List of Semiconductors and ICs products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

• Cooling system

We guarantee consistently stable wraps and promise a magnificent mirror finish.

• Other semiconductors

Extremely uniform with minimal lot variation.

• Other semiconductors

It is a resin that can be cured in a short time by exposing it to ultraviolet light with a wavelength of 200 to 400 nm.

• Other semiconductors

PEEK is a thermoplastic super heat-resistant resin that combines excellent mechanical properties and functionality.

• Other semiconductors

Excellent corrosion resistance (e.g., hundreds of times that of stainless steel in the case of concentrated hydrochloric acid)

• Other semiconductors

It is an abrasive with strong crushing strength and thermal stability.

• Other semiconductors

A lineup of 5 types of grain sizes.

• Other semiconductors

As of April 1, 2016, the old product name YUPIMORE(R) has been changed to SEPLAS SA.

• Other semiconductors

We have assembled equipment that is strong in the analysis of organic materials such as resin and carbon composites.

• diode
• Contract measurement
• Composite Materials

GC/MS: Gas Chromatography-Mass Spectrometry

• Contract Analysis
• Memory

AFM: Atomic Force Microscopy Method

• Contract Analysis
• Wafer

You can investigate the changes in degassing intensity while maintaining the temperature.

• Contract Analysis
• Memory

The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).

• Contract Analysis
• Transistor

The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.

• Contract Analysis
• magnet
• Memory

Microscopic structural analysis of amorphous films is possible through simulation.

• Contract Analysis
• Memory

It is possible to confirm the stress distribution in the sample cross-section.

• Contract Analysis
• Wafer

It is possible to evaluate trace metals in ppm orders.

• Contract Analysis
• Ceramics
• Wafer

Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.

• Contract Analysis
• Transistor
• Power storage device

Non-destructive three-dimensional observation of the internal structure of a discrete package.

• Contract Analysis
• Other semiconductors

Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.

• Contract Analysis
• Other semiconductors

Evaluation of microscopic atomic structures is possible through computational simulation.

• Contract Analysis
• Other semiconductors

Reverse engineering of DRAM on the product's internal substrate.

• Contract Analysis
• Memory

It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.

• Contract Analysis
• Memory

It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.

• Contract measurement
• Transistor
• Memory

Simultaneous measurement of inorganic and organic components in minute specific areas.

• Contract measurement
• Wafer
• Memory

We evaluate abnormalities inside the device non-destructively.

• Contract Analysis
• Other electronic parts
• Transistor

Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.

• Wafer
• Contract measurement
• Other semiconductors

Shape observation and simple quantitative analysis using SEM-EDX.

• Contract Inspection
• Wafer
• Other semiconductor manufacturing equipment

It is effective to differentiate between the two methods depending on the surface structure of interest.

• Contract Analysis
• Memory

High-sensitivity analysis of various solutions, such as pure water and wafer cleaning liquids, is possible.

• Contract Analysis
• Wafer
• Water quality testing

It is possible to evaluate the competitive adsorption of multiple molecules using the focus parameters for film formation (temperature, pressure).

• Contract Analysis
• Other electronic parts
• Memory

From semiconductor and LCD manufacturing equipment parts to nursing and welfare equipment parts. MINWA delivers high-precision and high-quality machining.

• Other semiconductors
• LCD display
• Other machine elements

Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.

• Dedicated IC

The introduction of the laminated substrate reduces the degradation of the forward characteristics of the body diode!

• diode

The encapsulating materials for advanced semiconductor packages require various characteristics such as low stress, moisture resistance, and high reliability. Guidelines for the design and evaluation ...

• Other semiconductors
• Engineering Plastics
• Technical Seminar

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...

• Other semiconductor manufacturing equipment
• Other semiconductors
• Technical Seminar