaluation of flash memory - Reduced test time due to high parallelism

• Other electronic measuring instruments

The Semight PB6800 is a high-end SiC KGD die handler widely adopted in the semiconductor industry. It is specialized for dynamic and static parameter testing at the bare die level of SiC power chips, achieving high-reliability KGD (Known Good Die) sorting. This system employs a modular design and supports various die supply methods, including frame rings, tape & reel, and trays. Additionally, it allows for hard docking connections and testing at multiple stations at both room temperature and high temperature, and it is equipped with high-voltage arc protection features. It is a solution that significantly contributes to improving testing efficiency and yield in the mass production process of SiC power devices.

• Tester

The S2019C is a 4-channel PXIe Source Measure Unit (SMU) that combines high precision, compactness, and high cost performance. It supports both voltage and current output and measurement, with a maximum output of ±40V, ±500mA (DC), and ±1A (pulse). It is compatible with conventional SCPI commands, making programming easy. It widely supports standard PXIe chassis and also supports synchronized operation of multiple cards. The S2019C can be integrated into mass production test environments, contributing to improved test efficiency and cost reduction.

• Power Supplies

BI6201 is a high-density, multifunctional test system specifically designed for burn-in lifetime verification of semiconductor laser chips. By adopting a modular structure and a large-area single-layer design, it integrates multi-channel power supplies, temperature control, real-time data acquisition, standardized drawer structures, and flexible fixture configurations, significantly reducing system costs. ▶ Compatibility with Package and Fixture Flexibility It can accommodate various package shapes and sizes, such as CoC (Chip on Carrier). Custom fixtures are designed for easy one-touch replacement, allowing for quick swaps based on product types. ▶ High Reliability Drive and Protection Features The driver circuit of the BI6201 is equipped with an excellent current/voltage protection network. It is designed to thoroughly eliminate risks of EOS (Electrical Over Stress) such as: - Preventing current/voltage overshoot - Automatically disconnecting the relevant channel if the set threshold is exceeded - Avoiding damage to the test target chip Additionally, the control circuit incorporates isolation performance between channels and ESD (Electrostatic Discharge) protection design, ensuring long-term stable operation and reliability assurance.

• diode

The Semight RT & HT Daitester CT8201 is a high-performance automatic test system capable of performing LIV scans, EA scans, and spectral scans for DFB lasers and EML (Electro-absorption Modulated Laser) devices at both room temperature and high temperature in two temperature ranges. ■ Main Supported Tests and Functions - Forward and reverse optical measurements (photocurrent/IV measurements) - Forward spectral measurements (emission spectrum) - Simultaneous support for two temperature zones (parallel measurement of room temperature and high temperature on two independent platforms) - Equipped with high-precision thermal control and stable supply probe structure ■ Productivity, Accuracy, and Stability The CT8201 can complete all six processes (loading, transport, recognition, measurement, classification) in just 6 seconds. Particularly in EML measurements, further throughput optimization is possible depending on the measurement item configuration. Additionally, it incorporates an eccentric cam structure, high-precision linear motors, high reproducibility stepping control, high thermal conductivity chuck, and high rigidity probe structure, achieving ultra-high precision and ultra-high stability, making it ideal for die sorting and reliability testing in mass production.

• Tester

The Semight sCT9002 is a SiPh wafer testing system that is optimized and integrated in both hardware and software, achieving significant improvements in optical alignment performance and coupling speed. This system adopts a modular structure and supports optical coupling using single-core fibers or fiber arrays. It supports both vertical coupling and edge coupling methods, significantly reducing measurement time through parallel testing configurations and dramatically improving testing efficiency. The high precision and high reliability of the sCT9002's measurement performance provide assured data quality and reproducibility in the research and development as well as mass production verification of silicon photonics wafers.

• Tester

The Semight PBT3058 is a high-performance bit error rate tester designed for error testing of high-speed serial signals. It is used for physical layer characterization and compliance testing, supporting both PAM4 and NRZ signals. It can handle symbol rates of up to 106.25 GBaud, providing an optimal solution for evaluating next-generation high-speed communication standards.

• Signal Generator

The Semight CR3302 is a compact, high cost-performance, and high-efficiency tabletop high-speed clock recovery unit. It supports clock recovery for NRZ (Non-Return-to-Zero) and PAM4 (4-level Pulse Amplitude Modulation) signals ranging from 25 to 120 GBaud. This product is widely used in 1.6T optical transceivers and high-speed interface evaluations, and it can stably extract clocks even from signals in a closed-eye state due to its high sensitivity, low jitter, and excellent measurement accuracy.

• Time-frequency measurements

The 200Gbps per lane data rate not only achieves higher bandwidth but also significantly contributes to power consumption reduction. On the other hand, evaluating such high-speed signals requires extremely advanced measurement techniques. Semight has developed the "DCA1065," a wideband sampling oscilloscope that employs a newly designed ASIC compatible with 200Gbps per lane, addressing the challenges of high-speed signal measurement. With the System Impulse Response Correction (SIRC) function, it can flexibly respond to signal measurement requirements under various data rate conditions. Additionally, it supports up to 64 taps in the feedforward equalizer (FFE) for TDECQ, effectively reducing inter-symbol interference (ISI).

• oscilloscope

It is a single-channel high-voltage semiconductor pulse generation unit that can output adjustable high-precision, high-voltage pulse signals. - High Voltage Range It supports an output of ±40V, meeting the technical conditions for NVM (non-volatile memory) testing. - High Voltage with Fast Slew Rate A high-voltage pulse source that achieves a fast slew rate of 1000V/μs enables the generation of sharper edges. - PXIe Interface Based on PXIe interface design, it can be fitted into a standard PXIe chassis. Multi-channel expansion is easy, and it supports chassis sharing with other PXIe measurement instruments, allowing for the construction of a highly convenient semiconductor testing system. - Multi-Level Pulse Output It supports 2-level and 3-level pulse outputs, enabling combinations of multiple pulses to meet the needs for multi-stage pulses in semiconductor testing. - ALWG Function It supports user text editing based on CSV, allowing for the output of arbitrary linear waveform signals. - Software Features The GUI is designed to be very intuitive and concise, making it easy to configure the output voltage waveform settings for each channel.

• Signal Generator

Optimize the crystal arrangement to improve material consistency. Customization for metalization is possible.

• Ceramics

High-output electronic devices, laser systems, heat dissipation management, etc.

• Ceramics

Laser, optoelectronic devices, high output heat dissipation, and other high-end applications.

• Ceramics

The diamond window not only has excellent light transmittance at pump wavelengths, but its thermal conductivity is unmatched by other materials. The ultra-high thermal conductivity of CVD diamond allows for the rapid dispersion of heat generated by the laser medium into the surrounding environment. The precise polishing process enhances thermal conduction by ensuring close contact between the diamond window and the laser crystal, improving the efficiency and accuracy of laser output.

• Fine Ceramics

The "WLBI370A" can perform burn-in on devices such as Si, GaN, SiC, and ceramics using wafers, significantly improving the burn-in efficiency of the devices! It supports simultaneous burn-in of up to 20 wafers. Additionally, independent burn-in condition settings can be configured for each fixture. It fully protects each circuit with complete hardware. 【Features】 - Suitable for burn-in of wafers such as Si, GaN, SiC, and ceramics - Independent burn-in condition settings for each fixture - Capable of powering on all chips on a wafer simultaneously for burn-in - Voltage range customizable up to a maximum of 200V - Supports current monitoring during burn-in - Temperature range RT-200C Sold by layer (1 wafer is burned in with 1 layer of circuits), with the option for expansion, helping to reduce initial investment. *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

Our company's "Burn-in Equipment" is not chamber-based, but allows for temperature and power conditions to be controlled for each jig, making it user-friendly. 【Features】 ■ Simultaneous burn-in of up to 4224 devices per system ■ Temperature and power conditions can be controlled for each jig ■ Dedicated jigs support wire bonding, loaders, burn-in, unloaders, and inspection *For more details, please refer to the PDF materials or feel free to contact us.

• Other inspection equipment and devices

▶ High Precision and High Reliability Current Source Performance Supports output up to 1.5A and achieves a minimum pulse width of 3μs. Optimal control according to load minimizes overshoot and waveform distortion. ▶ High-Speed Test Performance Supports a maximum ADC sampling rate of 100MS/s. NPLC (integration time) values can be user-defined, allowing for flexible test control. ▶ Versatile Cable Design for Multiple Applications Stable output even with output cables up to 2m in length. High layout flexibility makes it suitable for equipment integration. ▶ Real-Time Reading of Pulse Current and Voltage Real-time reading of pulse current and voltage drop on the DUT is possible. Simultaneous monitoring and feedback of test conditions and measurement results. ▶ Synchronized Measurement with Multi-Channel and Multi-Model Synchronized measurements are possible between multiple channels and different SMU modules. Supports the construction of large-scale automated measurement systems.

• Power Supplies

The S3030F is a single-channel source measure unit (SMU) designed for high voltage and high power applications, capable of simultaneous output and measurement of voltage and current in a single unit. It supports a maximum power output of 180W, high voltage of ±3500V, high current of ±120mA (DC), and high resistance measurements of up to 10GΩ, featuring a compact and highly cost-effective design. This product is widely used in research and evaluation applications that require high voltage measurements, such as: ▶ Evaluation of power semiconductor characteristics like GaN / SiC ▶ Electrical testing of insulating materials and composite materials ▶ Measurement of high voltage leakage currents Additionally, the S3030F complies with SCPI commands, making it easy to operate through programming. It also supports synchronized operation of multiple units, allowing integration into evaluation systems such as production lines, contributing to improved measurement efficiency and reduced testing costs.

• Power Supplies

A benchtop SMU (Source Measure Unit) series that balances precision measurement and high-performance output, ideal for research and development and reliability testing. Semight's high-resolution SMU products cover a wide range of voltage and current, from ±200V/±1A (DC) to ±3A (pulse), and even up to ±60V/±10A (pulse), achieving measurement resolutions from a maximum of 1fA/1μV to 10fA/100nV. Equipped with a maximum ADC sampling rate of 1MS/s and a self-developed high-precision, fast-response control system (Adaptive PFC), it supports a wide range of applications from accurate measurement of small signals to high-speed pulse testing.

• Power Supplies

- ±200V/±3A (DC)/10A (pulse) - Minimum resolution 100fA/100nV - Maximum sampling 1M ADC - 5-inch LCD touch panel

• Power Supplies

▶ Adaptive High Precision and High-Speed Control Achieves high-speed and high-precision output even under diverse load conditions with user-configurable APFC parameters. ▶ High-Performance DC Measurement Supports high voltage and high current measurements with 4-quadrant source & measure functionality. Capable of high-resolution measurements of 1fA and 100nV. Equipped with auto-range functionality. ▶ High-Speed Testing Maximum ADC sampling rate of 1MS/s. Supports programmable settings for NPLC values. ▶ Versatile Measurement Modes Supports both local and remote sensing. Features sweep mode with up to 8K points including linear, log, and list options. Allows measurements with user-defined source delay settings. Supports synchronized measurements with an 8-channel internal trigger bus and 2-channel external DIO. ▶ Intuitive UI and Remote Control Remote operation via GUI tools on a PC is possible. Compatible with standard SCPI programming. ▶ Built-in Protection Features Equipped with protection functions against overheating, overvoltage, and overcurrent.

• Power Supplies

Our "KGD" is a testing device that performs 4Site parallel testing, capable of conducting static and dynamic tests at both room temperature and high temperature. The UPH is high, ranging from 1000 to 1200, with high testing efficiency, significantly reducing testing costs. It also supports various LD/ULD boxes. The sealed structure of the probe ensures the safety and reliability of the inspection. 【Features】 ■ Compatible with various LD/ULD boxes ■ Temperature range RT-200°C (optional -45°C) ■ Supports 3000V/1200A ■ Capable of full testing with 4Site parallel testing and static + dynamic tests ■ Specially designed circuits guarantee circuit inductance of less than 15nH *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

"Wafer level burn-in" is equipment that allows for burn-in testing of GaN and SiC devices at the wafer level, significantly reducing the inspection loss of power modules. It can accommodate simultaneous burn-in of up to 6 wafers. Additionally, independent burn-in condition settings are possible for each fixture. Complete hardware protects each circuit. 【Features】 - Suitable for burn-in of GaN and SiC wafers - Independent burn-in condition settings for each fixture - Allows simultaneous power-on and burn-in of all chips on the wafer - HTGB voltage ±75V, HTRB voltage 2000V (upgradeable) - Supports Igss, Idss, Vth, Idson testing - Temperature range RT-200C *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our "High-Power LD (Laser Diode) COC Tester," which is a fully automated COS inspection system that includes automatic jig pick-and-place, jig 2D code, and LIV spectrum inspection. In the multi-station inspection, the design of four inspection stations, parallel temperature control of the four stations, and serial LIV and spectrum testing improve the overall inspection efficiency of the machine. The COS jig enhances the stability of inspection parameters through excellent individual temperature control, temperature accuracy, and stability. 【Features】 ■ Fully automated COS inspection system including automatic jig pick-and-place, jig 2D code, and LIV spectrum inspection ■ Design of four inspection stations ■ Parallel temperature control of the four stations ■ Serial LIV and spectrum testing ■ Improved stability of inspection parameters through excellent individual temperature control, temperature accuracy, and stability *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our "High-Power LD Burn-In Equipment." The entire system accommodates 512 pieces of COS and allows for independent control for each layer. It supports different types of COS without interference between them. A water cooling system dissipates heat from the high-power laser. Additionally, monitoring of optical power is possible during the burn-in process. 【Features】 ■ The entire system accommodates 512 pieces of COS ■ Supports different types of COS without interference ■ Capable of monitoring optical power during burn-in *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

This product is a full test inspection equipment for LD chips that can be tested from low to high temperatures. It has two inspection stages and can simultaneously test 2 pieces of LD chips under different temperature conditions. It is compatible with LD chips such as DFB, EML, and EML + SOA. When removing chips from the blue sheet, a special method is used to avoid damaging the chips. Please feel free to contact us if you have any inquiries. 【Features】 ■ Supports inspection from low to high temperatures ■ Has two inspection stages ■ Uses a special method to avoid damaging chips when removing them from the blue sheet ■ Supports separation of 4 blue sheets and 8 bins per blue sheet after inspection *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The "LD (Laser Diode) COC Inspection Device" automatically automates operations and inspections, including fixture pickup, two-dimensional code reading, temperature management, and inspection. The inspection fixtures are shared with the burn-in system, and the COC fixtures do not separate the upper and lower fixtures throughout the entire process from inspection to burn-in, eliminating the need to exchange probe cards in between, significantly improving inspection direct rate and inspection stability. Additionally, depending on the type of fixture, up to 6 sets of fixtures can be placed simultaneously at once. Please feel free to contact us when needed. 【Features】 ■ Fully automates operations and inspections ■ COC fixtures do not separate the upper and lower fixtures throughout the entire process from inspection to burn-in ■ No need to exchange probe cards in between ■ Depending on the type of fixture, up to 6 sets of fixtures can be placed simultaneously *For more details, please refer to the PDF materials or feel free to contact us.

• Other inspection equipment and devices

The "LD (Laser Diode) COC Burn-In Device" is not chamber-type, but rather allows for temperature and power conditions to be controlled for each jig, making it a user-friendly piece of equipment. It supports COCs such as EML and DFB. Up to 4224 pieces of COC can be burned in simultaneously, and burn-in conditions can be freely set for each jig. Additionally, monitoring of optical power during burn-in is possible, and LIV testing is available as an option. 【Features】 ■ Simultaneous burn-in of up to 4224 pieces of LD COC per system ■ Control of temperature and power conditions for each jig ■ Compatible with COCs such as EML and DFB ■ Jigs support wire bonding, loaders, burn-in, unloaders, and COC inspection *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices