アイテス List of Products and Services

We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed. Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant circuit board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melting. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal area, raising suspicions that the undercoat layer may be exposed. Next, a cross-sectional sample was prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which showed that the protective film and resistive material appeared to be melting. At Aites, we consider and propose processing, pretreatment, observation methods, and combinations tailored to the observation objectives and the composition and structure of the samples based on our accumulated know-how. Please feel free to contact us for consultations. [Analysis Content] ■ Surface Observation ■ Cross-Sectional Observation *For more details, please download the PDF or feel free to contact us.

• Contract Analysis

We would like to introduce a case where the rebound and vibration absorption properties of rubber materials were evaluated using dynamic mechanical analysis (DMA). In the "Comparison of Vibration Absorption of Rubber (Temperature Dispersion Measurement)," dynamic mechanical analysis was conducted using two types of rubber materials. Rubber A is considered to have superior vibration absorption properties (lower rebound) than Rubber B, with larger E" and tanδ in temperature ranges above -10°C. In the "Comparison of Vibration Absorption of Rubber (Frequency Dispersion Measurement - Master Curve)," the dynamic mechanical properties of Rubber A and B were compared across frequencies. By creating a master curve, it is also possible to predict the viscoelastic behavior in frequency ranges that cannot be directly measured. 【Measurement Details】 ■ Comparison of Vibration Absorption of Rubber (Temperature Dispersion Measurement) - Rubber A is considered to have superior vibration absorption properties (lower rebound) than Rubber B, with larger E" and tanδ in temperature ranges above -10°C. ■ Comparison of Vibration Absorption of Rubber (Frequency Dispersion Measurement - Master Curve) - Rubber A is considered to have superior vibration absorption properties than Rubber B, with larger tanδ across a wider frequency range. *For more details, please download the PDF or feel free to contact us.

• Analytical Equipment and Devices

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure points using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure points using TEM *For more details, please download the PDF or feel free to contact us.

• Other Testing Contract
• Contract Analysis

We would like to introduce the dynamic viscoelastic measurement of CFRP conducted by our company using the bending mode. When performing dynamic viscoelastic measurements using DMA, CFRP is generally highly elastic, and it is considered that measurements using the bending mode are suitable due to its applications. The deformation modes of DMA can measure in any mode as long as the size requirements are met, but it is ideal to select appropriate conditions based on the material's shape, elastic modulus, and the purpose of the measurement. If you have a subject for which you would like to measure dynamic viscoelasticity, please feel free to consult us. 【Measurement Modes】 ■ Tensile ■ Compression ■ Bending (two-point/one-point/three-point) ■ Shear *For more details, please download the PDF or feel free to contact us.

• Contract measurement
• Other measurement and measuring equipment

This document introduces examples of visualizing the internal state of capsules in three dimensions and obtaining elemental information data through EDX analysis of powders. In the X-ray CT analysis, it was observed that there were slight air gaps inside the capsule, and it was also visually confirmed that the particle size was not uniform, with some larger particles included. In the SEM-EDX analysis, elemental analysis was conducted on any particles contained within. At an acceleration voltage of 15 kV, carbon (C), oxygen (O), as well as calcium (Ca), chlorine (Cl), iron (Fe), phosphorus (P), and sodium (Na) were detected. [Analysis Details] ■ X-ray CT Analysis: X-ray transmission observation of the capsule ■ SEM-EDX Analysis: Elemental analysis of any particles contained within *For more details, please download the PDF or feel free to contact us.

• X-ray Inspection Machine

We will introduce a case study comparing cross-section preparation methods on the surface coating layer of a golf ball and observing the effects of heat from CP processing. There are two layers of coating on the outermost layer of the cover layer, and we conducted a comparison of cross-section preparation methods using this coating layer. SEM observations of the cross-sections prepared using three different methods were performed. While cross-section preparation of soft materials is effectively done using cross-section ion milling (CP), the physical properties may change due to the heat generated during CP processing. In such cases, cross-section preparation using cryo-CP, which mitigates the effects of processing heat through cooling, is effective. 【Cross-section preparation methods】 ■ Mechanical polishing ■ CP ■ Cryo-CP (-50°C) *For more details, please download the PDF or feel free to contact us.

• Other analytical and testing equipment
• Other processing machines

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution of TEM and STEM has improved, and performance has been significantly enhanced, including the capability for EDS analysis with four detectors. Additionally, it is equipped with Drift Corrected Frame Integration (DCFI), which allows for the integration of multiple frames while correcting for drift. 【Specifications (excerpt)】 ■ Acceleration Voltage: 200kV, 80kV ■ TEM Information Limit: ≦0.11nm ■ STEM Resolution: ≦0.14nm ■ Drift Corrected Frame Integration (DCFI) ・Integration of multiple frames while correcting for drift *For more details, please download the PDF or feel free to contact us.

• Other microscopes
• Transmission electron microscope

At Aites Co., Ltd., we conduct "Poisson's ratio measurement." Poisson's ratio is the ratio of longitudinal strain to lateral strain that occurs when a load is applied to an object, and it is necessary for strength calculations of materials. In the downloadable materials, we introduce the results of attaching strain gauges to test specimens, applying tensile loads using a universal testing machine, and examining the longitudinal and lateral strains obtained from the strain gauges. Please feel free to download and take a look. 【Measurement Examples】 ■ Measurement using strain gauges ■ Measurement using video extensometers *For more details, please download the PDF or feel free to contact us.

• Other Testing Contract
• Contract measurement

It is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "Heating Deformation Observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in a heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state. 【Features】 ■ It is possible to visualize and confirm shape changes during heating. ■ Depending on your preferences, it is possible to create profiles for temperature rise speed, waiting time, and temperature settings. *For more details, please download the PDF or feel free to contact us.

• Contract Inspection

We would like to introduce a case where cross-sections were created and observed for the adhesive parts of pull-back car tires using different methods. Upon conducting SEM observations of the created cross-sections, fillers present within the rubber were confirmed. It was found that the dispersion state of the fillers and the appearance of the adhesive interface were not clear with liquid nitrogen fracturing or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allowed for a clear observation of the dispersion state of the fillers contained in the rubber and the appearance of the adhesive interface with the plastic substrate. 【Cross-section Preparation Methods】 ■ Liquid Nitrogen Fracturing (-196℃) ■ Mechanical Polishing ■ Cryo CP (-150℃) *For more details, please download the PDF or feel free to contact us.

• Surface treatment contract service
• Processing Contract

We would like to introduce the "Tensile Property Evaluation Using a Strain Gauge Compatible with High-Extension Flexible Materials" that we offer. Tensile tests on NR rubber were conducted using both contact-type (compatible with high-extension and soft materials) and non-contact type (video) strain gauges, and the results were compared. To accurately determine strain in tensile tests, it is necessary to select an appropriate strain gauge and testing conditions based on the target material and measurement objectives. We will provide suggestions tailored to your inquiries. 【Comparison of Strain Gauges】 ■ Contact Type (Compatible with High-Extension and Soft Materials) - Suitable for materials with large extensions - Not suitable for brittle or easily deformable materials - Not usable in constant temperature baths ■ Non-Contact Type - No restrictions on materials *For more details, please download the PDF or feel free to contact us.

• Testing Equipment and Devices
• Other Testing Contract

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat prevention treatment for resin embedding. Without this treatment, the temperature can rise to 138°C during curing. However, with the heat prevention treatment applied, we were able to keep the heat generation during curing to within 30°C, even with a large amount of resin. 【Measurement Results】 ■ Without heat prevention treatment for a large amount of resin (large container) - Heat generation reached up to 138°C during curing. ■ With heat prevention treatment for a large amount of resin (large container) - Heat generation during curing was kept within 30°C. *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

Our company conducts "rubber thermal aging tests" that help evaluate the properties of materials in actual use environments. Using a method compliant with JIS K6257 (Method for determining thermal aging characteristics of vulcanized rubber and thermoplastic rubber), rubber test pieces are suspended in a gear oven to create samples with varying heat treatment times. Additionally, tensile tests are performed on heated natural rubber (NR) to investigate changes in mechanical properties, while hardness is measured simultaneously. Changes in the properties of the rubber are also examined, confirming that rubber elasticity is lost and the material becomes harder with heating. [Property Evaluation] ■ Heating Temperature: 120℃ Tensile Test: Universal Testing Machine ■ Hardness Measurement: Micro Rubber Durometer *For more details, please download the PDF or feel free to contact us.

• Other Testing Contract
• Material Evaluation Test

Our company's "Component Analysis of Organic Matter" often utilizes FT-IR and GC/MS. In FT-IR measurements, it is possible to analyze the main components of organic matter by comparing the IR spectrum of known substances. Additionally, if you want to analyze not only the main components of unknown substances but also trace amounts of organic matter such as additives, we recommend performing GC/MS measurements. 【Features】 <FT-IR Measurement> ■ Capable of analyzing the main components of organic matter ■ Can also analyze some inorganic substances *For more details, please download the PDF or feel free to contact us.

• Other analysis and evaluation services
• Contract Analysis
• Ingredient analysis

We would like to introduce the "Substrate Deformation Observation" using a 3D shape measurement machine. By applying pressure to a PCB substrate, referencing the bending tests of plastics and PCB substrates, we measure the changes using a 3D shape measurement machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure. 【Features】 ■ Measurement results can be confirmed with a color palette and line profile ■ It is possible to visually verify the shape and amount of deformation caused by the applied pressure *For more details, please download the PDF or feel free to contact us.

• Analysis Services
• Analytical Equipment and Devices

We would like to introduce the "Tracking Camera Cross-Section Observation" through mechanical polishing. Regarding the structure of the tracking camera components, the lens can be confirmed when viewed from above, and while it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is the same as that of the RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode. 【Features】 ■ The cross-sectional structure is a back-illuminated CMOS structure, similar to that of the RGB sensor. ■ There is no color filter layer since color information is not needed for the tracking camera. ■ A jagged uneven shape was observed on the surface of the photodiode. *For more details, please download the PDF or feel free to contact us.

• Analysis Services
• Analytical Equipment and Devices

At Aites Co., Ltd., we conduct "NMR analysis of liquid crystal compounds." NMR is an analytical method that reveals the connections between atoms that make up a molecule, and it is used alongside mass spectrometry and infrared spectroscopy for determining the structure of compounds. In the downloadable materials, we introduce information obtained from NMR using 4-butoxy-4'-cyanobiphenyl (CAS number 52709-87-2) as an example, including 1H NMR, 13C NMR, and DEPT measurements. Please feel free to download and take a look. [Measurement Examples] ■ 1H NMR measurement ■ 13C NMR measurement and DEPT measurement ■ Other NMR measurement techniques *For more details, please download the PDF or feel free to contact us.

• Other analysis and evaluation services

We would like to introduce our "Appearance Observation and Measurement Services." We offer a variety of equipment to meet your needs, including appearance observation before and after reliability testing, solder joint observation, as well as dimensional and surface roughness measurements of various components. You can also leave the pre-observation processing to us. Our company has IPC-A-610 certified IPC specialists on staff. We assist with observations in accordance with international standards and provide consultations to address various observation-related concerns. 【Equipment】 ■ VHX-X1 ■ VHX-5000 ■ VR-6200 ■ VK-X200 *For more details, please download the PDF or feel free to contact us.

• Visual Inspection Equipment
• Other measurement, recording and measuring instruments
• Other contract services

At our company, we created a cross-section of the CMOS image sensor component associated with VR goggles manufactured by Company A through mechanical polishing while keeping the component in its original state, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the method for creating cross-sections. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.

• Other analysis and evaluation services

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in a mounted state on a circuit board and in an unmounted state. In the mounted module, it was observed that the temperature change was slightly slower, and correspondingly, the change in strain was also slow. This is believed to be due to the delayed transfer of heat to the module when it is mounted. 【Test Overview】 ■ Strain Gauge Used - Foil strain gauge for composite materials: compatible linear expansion coefficient 1x10^-6, base 15x5mm ■ Test Conditions - Hold at -40℃ for 3 hours → 15℃/min → Hold at 80℃ for 3 hours * 5 cycles * For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

At AITES Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We assist with observations in accordance with international standards, offer consultations, and address various concerns regarding observations. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to contact us when needed. 【Service Contents】 ■ Reliability Testing ■ Solder Joint Observation ■ Whisker Observation ■ Cross-Sectional Observation *For more details, please download the PDF or feel free to contact us.

• Other analysis and evaluation services

This product is a SiC defect inspection device that reveals defects that had not manifested without electrical current by using UV laser irradiation, thereby shortening the evaluation cycle of research and development. 【Features】 ■ UV Irradiation - Achieves uniform laser irradiation from small sizes like chips to the entire wafer. - Calculates hole concentration from epitaxial thickness and doping concentration, and proposes radiation intensity corresponding to current density. ■ PL Measurement Function - Observes defects from multiple angles at wavelengths of 380nm, 420nm, and over 700nm. - Enables identification and classification of layered defects (buffer layer, drift layer, substrate interface) using image processing technology. - Includes mapping function with coordinates of defect occurrence. * Please feel free to consider a trial measurement (free of charge) first. * For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We will introduce the analysis of organic and inorganic composite materials using FT-IR and EDX. FT-IR measurements were conducted on the glossy and non-glossy areas of the surface of the PET bottle label, and the IR spectra differed between the glossy and non-glossy areas. Additionally, SEM-EDX measurements were performed on the glossy and non-glossy areas, and the EDX spectrum and backscattered electron image revealed that the non-glossy area contained sulfur (S) and barium (Ba), which were not detected in the glossy area. [Analysis Content] ■ Organic analysis using FT-IR - FT-IR measurements on the glossy and non-glossy areas of the PET bottle label surface ■ Inorganic analysis using SEM-EDX - SEM-EDX measurements on the glossy and non-glossy areas *For more details, please refer to the PDF document or feel free to contact us.

• Business Intelligence and Data Analysis

We will introduce the composition analysis of active materials in LIB cathode materials using ICP emission analysis. The cathode material of lithium-ion batteries (LIB) is one of the important components that influence the battery's voltage and energy density, and the composition of the cathode material significantly affects the battery's performance. ICP emission analysis can determine which elements are present in a liquid sample and in what quantities. 【Features】 - Qualitative and quantitative analysis of approximately 70 types of elements is possible. - Applicable to various analyses, including qualitative and quantitative analysis of additives and impurities contained in the sample, as well as quantitative analysis of substances under the RoHS directive. *For more details, please download the PDF or feel free to contact us.

• Business Intelligence and Data Analysis

We will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are obtained, and the resulting images are corrected for positional misalignment between SEM images and visualized in three dimensions using three-dimensional construction software (Avizo). By combining the position identification technology for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area. [Contents] ■ About Slice & View and three-dimensional reconstruction ■ Continuous SEM observation and three-dimensional reconstruction of failure locations identified by OBIRCH *For more details, please download the PDF or feel free to contact us.

• 3D measuring device

At Aites Co., Ltd., we conduct "analysis of optical films." Optical films used in smartphones and other devices have various functions depending on their structure and materials. We can investigate the transmission characteristics of anti-peeping films using angle-variable spectrophotometry and analyze the mechanisms of function manifestation through cross-sectional observation and Raman analysis. 【Features】 ■ Measurement of optical properties ■ Analysis of the mechanisms of function manifestation *For more details, please download the PDF or feel free to contact us.

• Contract Analysis

Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, while capturing and monitoring the operational status such as screen displays. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subject using loggers for parameters like voltage, current, resistance, and temperature is widely practiced. For samples where monitoring with loggers is difficult, we combine a constant temperature and humidity chamber equipped with a front glass window option, a camera, and monitoring software to conduct environmental tests while capturing and monitoring the condition of the testing equipment. [Example of monitoring an LCD panel] - Interval shooting at regular intervals - Motion detection shooting that captures changes in condition - Monitoring of indicator lamps is also possible *For more details, please download the PDF or feel free to contact us.

• Environmental Test Equipment

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. [Summary] < Elemental Analysis by EDX > - Surface analysis shows the distribution of Ni, Cu, and Sn within the compounds. < Crystallographic Orientation Analysis by EBSD > - By combining this with elemental analysis using EDX, it is possible to estimate the composition. - In some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. *For more details, please download the PDF or feel free to contact us.

• Contract Analysis

We would like to introduce the results of our investigation into the behavior of strain during moisture absorption and drying using strain gauges. It was observed that the material expands when absorbing moisture and contracts back to its original state when drying, with the strain returning to the condition prior to moisture absorption. Regarding FR-1, it is presumed that it did not return to its original state due to changes in the chemical structure of the material caused by hydrolysis. 【Test Overview】 ■ 85℃ 50% ⇒ 85℃ 85% ⇒ 85℃ 50% ■ Test Materials ・FR-1 Paper Phenolic (single-sided board) ・FR-4 Glass Epoxy (single-sided board) ■ Strain Gauge ■ Foil Strain Gauge for Composite Materials *For more details, please download the PDF or feel free to contact us.

• Contract measurement

We would like to introduce our "Microscopic FT-IR Imaging Measurement." It is possible to visualize the distribution of substances as a two-dimensional image within a specified plane. This allows for the evaluation of changes in the distribution of substances that would be difficult to assess with regular point measurements, using visible images. 【Analysis Suitable for Imaging Measurement】 ■ Evaluation of the diffusion state of substances (assessment of the mixing of substances in a mixture, evaluation of the locations of impurities, etc.) ■ Evaluation of molecular structural changes (assessment of the degree of oxidation from the surface to the interior of resin products, etc.) ■ Qualitative analysis of minute foreign substances that are difficult to sample *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the cross-section milling width can be expanded up to a maximum of 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the width of processing is possible ■ The previously localized observation range can be significantly expanded ■ Equipped with a cooling temperature adjustment function to control temperature rise caused by ion beam irradiation ■ The observable range is approximately 8mm *For more details, please download the PDF or feel free to contact us.

• Processing Contract
• Other measurement, recording and measuring instruments

We would like to introduce the "IOL testing of discrete semiconductors" that we conduct. Under normal temperature conditions, we repeatedly turn the power ON/OFF, applying stress to the device due to temperature changes caused by the device's own heat generation during power ON. During the power OFF (cooling) phase, forced cooling is also performed using a fan. 【Adjustment Conditions】 ■ Temperature Rise: 125℃ ■ Heating Time: 5 minutes ■ Cooling Time: 5 minutes ■ Fan Operating Time: 2 minutes *For more details, please download the PDF or feel free to contact us.

• Public Testing/Laboratory

We will introduce the observation of metallic structures through chemical treatment. By performing chemical treatment on metallic samples, it is possible to clearly observe the metallic structure. Observing the structure can confirm the condition of the sample as well as the history of applied heat and stress, providing clues about the quality of the product and any defects based on the structural shape. In the published catalog, you can find details on the observation of metallic structures, such as the macrostructure of aluminum plates and the soldered parts of copper terminals. Additionally, we offer other services such as cross-sectional observation and various analysis services. Please feel free to contact us if you have any requests. [Contents] ■ Macrostructure of aluminum plates ■ Soldered parts of copper terminals ■ Brass screws ■ Welded parts of SUS rods *For more details, please download the PDF or feel free to contact us.

• Public Testing/Laboratory

There are three main measurement methods for "microscopic FT-IR": "transmission method," "reflection method," and "ATR method." In "microscopic FT-IR," which combines FT-IR with an optical microscope, it is possible to measure small substances on the order of several tens of micrometers that are difficult to measure with conventional FT-IR, using an aperture (field stop). While the transmission method is the basic measurement method in microscopic FT-IR measurements, the reflection method or ATR method may be more suitable depending on the shape of the sample and the feasibility of sampling. 【Characteristics of Measurement Methods】 ■ Transmission Method - Infrared light is irradiated onto the sample, and the transmitted light is measured. - Information is obtained from the thickness of the material that the infrared light has passed through. ■ Reflection Method - Infrared light is irradiated onto the sample, and the reflected light is measured. - Information is obtained from the surface of the sample. *For more details, please download the PDF or feel free to contact us.

• Other microscopes

We would like to introduce an example of "observation of semiconductors through mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those produced by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment

We would like to introduce the "Strain Measurement of Thermal Shock Testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record the strain data in real-time during the test. The strain behavior during the thermal shock test was observed for two types of copper-clad laminates, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4. [Test Conditions] ■ Temperature Cycle: -30°C to 120°C ■ Exposure Time at Each Temperature: 30 min ■ Test Materials - FR-1 Paper Phenolic (Double-sided board) - FR-4 Glass Epoxy (Double-sided board) ■ Strain Gauge: Foil strain gauge for printed circuit boards *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

We would like to introduce a case of particle size measurement of cathode active materials using laser diffraction conducted by our company. In air or liquid, laser light is irradiated onto particles, and the angular dependence of the intensity of light scattered by the particles is measured. The angular dependence of the scattered light intensity is measured, and from that data, the particle size distribution (particle size distribution) is calculated. Commercially available reagents were used as samples, and measurements were conducted in a dry state without dispersing in a solvent. The particle size measurement results for NMC oxide showed a monodisperse state with particle sizes below several tens of micrometers, and the median diameter was calculated to be 12 μm. 【Case Overview】 ■ Measurement Method ・Dry ■ Particle Size Measurement Results for NMC Oxide ・Monodisperse state with particle sizes below several tens of micrometers ・Median diameter is 12 μm *For more details, please refer to the PDF document or feel free to contact us.

• Laser microscope
• Other measurement, recording and measuring instruments

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

We would like to introduce our service for "various cross-sectional observations of mounted components on circuit boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, you can see that numerous components are tightly soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can prevent normal operation. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

We would like to introduce our "Chemical Analysis Concierge Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis method within organic or inorganic analysis is the best fit. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analytical instrument can measure different targets, it is necessary to choose a method that aligns with your objectives based on the information available. 【Features】 ■ Reporting only the data for which results have been obtained ■ Results report can include up to 2 methods ■ If you wish to receive results for more than 3 methods, additional costs will apply *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

Our company conducts thorough evaluations and verifications of FPD from various angles. In structural analysis, we assess FPD products and products incorporating advanced technologies for any potential issues in characteristics or structure, and provide reports. In defect analysis, we approach and investigate the causes of product defects in increasingly sourced overseas products via the shortest route. Additionally, in reliability testing, we propose suitable reliability testing methods and conditions based on our extensive know-how, tailored to the customer's objectives and needs. 【Our Strengths】 ■ Problem-Solving Ability - Proposals for analytical methods well-versed in the liquid crystal manufacturing process ■ Investigative Ability - Deep insights and advanced, sub-micron level fine sample processing techniques ■ Specialized Equipment - Considerations using a combination of diverse analytical instruments *For more details, please refer to the PDF document or feel free to contact us.

• Public Testing/Laboratory

We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) is deposited on its surface for conductivity. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and the connection state, cross-sectional observations were conducted, revealing that the particle deformation amount was "medium," indicating an appropriate level of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects. [Summary] - In implemented ICs, slight "warping" or "tilting" can cause differences in particle deformation between the edges and the center, potentially leading to display defects. - By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

Due to the suspected malfunction at the switch part of the appliance that has stopped powering on, we will introduce a case study along with the work flow. First, we check for any shape changes such as swelling, cracking, or discoloration through visual observation. In the electrical check, we verify whether the malfunction can be reproduced and whether it is an open or short circuit. An internal observation using X-rays revealed that the contact terminals inside the switch had melted, scattered, and disappeared, leading to an open circuit failure. Ultimately, we will submit a report that includes the consideration of the cause. We also welcome inquiries regarding analysis after non-destructive testing, so please feel free to consult us. 【Basics of Non-Destructive Observation】 ■1: Visual Confirmation ■2: Electrical Confirmation ■3: Internal Observation with X-rays *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

Our company analyzes the spectra of UV-curable resins before and after UV irradiation. We irradiate UV-curable resin (acrylic type) with ultraviolet light and obtain Raman spectra before and after irradiation. Through the analysis of the Raman spectra, the curing reaction can be estimated to some extent. For a more detailed analysis of the curing mode, analyses such as GCMS are necessary, but our company can provide not only structural estimation but also reaction estimation through spectral analysis. 【Features of Raman Spectral Analysis】 ■ The curing reaction can be estimated to some extent. ■ We provide support for both structural estimation and reaction estimation. *For more details, please refer to the PDF materials or feel free to contact us.

• Contract Analysis
• plastic

This is an example of evaluating the maximum pore diameter and pore size distribution of non-woven fabric sheets using the bubble point method. The sample is immersed in a chemical solution and air pressure is applied. The pressure is increased until it overcomes the surface tension of the chemical solution absorbed in the sheet, resulting in the appearance of bubbles; this pressure is referred to as the bubble point. The maximum pore diameter can be calculated based on the bubble point pressure and the surface tension of the chemical solution. 【Calculation Formula】 ■d = Cy/P ・d: Maximum pore diameter ・C: Constant ・y: Surface tension of the chemical solution ・P: Differential pressure *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices