List of Circuit board processing machine products
- classification：Circuit board processing machine
301～360 item / All 364 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Compact space-saving tabletop ACF bonding device.
- Circuit board processing machine
- Other mounting machines
The grip can be used permanently!
- Circuit board processing machine
- Other consumables
Introduced a processing machine equipped with IFRIT (Ifrit) from Cyber Laser Co. It enables high-precision micro-machining of difficult-to-process materials and achieves reduced friction.
- Circuit board processing machine
- Other processing machines
- Processing Contract
Air-free, hassle-free laminator
- Other semiconductor manufacturing equipment
- Circuit board processing machine
- Vacuum Packaging Machine
The dust prevention measures are different from previous exposure devices!
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Processing technology that allows flexible responses tailored to customer needs, from a single prototype to mass production.
- Circuit board processing machine
High-performance flip chip bonder for multi-variety cell production lines.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production purposes
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production with automatic ACF attachment.
- Circuit board processing machine
Elimination of coating unevenness and nozzle clogging with a unique nozzle.
- spray
- Circuit board processing machine
- Other semiconductor manufacturing equipment
IC bonding device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production use.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
High-density plasma is generated over a large area by a unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Molding Equipment
- Circuit board processing machine
- Plasma surface treatment equipment
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
Implementation Solution Service
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Notice of Participation in the 22nd Fine Tech Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions
Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 22nd Fine Tech Japan, which will be held at Tokyo Big Sight from April 11 (Wednesday) to April 13 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (CO2 reduction) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, combining low capital investment with low running costs, which is its greatest economic advantage. On the day of the event, we will conduct a demonstration using the compact tabletop MyPL-Auto150, allowing you to experience actual large-area plasma irradiation. We sincerely look forward to your visit. 【Contact Information for Inquiries】 Well, Inc. Packaging Solutions Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-plasma.jp/
Real-time monitoring system for semiconductor packaging process anomalies
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Dispenser & UV irradiation device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Ultrasonic flip chip bonder
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
We are committed to manufacturing printed circuit boards with a pattern accuracy of 0.1μm.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
We will create products that meet your specifications, so please feel free to contact us.
- Circuit board processing machine
For samplers, thermocouples, composite probes, and ceramic fiber spoons, please leave it to us.
- Circuit board processing machine
Leave the design and manufacturing of vacuum devices to us!
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Inspection with a solder printing inspection machine.
- Circuit board processing machine
Automatic Soldering Robot (TX-I224)
- Soldering Equipment
- Circuit board processing machine
Vacuum three-dimensional thermal pressurization device
- Circuit board processing machine
Applying high-speed automatic machine technology, productivity is more than doubled! Router-type circuit board separator.
- Circuit board processing machine
Automatic Soldering Robot (TX-M444)
- Soldering Equipment
- Circuit board processing machine
Automatic soldering robot (MINIMAX 2)
- Soldering Equipment
- Circuit board processing machine
Patterning of various metal thin films
- Circuit board processing machine
- Processing Contract
We handle the installation and manufacturing of gas supply equipment, as well as special material gas piping work.
- Circuit board processing machine
- Other semiconductor manufacturing equipment
- cabinet
It performs splitting at approximately twice the speed of conventional splitting speeds using a 2-spindle system.
- Circuit board processing machine
Dust between patterns can be removed without damage! Circuit board vacuum cleaner.
- Other processing machines
- Circuit board processing machine
Achieving non-contact drive! A film cleaning machine that eliminates dust removal power fluctuations.
- Circuit board processing machine
- Other semiconductor manufacturing equipment
- Other packaging machines
Research and development small-sized developer SPD40
- Other surface treatment equipment
- Circuit board processing machine
- Other laboratory equipment and containers
Small-scale peeling machine for research and development SPS40
- Other surface treatment equipment
- Circuit board processing machine
- Other laboratory equipment and containers
Small Development Printing Device for Research and Development HPD40
- Other surface treatment equipment
- Circuit board processing machine
- Other laboratory equipment and containers
Small thin plate developing device FBD40
- Other surface treatment equipment
- Circuit board processing machine
- Other laboratory equipment and containers
An FPC of 0.03t can be transported sheet by sheet without a jig! A peeling device for small thin plates.
- Other surface treatment equipment
- Circuit board processing machine
- Other laboratory equipment and containers
Compact Ultra-High Precision Development Device MPD40
- Other surface treatment equipment
- Circuit board processing machine
- Other laboratory equipment and containers
Batch-type plasma ashing device for 50 wafers at once.
- Etching Equipment
- Ashing device
- Circuit board processing machine
Direct-acting solenoid valve
- Resist Device
- Evaporation Equipment
- Circuit board processing machine
Manual XY stage
- Circuit board processing machine
- Power Transmission Equipment
- Other work tools
Press-fit connector insertion device
- Other processing machines
- Circuit board processing machine
Analysis of the LCD Implementation Device Market and Demand Trends for LCD Driver ICs
- Bonding Equipment
- Circuit board processing machine
- Other semiconductors
Attach it to your open press machine and repurpose it as a vacuum press machine at low cost.
- Tester
- Circuit board processing machine
- Other semiconductor manufacturing equipment
2004 Market/Application Demand Analysis for TAB/COF IC Tape Substrates
- Circuit board processing machine
- Printed Circuit Board
- others
2005 SMT Mount Market Analysis
- Circuit board processing machine
2004 SMT Mounting & Automatic Visual Inspection Machine Market Analysis
- Semiconductor inspection/test equipment
- Circuit board processing machine
- Visual Inspection Equipment