日本エンギス List of Products and Services

Engis Corporation's vertical grinding machine is a grinding system designed for hard and brittle materials, equipped with a high-rigidity and high-precision spindle (Engis HVG model). It achieves low-cost and high-precision wafer processing through semi-automatic control. Optional features include an auto-dressing mechanism for the grinding wheel, various thickness sensors for endpoint control of wafer thickness, and in-process thickness measurement technology. This equipment will be exhibited at SEMICON JAPAN 2024, held at Tokyo Big Sight from December 10 (Wednesday) to December 13 (Friday). We sincerely look forward to your visit. *Please feel free to contact us if you have any requests.

• Other processing machines

The tabletop CMP polishing machine 'EJ-380IN-CH-D' features a compact body that minimizes the installation space. It is a versatile tabletop lapping device that can meet a wide range of needs, from polishing sample pieces and small quantities of various parts for research and development purposes to full-scale precision polishing. <Features> - Automation of precision mirror surface processing - Body design with excellent chemical resistance 【Usable platen outer diameter: Φ380 mm】 Additionally, this device will be exhibited at the 27th Monozukuri World [Osaka] held at Intex Osaka from October 2 (Wednesday) to October 4 (Friday), 2024. Booth number: Hall 6, 38-5* We sincerely look forward to your visit. *Please feel free to consult us if you have any requests.

• Other processing machines

The Trinity-Y series "HVG-300DSO" is a grinding machine equipped with a two-axis mechanism that allows for both rough and precision grinding on a single work table. Since the workpiece can be mounted in one go, there is no error during attachment and detachment, enabling stable flatness and TTV. With the optional thickness measurement, the actual thickness of the wafer during processing can be measured in real-time, allowing for accurate detection of the endpoint after grinding. [Options] ■ Auto-dress mechanism ■ Thickness measurement system (available in contact and non-contact types) *You can view the product documentation via "PDF Download." Please feel free to contact us for inquiries.

• Grinding Machine

The EBM-250HSC is a device designed and developed for the bonding process of wafers and bonding plates (ceramic plates). It can be used before and after the lapping process to achieve high precision in wafer thickness, flatness, warpage, and parallelism.

• Wafer processing/polishing equipment
• Other abrasives
• Circuit board processing machine

The EBM-250HC is a device designed and developed for the bonding process of wafers and bonding plates (ceramic plates). It can be used before and after the lapping process to achieve high precision in the thickness, flatness, warpage, and parallelism of the wafers.

• Wafer processing/polishing equipment
• Other abrasives
• Circuit board processing machine

The Trinity-Y series "HVG-200-2Axis" is a grinding machine equipped with two processing axes, allowing for both rough and precision finishing on a single work table. Since the workpiece can be mounted in one go, there is no error during attachment and detachment, enabling stable flatness and TTV. It is suitable for grinding hard and brittle materials and is effective for small to medium lot production and research and development. 【Features】 ■ Compact design contributes to space-saving ■ Special specifications can be provided upon request *You can view the product documentation via "PDF Download." Please feel free to contact us with any inquiries.

• Grinding Machine

The substrates such as SiC (silicon carbide), GaN (gallium nitride), and PCD (sintered diamond), which are expected to expand in the market in the future, are difficult materials to process due to their hard and brittle nature. Among them, we would like to introduce a case study that achieved the polishing of sintered diamond, which is particularly challenging to process. [Polishing Results] ■ Surface roughness < 3nm ■ Processing time 4 hours (processing time with conventional methods 10 hours) ■ By using the high-speed high-pressure polishing machine 'EJW-400HSP' and the fixed grinding stone 'MAD Plate', we achieved a reduction in processing time by 6 hours. *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other abrasives
• Circuit board processing machine

In power devices such as SiC (silicon carbide) and GaN (gallium nitride), which are expected to see market expansion in the future, cost reduction is an important issue. Among these, we would like to introduce a processing case that achieved cost reduction through a method different from conventional processing processes. [Polishing Results] ■ Surface roughness < 0.5nm (subsequent process CMP) ■ TTV < 2μm / Warp < 10μm ■ Achieved double-sided grinding of SiC by using the high-speed pressure grinding machine 'EJD-6BY' and the fixed grinding stone 'MAD Plate'. *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other abrasives
• Circuit board processing machine

Utilizing the experience and knowledge gained from years of developing wrapping techniques, we have developed the grinding device ED-380ISR "Tetra," which mechanizes the fitting process to polish the mating surfaces of the cylinder block and valve plate, the heart of the swash plate axial piston pump. Among these, we would like to introduce a case that achieved a high contact ratio. [Grinding Results] ■ Surface roughness < 0.1μm ■ 95% + Contact Ratio * The single-sided lap machine is suitable for processing seal surfaces, swash plates, and piston shoe flat surfaces. * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other abrasives
• Circuit board processing machine

The "EJW-400HSP" is the latest model in the Trinity series designed for high-speed and high-pressure grinding. It is specifically designed for the high-precision and efficient grinding of polycrystalline sintered diamond (PCD). <Features> ◆ Sturdy body designed to consider vibrations at high rotational speeds ◆ Capable of incorporating a data logging system / temperature control system* (*Measures the actual surface temperature of the grinding wheel and maintains the optimal temperature condition during grinding through automatic control of processing pressure and grinding wheel rotation.) *For more information about the product, please download the catalog or contact us.

• Wafer processing/polishing equipment

The "Polishing Brush" comes in three types: straight, wheel, and cup. The brushes use natural hair. They have a long lifespan, and the hard bristles retain diamond compound for an extended period, enhancing the cutting ability of the diamond.

• Lubricants
• Chemicals
• others

Engis, which developed diamond slurry based on the demands of the electronics industry, supplies a variety of ultra-precision slurries.

• Lubricants
• others

At Japan Engis, which offers a full range of wrapping and polishing equipment, we are currently giving away our "Comprehensive Catalog," which includes the latest products, for free! Notably, we have the 'Bore Finish System' for the automotive and hydraulic industries. This new product improves inner diameter dimensional accuracy compared to traditional honing machine finishes! It significantly enhances production efficiency and reduces costs. Additionally, we have a wide variety of consumables listed, including slurries, brushes, and polishing cloths. ◎ We are currently accepting "live demonstrations" at our lab! Please contact us through "Inquiries." 【Contents Included】 ■ Precision wrapping equipment ■ Multifunctional polishing system "Trinity-Y" ■ Precision large wrapping/polishing equipment ■ Precision grinding machine series ◎ Other items listed include wrapping accessories, diamond slurries, polishing slurries, polishing cloths, wrapping plates, diamond pastes, and polishing materials for mold finishing, among many others!

• Other processing machines

The ultra-precision single-sided lapping machine 'EJW-400I' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ380 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of being equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

• Other processing machines

The ultra-precision single-sided lapping machine "EJW-1200IN" is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ1200 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of being equipped with a facing device (automatic plate correction device) - Standardly equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

• Other processing machines

The tabletop one-sided wrapping device 'EJ-380' is a tabletop model wrapping device that enables the automation of mirror surface processing. 【Usable table plate outer diameter: Φ380 mm】 <Features> - Can be used for polishing various materials by selecting the table plate (wrapping plate). - Automation of polishing is possible by combining the minimizer (slurry supply device) and the auto-stirrer (slurry stirring device). *Please feel free to contact us if you have any requests.

• Other processing machines

"HYPREZ Diamond Gel" is a gel-type abrasive that is ideal for polishing molds. Since "HYPREZ Diamond Gel" does not need to be diluted like diamond paste, it eliminates the hassle of dilution and ensures uniform polishing power. Additionally, being in gel form, it does not run off, providing excellent workability. 【Features】 ■ The gel effect retains the tool, allowing highly dispersed diamond abrasives to exhibit high polishing performance. ■ Suitable for various applications and materials as a hand wrap. ■ Available in both water-based and oil-based options. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

• Lubricants
• Chemicals
• others

Nihon Engis Co., Ltd. has an in-house lab capable of developing cutting-edge polishing processing technologies and new materials. Since its founding in 1983, the company has consistently worked to improve wrapping technology through the development of advanced wrapping machines and diamond slurries. We are currently offering the latest handbook titled "Fundamentals of Wrapping & Polishing" created by Nihon Engis for free! 【Contents】 - Positioning of polishing - What is the difference between wrapping and polishing? - Types of wrapping and processing mechanisms - Types and properties of diamond abrasives - Types and characteristics of slurries - What is the principle of classification? - About wrapping devices - Types of wrapping plates - What is Preston's law? - What is the Twyman effect? - Processing examples Additionally, we are offering the latest handbook "Fundamentals of Polishing Processing & Wrapping," which includes various data and processing images related to polishing, for free! *If you are interested, please download it from the link below.

• Wafer processing/polishing equipment

The materials of the high-pressure composite wrapping plates are a composite of polymer and metal powder, possessing a certain degree of flexibility and elasticity, which uniformly retains and fixes the diamond for grinding. <Product Lineup> - HYPREZ Iron: For rough processing - HYPREZ Copper: For intermediate finishing - HYPREZ Ceramic: For intermediate finishing - HYPREZ Tin TX-10: For finishing processing

• LED Module

The ALMET metal wrapping plate is a base plate made by mixing special metals with tin. It is ideal for precision finishing of various composite materials and more. <Product Lineup> - ALMET-510D - ALMET-515D - ALMET-518D - ALMET-5111D - ALMET-825D

• LED Module

The "Wrapping Stick" comes in three types: Hard, Soft, and Very Soft. - Hard Wood Stick: Laminated boards combined based on the direction of the wood grain are high-pressure compressed and fully bonded with resin. It is easy to shape and maintains its form well. Detailed hand processing allows for precise diamond wrapping in the mold. - Soft Wood Stick / Very Soft Wood Stick: These sticks are designed for intermediate or final finishing. They can be used with fine diamond compounds to achieve a mirror finish.

• Lubricants
• Chemicals
• others

This is a concentrated slurry formulated for mold polishing that requires a large amount of stock removal. Despite the high diamond concentration, it has excellent dispersion, ensuring that the amount of abrasive supplied to the mold polishing surface remains consistently stable, which maintains a uniform polishing precision.

• Lubricants
• Chemicals
• others

The hand-polishing abrasive "High Press Diamond Paste" comes in three types: W, OS, and L, tailored for different applications. ■ W Type Diamond Paste - A water-soluble paste that can be easily cleaned after polishing. - Ideal for tasks that are difficult with oil-based compounds. - If adding a lubricant, please use W type lubricant. ■ OS Type Diamond Paste - An oil-based, so-called oily paste. - Oil-based lubricants facilitate rapid cutting during lapping. It contains more lubricating material and has a self-lubricating effect. - If adding a lubricant, please use OS type lubricant. ■ L Type Diamond Paste - Suitable for wire drawing dies and heading dies. - Wire drawing carbide dies and heading dies require extremely dense diamond compounds. It is important to supply lubricant to the lapping area as needed according to the cutting cycle. - Also used for flat lapping of hard tools, mechanical seals, and other applications with significant material removal.

• Lubricants
• Chemicals
• others

The multi-layout multifunctional wrapping system "Trinity-Y" is a device developed to accommodate next-generation materials such as wide-gap semiconductors. It allows for the flexible selection of mechanisms optimal for various new materials, consolidating these functions into a single unit to achieve space-saving design and build a highly functional processing system without waste. For more details, please contact us or download the catalog.

• Wafer processing/polishing equipment

A compact and multifunctional CMP-compatible double-sided polishing device in size 6B has been developed from the "Trinity-Y" series. It is made using full stainless steel dust covers and thoroughly corrosion-resistant materials throughout, making it suitable for all types of slurries and ideal for simultaneous double-sided polishing of difficult-to-machine materials. Additionally, by combining it with other Trinity-Y devices, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste. 【Specifications】 ○ Polishing plate outer diameter φ386 × inner diameter φ148 mm ○ Plate rotation speed maximum 10–60 r.p.m. For more details, please contact us or download the catalog.

• Wafer processing/polishing equipment

Engis's single-pass bore finishing technology provides bores with far superior fit compared to those finished with traditional honing. Traditional honing finishes utilize reciprocating tools that employ relatively quickly worn grinding stones, which need to expand and contract during each cycle. In contrast, the single-pass technology performs the operation on a series of extremely fine preset diamond tools, distributing the load across each tool during a single pass. This high-performance tool, combined with an extremely wear-resistant diamond coating, enables the single-pass process to achieve excellent bore sizes. 【Features】 ○ Provides bores with far superior fit compared to those finished with traditional honing. For more details, please contact us or download the catalog.

• Other processing machines

We have developed the EJ-380ISR "Tetra," a grinding device that mechanizes the "fitting work" previously performed to polish the mating surfaces of the cylinder block and valve plate, which are the heart of a slant plate axial piston pump. 【Features】 ○ Capable of handling special specifications such as different surface roughness and different spherical shapes, which were impossible to process with conventional fitting methods. ○ Achieves a high contact ratio using stable grinding motion and special grinding tools. ○ Can reduce the lubrication efficiency and noise of hydraulic pumps.

• Wafer processing/polishing equipment

In the manufacturing of hydraulic valves, processes such as "inner diameter machining of valve bodies" and "machining of inner sleeves" typically use honing tools. However, manual honing processes have the disadvantage of variability in machining precision, requiring advanced skills and time, which leads to unstable product quality. Additionally, honing tool abrasives take time to expose the grinding particles, often resulting in lengthy machining operations. Engis offers "single-pass machining," which perfectly resolves these issues related to inner diameter processing! 【Benefits We Provide】 - Achieves "roundness, cylindricity, and straightness" that cannot be attained with honing - Reduces the likelihood of leaks and the frequency of repairs - Decreases downtime - Improves quality and productivity - Significantly contributes to cost reduction *For more details, please contact us or download the catalog.

• Other processing machines

"HYPREZ Diamond Gel" is a gel-type abrasive that is ideal for polishing molds. Since there is no need to dilute it like diamond paste, it saves the hassle of dilution and ensures uniform polishing power. Additionally, because it is in gel form, it does not run off, providing excellent workability. 【Features】 ■ The gel effect allows the tool to hold the highly dispersed diamond abrasives, demonstrating high polishing performance. ■ Suitable for various applications and materials as a hand wrap. ■ Available in both water-based and oil-based options. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

• Other abrasives

The Single Pass Bore Finishing System utilizes tools with excellent wear resistance and diamond coating to perform internal diameter processing in a "single pass" without repeated reciprocating motion. By conducting operations on finely preset diamond tools, the burden on each tool is reduced, achieving high precision in roundness, cylindricity, and straightness for bore processing. This reduces the potential for leaks and repair frequency when the processed components are integrated into devices such as automobiles, construction machinery, and agricultural equipment, leading to expected reductions in downtime. 【Features】 ■ Roundness of 0.2μm or less, with a high process capability of Cpk>1.67 ■ Tools are equipped with diamond coating that minimizes wear ■ Stable processing accuracy suppresses the occurrence of out-of-spec products and rework ■ The 'LPM-4000' is available in 4/6/8mm spindle models, with a maximum bore diameter of 152mm (6 inches) ★ We will be exhibiting at the 15th China International Machine Tool Exhibition (CIMT2017) ★ *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

• Other processing machines

A flatness measuring device for a reference plate, essential for precision processing in wrapping equipment. - Product lineup HLG-8 HLG-15 HLG-24 HLG-36 We offer a diverse range of products to match the size of the lap reference plate.

• LED Module

The compact tabletop automatic wrapping machine EJ-200I minimizes the installation space with its compact body. It is a tabletop wrapping device that can meet a wide range of needs, not only for research and development applications such as sample polishing and polishing of various small parts, but also for full-scale precision polishing processing. <Features> - Automation of precision mirror surface processing - Compact design for space-saving installation

• Other surface treatment equipment

The ultra-precision single-sided lapping machine 'EJW-460I' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ460 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of being equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

• Other processing machines

The ultra-precision single-sided lapping machine 'EJW-610I' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ610 mm】 <Features> - Can be used for polishing various materials by selecting different plates (lapping plates) - Can be equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

• Other processing machines

The ultra-precision single-sided lapping device 'EJW-710I' is a highly versatile machine that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ710 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Can be equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

• Other processing machines

The ultra-precision single-sided lapping device 'EJW-910I' is a highly versatile machine that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ910 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Can be equipped with a facing device (automatic plate correction device) - Standard water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

• Other processing machines

The minimizer (automatic sprayer) can accurately set the spray time and supply amount of diamond slurry and lubricant to match the wrapping cycle. Since the supply time of the slurry can be controlled according to the wrapping conditions, issues caused by excessive or insufficient supply of abrasives will not occur.

• Other surface treatment equipment

During the operation of the wrapping device, this stirrer continuously stirs the slurry, preventing the sedimentation of diamond abrasives and enhancing the dispersion of the slurry.

• Other surface treatment equipment

The forced drive unit is used to forcibly rotate the ceramic ring and the workpiece. Standard sizes are available for 15 inches and 18 inches. *Other sizes can also be manufactured.

• Other surface treatment equipment

The ceramic ring evenly charges the diamond abrasive particles from the slurry sprayed on the lap plate onto the surface of the plate. The use of the ceramic ring efficiently fixes the diamonds, preventing chipping and scratching. <Product Lineup> - Compatible with lap plates ranging from 8 inches to 48 inches. *Ceramic rings of other sizes can also be custom quoted and manufactured.

• LED Module

It is used for wrapping and polishing when attaching workpieces with wax, etc. The material can be selected from SUS and ceramics. <Product Lineup> - Compatible with flat plates from 12 inches to 36 inches. *We can also provide quotes for adhesive plates of other sizes.

• LED Module

The bonding machine (water-cooled type) is designed for the attachment work of fixing workpieces to the bonding plate using wax, among other tasks. It enables good adhesion through a pressurized air press. By combining it with a water cooling unit, further efficiency can be achieved. <Product Lineup> - Compatible with bonding plates from 12 inches to 24 inches - Number of processing axes: 1 to 4 axes *Other sizes and number of axes can be accommodated separately.

• LED Module

The Engis precision granite surface plates are made from specially selected precision granite. As a result, there is very little wear or deformation even after long-term use.

• LED Module

Weight adjustment is possible with the center pole method. For 12 inches: WS-12 type (maximum load: 8kg, weights of 1kg, 2kg, 3kg) For 15 inches: WS-15 type (maximum load: 12kg, weights of 2kg, 3kg, 4kg)

• LED Module

It is a cooling device for the cold water wrapping machine (EJW series) and bonding machine. It can be selected according to the size of the wrapping plate.

• LED Module