List of Annealing furnace products
- classification：Annealing furnace
1～45 item / All 85 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.
- Other semiconductor manufacturing equipment
- Annealing furnace
- CVD Equipment
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
- Annealing furnace
- Heating device
- Electric furnace
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace
Multi-Target Sputtering Device [MiniLab-125] Compatible with Φ8" SiC Coating Equipped with 1000℃ Heater Stage! Compact Size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Simultaneous deposition of three components + one component Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to three cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed on the touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber type can also be manufactured. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.
- Annealing furnace
- Heating device
- Electric furnace
Multi-Target Sputtering Device [MiniLab-125] Compatible with Φ8" SiC Coating Equipped with 1000℃ Heater Stage! Compact Size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Simultaneous deposition of three components + one component Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to three cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed on the touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber type can also be manufactured. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely accommodates various purposes from research and development to small-scale production.
- Annealing furnace
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
Multi-Target Sputtering Device [MiniLab-125] Compatible with Φ8" SiC Coating Equipped with 1000℃ Heater Stage! Compact Size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Simultaneous deposition of three components + one component Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to three cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed on the touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber type can also be manufactured. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
Compact, space-saving, energy-efficient! High-performance ultra-high temperature experimental furnace for R&D.
- Annealing furnace
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
![[Nanofurnace] BWS-NANO Thermal CVD ...](https://image.mono.ipros.com/public/product/image/0d0/2000191194/IPROS99314670218218380543.jpeg?w=280&h=280){kind=small}
Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.
- CVD Equipment
- Annealing furnace
- Heating device
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations with precisely adjusted process gas pressure (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace
VOXIA box X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 0–150kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 49.5μm, 6.75 million pixels! * Sample size: Φ100mm ◉ Vcap (control software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (reconstruction software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with an image size of 992 x 992 pixels and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D display analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodat...
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
Multi-Target Sputtering Device [MiniLab-125] Compatible with Φ8" SiC Coating Equipped with 1000℃ Heater Stage! Compact Size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Simultaneous deposition of three components + one component Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to three cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed on the touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber type can also be manufactured. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
- Heating device
- Electric furnace
- Annealing furnace
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace
Multi-Target Sputtering Device [MiniLab-125] Compatible with Φ8" SiC Coating Equipped with 1000℃ Heater Stage! Compact Size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Simultaneous deposition of three components + one component Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to three cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed on the touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber type can also be manufactured. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Max 1000℃, maximum 3 systems for MFC, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
- Annealing furnace
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
BH Series [UHV Compatible Ultra-High Temperature Vacuum Thin Film Experiment Substrate Heater] Max 1800℃
It can be applied to various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. We offer custom-made solutions to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requests. ● Easy replacement of the auxiliary heater wire. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating. ● Base flange and vacuum feedthrough.
High-precision control of ±3℃ × multi-stage control, a continuous furnace that automates mass production in a space-saving manner.
- Heating device
- Annealing furnace
- Drying Equipment
Achieving high-precision temperature control of ±1.5℃.
- Heat Treatment Drying Equipment
- Annealing furnace
- Drying Equipment
Expansion to advanced packages: Processing is possible on a 510×515mm substrate.
- Sputtering Equipment
- Etching Equipment
- Annealing furnace
![[Sintering Material Compatible] Vac...](https://image.mono.ipros.com/public/product/image/43427/IPROS15682486374808681803.png?w=280&h=280){kind=small}
Large substrate-compatible vacuum and reducing atmosphere sintering furnace │ Capable of multi-purpose processing such as soldering, sintering bonding, and Cu via firing.
- Annealing furnace
- Reflow Equipment
![[Case Study of Annealing Equipment]...](https://image.mono.ipros.com/public/product/image/2009035/IPROS17844705013903780260.png?w=280&h=280){kind=small}
We will introduce examples of annealing equipment suitable for small-lot production of various types and large components!
- Annealing furnace
A Comprehensive Explanation of the Benefits and Applications of Formic Acid Reduction (Manufactured by Unitec Japan)
- Annealing furnace
Know-how in designing and manufacturing various devices! Powerful support with abundant knowledge and experience.
- Annealing furnace
- Heating device
- controller
Utilizing hydrogen gas, stainless steel bright treatment is possible!
- stainless
- Annealing furnace
- Electric furnace
Heat recovery type, low running cost, hot air dryer for painting.
- Other painting machines
- Drying Equipment
- Annealing furnace
Heat recovery type, low running cost, paint drying oven.
- Other painting machines
- Drying Equipment
- Annealing furnace
Dryer Dry Tech Price Information Public Site Now Available
We have launched a price information website for the painting-specific dryer, Drytech. The site features product information and sizes focused on standard models of Drytech, both front and single-door types, as well as custom products and options, including performance and price information. We have disclosed price information to facilitate a quicker process from consideration and decision-making to implementation. Please make use of it.
Supports tray transport! Achieves excellent substrate temperature distribution and gas flow method.
- Annealing furnace
- Heating device
Maximum substrate heating temperature of 1000℃! Reduces element loss specific to the substrate surface heating process!
- Heating device
- Annealing furnace
Usable from R&D to mass production! Vertical furnace with automatic transport compatible with 3 to 6-inch wafers.
- Annealing furnace
The furnace dimensions are 3.5m wide, 3.5m high, and 7.0m deep. It is capable of heat treatment for large workpieces!
- Heating device
- Industrial Furnace
- Annealing furnace
Notice of participation in 'THERMOTEC 2026 9th International Industrial Furnace and Related Equipment Exhibition' from September 9 (Wednesday) to September 11 (Friday), 2026.
NARITA Manufacturing Co., Ltd. will be exhibiting as part of the NARITA Group at the 'THERMOTEC 2026 9th International Industrial Furnace and Related Equipment Exhibition' held at Tokyo Big Sight. This exhibition, themed "Environment, Heat, Future - Let's Think Together About Efficient Heat Technology and a Sustainable Future," is an international exhibition where advanced industrial furnaces and heat technologies come together. We plan to showcase three products that can be used with hydrogen, including a compact variable control valve, an orifice meter, and a needle valve. We sincerely look forward to your visit.
No warm-up/cool-down time. High-quality continuous annealing processing is possible.
- Annealing furnace
- Other processing machines
By achieving ultra-high temperature treatment and excellent temperature uniformity, batch processing of boule ingots and wafers is possible, minimizing defects and dislocations.
- Annealing furnace
- Other semiconductor manufacturing equipment
- Other metal materials
Due to lamp heating, RTP and RTCVD processing is possible! Quartz tube-type chamber.
- Annealing furnace
Turbo pump compatible! Low temperature (1100°C) / high temperature (1300°C) pyrometer.
- Annealing furnace
Supports a maximum substrate size of 156mm x 156mm! Compatible with vacuum or atmospheric transport systems and can be equipped with a load lock.
- Annealing furnace
Rapid cooling mechanism after annealing! Introducing the high-speed heat treatment equipment from Annealsys.
- Annealing furnace
We will introduce a case where "Eco Keeper" was applied to an annealing furnace that was experiencing severe heat release and environmental deterioration!
- Other safety and hygiene products
- others
- Annealing furnace
Kaneko Chemical Cleaning Agent Product Line
- Annealing furnace
A quartz tube type annealing device commonly used for alloying and reducing resistance of electrode films in compound semiconductors. It is a high-temperature processing type equipped with a rapid coo...
- Annealing furnace
- Heating device
Supports small-diameter wafers (4 inches) and niche processes for compound semiconductors. Compatible with both crystal processes and wafer processes (alloying and electrode annealing).
- Annealing furnace
- Electric furnace
- Other surface treatment equipment