List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

406~450 item / All 5153 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

Micro-capacity inspection with high resolution! Capable of inspecting various products such as thin-film RF filters and accelerometers.

  • Tester

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USB3.2 10Gbps 5 Megapixel SWIR Model

  • Monochrome camera
  • Semiconductor inspection/test equipment

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A device that transfers 25 wafers to a carrier or boat at once.

  • Semiconductor inspection/test equipment

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A device for arranging broken wafers in order of lot number.

  • Semiconductor inspection/test equipment

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The adoption of a unique blade tip positioner and an adjustable collet holder allows for quick and accurate visual drill setup!

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  • Wafer processing/polishing equipment

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Supports manufacturing with precision of +0, -0.005mm (5μm) in outer diameter grinding processing. Centerless finishing of free-cutting phosphor bronze round bars.

  • probe
  • Semiconductor inspection/test equipment
  • Non-ferrous metals

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With our core technology, we respond to our customers' themes! Haimeka will walk alongside our customers!

  • Contract manufacturing
  • Other semiconductor manufacturing equipment
  • Circuit board design and manufacturing

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Contributes to the efficiency and quality improvement of semiconductor manufacturing processes. Since there are no specialized parts, maintenance is easy, allowing for quick recovery. It achieves low ...

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  • Semiconductor inspection/test equipment

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We provide consistently! Electronic components, electronic modules, electronic equipment inspection devices.

  • Semiconductor inspection/test equipment

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We will analyze trace amounts of organic contaminants adhered to the material using TD-GC/MS.

  • Contract measurement
  • Semiconductor inspection/test equipment

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Shape observation and simple quantitative analysis using SEM-EDX.

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  • Contract Inspection
  • Wafer
  • Other semiconductor manufacturing equipment

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Bringing precision dispensing closer to you. Precision dispenser 'Quspa-Dx'.

  • Other semiconductor manufacturing equipment

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Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.

  • Other semiconductor manufacturing equipment

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Notice of Exhibited Products and Events for Nepcon Japan 2024

We are pleased to announce that Shinwa will be exhibiting at the Internepcon Japan, which will be held from January 24 to January 26. Date: January 24 (Wed) - January 26 (Fri) 10:00 AM - 5:00 PM Location: Tokyo Big Sight, East Hall 1 Booth Number: [E4-8B] At our booth, we will be showcasing the newly redesigned dispenser device "Quspa-LX" for the first time. You will be able to see a demonstration. Additionally, we will introduce the TXC Corporation's crystal oscillators, which hold the number one global market share, and the CMOS camera modules for automotive applications from the Foxconn Group. On January 25 (Thu), the famous YouTuber Monozukuri Taro will be appearing at our booth! He will clearly explain the appeal of our new products. There will be two sessions on that day, so don't miss this opportunity! Morning: 11:00 AM Afternoon: 3:00 PM We look forward to seeing you there. Please note that pre-registration is required for entry to Internepcon Japan this year. If you have not registered, please do so via the link.

We propose a custom-made dispenser that fulfills your ideals.

  • Other semiconductor manufacturing equipment

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Achieved over 50% higher throughput compared to conventional serial testers by adopting Per-Pin architecture!

  • Tester

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Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26

Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=

High-performance wafer-level test system compatible with wafers from 8 inches to 12 inches!

  • Tester

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Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26

Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=

Supports PAM4/NRZ signals and covers the 1.6TBASE/CEI-224G standard!

  • Tester

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Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26

Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=

High-Spec Dedicated Load Grinding Device

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  • Wafer processing/polishing equipment

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A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!

  • Wafer processing/polishing equipment
  • Other abrasives

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Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!

  • Wafer processing/polishing equipment
  • Other abrasives

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Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.

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  • Wafer processing/polishing equipment
  • Other abrasives

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A collection of case studies on the implementation of process analyzers / online analyzers actually introduced around the world!

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  • Analytical Equipment and Devices
  • Moisture Measuring Device
  • Semiconductor inspection/test equipment

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A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...

  • Other semiconductor manufacturing equipment
  • Other semiconductors
  • Technical Seminar

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Liquid hazardous materials can also be safely transported with all-fiber solutions.

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  • Wafer
  • Resist Device
  • Photomask

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It is an environmentally friendly cleaning device that does not use chemical solutions.

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  • Other semiconductor manufacturing equipment

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It can achieve high sensitivity detection for all AMC categories.

  • Semiconductor inspection/test equipment

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The installation direction can be freely set! Achieving maintenance-free operation with a long lifespan of 30 million rotations!

  • Slip Ring
  • Sputtering Equipment

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A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

  • High pressure cleaner
  • Resist Device

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

Clean drying using high-purity IPA is possible for devices, wafers, glass, components, etc., regardless of material or shape.

  • Other semiconductor manufacturing equipment

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Our local subsidiary in Thailand supports your business! - A trading company known for its flexibility.

  • Other semiconductor manufacturing equipment
  • others
  • Other Connectors

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A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.

  • Other semiconductor manufacturing equipment

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The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!

  • Tester

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It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!

  • Tester

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Features stable solder ball mounting and improves productivity through an inline system.

  • Other semiconductor manufacturing equipment

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Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.

  • Semiconductor inspection/test equipment

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A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

  • High pressure cleaner
  • Other semiconductor manufacturing equipment
  • Resist Device

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

  • Other semiconductor manufacturing equipment

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.

  • Wafer processing/polishing equipment

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It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

  • Bonding Equipment

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Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.

  • Other semiconductor manufacturing equipment

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Notice of Participation in "Semicon Japan 2018"

We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009

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