List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

181~225 item / All 5261 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.

  • Other Pumps

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Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!

We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"

Achieving surprisingly low prices while using new ion exchange resin instead of recycled resin. Significantly reducing installation costs and providing a stable supply of high-quality pure water.

  • Other consumables
  • Other semiconductor manufacturing equipment
  • Pure water production equipment

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An overview of advanced packaging technologies from 2.5D/3D chiplets to thermal management, reliability evaluation, and PFAS compliance.

  • Other semiconductor manufacturing equipment
  • Other semiconductors
  • Technical Seminar

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11/10 Webinar Advanced Semiconductor Packaging Technology

■Title: "The Complete Picture of Advanced Semiconductor Packaging Technology - From 2.5D/3D and Chiplets to Thermal and Power Solutions, Reliability Evaluation, and PFAS Compliance -" ――A systematic explanation of advanced packaging technologies that support the evolution of AI semiconductors. In addition to the latest technological trends in 2.5D/3D packaging, chiplets, CoWoS, TSV, and glass core substrates, you will learn broadly about manufacturing processes, yield improvement, failure analysis, reliability evaluation, PFAS regulatory compliance, and thermal and power design. Practical case studies and evaluation analysis techniques directly related to work will also be explained in detail. - Basics of semiconductor packaging technology and the evolution of trends - Latest trends in 2.5D/3D and chiplet technology - Reliability testing and failure analysis techniques - Key points for yield improvement - PFAS regulatory compliance and sustainable materials - Thermal and power design technologies for advanced packaging aimed at AI - Engineers and researchers from chemical, electronics, electrical, and automotive manufacturers - Personnel involved in semiconductor backend processes and assembly technologies - Personnel involved in materials and equipment development - Those who want to systematically learn about advanced packaging technologies

One unit supports 4 channels! Cost reduction and space-saving possible!

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  • Other semiconductor manufacturing equipment

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HJS K-Series Bellows Pump for Semiconductor Manufacturing Equipment | High Quality, Low Pulsation, High Durability

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  • Other semiconductor manufacturing equipment

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It is a vacuum drying device that allows recipe operation through touch panel control.

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  • Resist Device

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With the wet zero-gap system, barrel polishing is possible without deformation even for extremely small and thin workpieces, such as those with a thickness of 0.1mm!

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  • Other machine tools
  • Wafer processing/polishing equipment

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We will be exhibiting at TCT Japan 2026 - Comprehensive Exhibition of 3D Printing & AM Technology.

Dear Sir/Madam, I would like to express my congratulations on the continued prosperity of your company. I also extend my heartfelt gratitude for your exceptional support. We will be exhibiting at TCT Japan 2026. - MetalFab420K, a high-output metal 3D printer by Additive Industries from the Netherlands - EF Series, a special electro-polishing machine, and CF Series, a disc finishing machine by OTEC from Germany We will display samples and provide explanations of their functions and performance. We kindly invite you to visit our exhibition booth and appreciate our offerings.

Compatible with double helical brushes for mold cleaning and seal brushes for transport devices.

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  • Conveyor
  • Plastic Mould
  • Molding Equipment

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For adjusting shaft misalignment and angle when installing a magnetic coupling linear rotary introducer (MFL)!

  • Sputtering Equipment
  • Other semiconductor manufacturing equipment

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We will manufacture a vacuum chamber.

  • CVD Equipment
  • Sputtering Equipment
  • Other semiconductor manufacturing equipment

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Please use it for deposition protection and light/beam blocking for the viewing port.

  • CVD Equipment
  • Sputtering Equipment
  • Other semiconductor manufacturing equipment

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Expand the lithography function of your SEM.

  • Electron beam lithography equipment

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Automatically distill 1ppb grade hydrochloric acid, hydrofluoric acid, and nitric acid to 10ppt grade, reducing the procurement costs of high-purity acids.

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  • Other semiconductor manufacturing equipment
  • Distillation Apparatus

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Achievements in the semiconductor industry worldwide, including the United States and Japan. A range of PFA products that contribute with outstanding reliability and purity.

  • Other semiconductor manufacturing equipment

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OptiSeal VSE is a versatile external pressure face seal. It features low friction, excellent chemical resistance, and can be used in environments ranging from extremely low temperatures to high temper...

  • Sealing
  • Other machine elements
  • Other semiconductor manufacturing equipment

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Our company has established a comprehensive production system that includes not only difficult-to-machine materials processing and metal machining, but also design, processing, assembly, and inspectio...

  • Semiconductor inspection/test equipment

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A rod/piston combined seal compatible with the P-number grooves of JIS B2401, suitable for use in harsh environments. It has low friction and excellent heat and chemical resistance.

  • Other machine elements
  • Other semiconductor manufacturing equipment
  • Sealing

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A seal with excellent chemical resistance that maintains the cleanliness of the semiconductor manufacturing environment.

  • Other machine elements
  • Other semiconductor manufacturing equipment
  • Sealing

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High-precision spray coater designed for developers for process development of various nano materials such as touch panels and fuel cells!

  • Coater

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To the chemical industry pursuing chemical resistance. Achieving both chemical resistance and low friction.

  • Other machine elements
  • Other semiconductor manufacturing equipment
  • Sealing

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A 3D spray coater that can be applied to any 3D shape. It reads the substrate shape with a laser scanner and automatically generates the application path.

  • Coater

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Resist coater for cover glass integrated touch panel (OGS)

  • Resist Device

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Systematically acquire semiconductor packaging technology from the basics. Learn about quality control and the latest packaging trends in one day.

  • Technical Seminar
  • Other semiconductor manufacturing equipment
  • Other semiconductors

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We offer a lineup of electron beam lithography systems, ranging from high-precision types with an acceleration voltage of 100 kV to universal types with SEM functionality, capable of meeting various n...

  • Electron beam lithography equipment
  • Other surface treatment equipment

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Establishing a consistent production system for design, processing, assembly, and inspection, not only for difficult-to-cut materials processing and metal machining.

  • Semiconductor inspection/test equipment

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Our company has introduced the latest processing equipment and is committed to precision parts processing with thorough quality control, striving to enhance customer trust and satisfaction.

  • Semiconductor inspection/test equipment

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Brix value = sugar content? In coolants, it does not directly translate to concentration. I will explain the concept of concentration management using conversion factors in an easy-to-understand manne...

  • Wafer processing/polishing equipment

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Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.

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  • Bonding Equipment

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Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.

  • Bonding Equipment

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A controllable current transducer and frequency that continuously monitors wire deformation.

  • Bonding Equipment

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Achieving high-quality bonds optimized for automotive powertrains.

  • Bonding Equipment

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The optimal bonding solution for the aerospace field, which requires high reliability.

  • Bonding Equipment

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High-precision bonding solutions that meet miniaturization needs.

  • Bonding Equipment

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Providing the optimal bond for high-brightness LED manufacturing.

  • Bonding Equipment

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Reliable bonding solutions that support the robustness of industrial robots.

  • Bonding Equipment

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Bonding solutions that contribute to improving productivity and reducing costs in home appliance manufacturing.

  • Bonding Equipment

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Providing optimal and high-quality bonding that supports multi-pin configurations.

  • Bonding Equipment

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Providing the ideal bond for manufacturing high-sensitivity sensors.

  • Bonding Equipment

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