We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Film forming equipment.
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Film forming equipment Product List and Ranking from 37 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Film forming equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. マツボー Tokyo//Trading company/Wholesale
  2. プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  3. 栗田製作所 本社・京都事業部 Kyoto//Industrial Electrical Equipment
  4. 4 Creative Coatings Co., Ltd. Tokyo//Electronic Components and Semiconductors
  5. 5 京浜ラムテック Kanagawa//Manufacturing and processing contract
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Film forming equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Polyparaxylene vapor deposition film formation device マツボー
  2. Plasma Ion Injection Film Deposition Device PBII-R1000 栗田製作所 本社・京都事業部
  3. RAM inline sputtering deposition system 京浜ラムテック
  4. 4 Powder Low-Temperature (Room Temperature) ALD Film Deposition Device CMP-400 Creative Coatings Co., Ltd.
  5. 5 Low-temperature DLC film deposition device (multi-layer ta-C, hydrogen-free) Creative Coatings Co., Ltd.

Film forming equipment Product List

46～60 item / All 72 items

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Graphene CVD deposition device

Graphene CVD deposition device

Equipped with a rapid cooling mechanism using slide movement of the furnace.

This is a tubular furnace thermal CVD device for synthesizing graphene films. It is equipped with a slide movement mechanism for the furnace, allowing for rapid heating and cooling of samples. An optional motor-driven automatic slide function can also be added. Additionally, by adding a turbo vacuum pump as an option, even higher quality graphene can be deposited.

  • Other physicochemical equipment
  • CVD Equipment

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Tabletop CNT/Graphene Film Deposition Device

Tabletop CNT/Graphene Film Deposition Device

This is a tabletop CVD device that can easily synthesize long-length powder CNTs, vertically aligned CNTs, and graphene films.

Of course, organic liquid raw materials, as well as hydrocarbon raw gases such as acetylene gas and methane gas, are standardly equipped with introduction ports for H2 reduction gas, making it easy to synthesize various types of CNTs. Additionally, rapid cooling of the substrate heater is possible, allowing for easy film formation of graphene membranes.

  • Other processing machines

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Organic EL film formation device

Organic EL film formation device

It is a hybrid deposition device that allows for the deposition of organic materials and metal materials in the same chamber. Co-evaporation of organic and metal materials is possible.

Eight organic deposition cells (KOD-Cell) for organic material film formation are available, and during metal material deposition, a metal deposition cell is standardly equipped in the same room. Both the organic and metal systems are configured with small-sized crucibles, focusing on minimizing chamber contamination within the device chamber. Additionally, it is a system that can be connected to a glove box. This system is a hybrid deposition device that allows for film formation of organic materials and metal materials in the same room.

  • Evaporation Equipment
  • Organic EL
  • Other clean room equipment and facilities

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Sputtering and deposition source composite thin film deposition device [nanoPVD-ST15A]

Sputtering and deposition source composite thin film deposition device [nanoPVD-ST15A]

Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.

Three types of film formation components are installed in the chamber: resistance heating evaporation source (metal evaporation), organic evaporation source (organic materials), and magnetron sputtering (metal and insulating materials), allowing for various thin film experimental setups to be accommodated within a single chamber. ◉ Three combinations are available: 1. Sputter cathode + resistance heating evaporation source x2 2. Sputter cathode + organic evaporation source x2 3. Sputter cathode + resistance heating source x1 + organic evaporation source x1 (*DC sputtering only) - Evaporation range: Φ4 inch / Φ100 mm - Vacuum exhaust system: Turbo molecular pump + auxiliary pump (rotary or dry scroll pump) - Substrate rotation and vertical lifting stage - Max 500℃ substrate heating heater - Quartz oscillator film thickness sensor - 7” touch panel HMI operation (includes 'IntelliLink' Windows PC remote monitoring software)

  • Sputtering Equipment
  • Evaporation Equipment
  • Annealing furnace

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Huz Technonet DLC Coating Device

Huz Technonet DLC Coating Device

Technology accelerates within possibilities.

DCL refers to a carbon film that has properties similar to diamond. It possesses significant characteristics such as an extremely hard surface, and there are expectations for its use in industrial materials and processed products, as well as the birth of new materials.

  • Other semiconductor manufacturing equipment

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Metal film + protective film forming device

Metal film + protective film forming device

A must-see for engineers considering new film formation methods! Fully automated film formation of metal films and protective films on resin substrates.

The newly developed injection molding machine-linked high-speed sputtering and polymerization system, SPP-SERIES, enables automatic film formation of metal films and protective films on resin substrates used in automotive and decorative parts. It is capable of fully automatic vacuum film formation (sputtering and polymerization) on injection molded substrates. 【Target Products】 ◆ Automotive headlamp reflectors ◆ Mirrors ◆ Metal decorative films *For more details, please contact us or download the PDF to view.

  • Vacuum Equipment
  • Sputtering Equipment

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Solid Source ECR Plasma Deposition Device "AFTEX-9000 Series"

Solid Source ECR Plasma Deposition Device "AFTEX-9000 Series"

Low-temperature process, high refractive index control, high-speed reactive film formation, dense and flat film.

The "AFTEX-9000 series" is a device capable of achieving high-quality nano thin film formation at low temperatures and with low damage. It supports substrate sizes of up to 8 inches and can accommodate up to three ECR plasma sources, significantly improving productivity by operating them simultaneously. Please use our equipment for nano thin film formation. 【Features】 ■ A fully automated C to C single wafer system with a multi-chamber design that can connect up to three ECR deposition modules for 8-inch substrates. ■ Achieves high productivity with simultaneous deposition using three ECR plasmas. ■ Allows for the setting of transport flow, deposition chamber, and deposition process through recipes, enabling fully automated deposition of multilayer films with any material. ■ Excellent uniformity is achieved through substrate tilt rotation and low-pressure deposition. ■ An in-device spectroscopic system (optional) enables measurement of film thickness, refractive index dispersion, etc. ■ Directly reacts raw material particles from solid sources with a highly active ECR plasma flow, eliminating the need for expensive exhaust treatment equipment and being environmentally friendly. *For more details, please refer to the catalog or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Solid Source ECR Plasma Deposition Device "AFTEX-2300"

Solid Source ECR Plasma Deposition Device "AFTEX-2300"

It is possible to obtain highly crystalline thin films at low temperatures! A cost-effective plasma deposition device.

The "AFTEX-2300" is a high-performance solid source ECR plasma deposition system equipped with a microwave branch-coupled ECR ion source, a load-lock mechanism, and a turbo molecular pump, all at a low price. Thin films grow under the irradiation of high-density ions controlled at low energies of 10-30 eV, resulting in dense, high-quality thin films with atomic-level smoothness. Thanks to the ion assist effect, it is possible to form compound thin films such as oxide and nitride films without high-temperature heating, and it is also possible to obtain highly crystalline thin films at low temperatures. 【Features】 ■ Equipped only with the basic functions of a solid source ECR plasma deposition system ■ Lower price compared to automatic deposition systems ■ Achieves long-term stable operation ■ Clean deposition environment ■ Various interlock mechanisms adopted *For more details, please refer to the catalog or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Solid Source ECR Plasma Deposition Device "AFTEX-8000 Series"

Solid Source ECR Plasma Deposition Device "AFTEX-8000 Series"

A fully automatic multilayer film forming device that can form multilayer films with excellent uniformity!

The AFTEX-8000 series is a fully automatic multi-layer film formation device that features two ECR plasma sources arranged at an angle in a single film formation chamber, capable of forming high-quality optical thin films and multi-layer films with excellent uniformity on substrates up to 8 inches in diameter. By using a high-activity, high-density ECR (Electron Cyclotron Resonance) plasma source and placing a target in the plasma extraction section, it achieves ECR plasma deposition using a solid source. There is no need to use hazardous gases like those in CVD, eliminating the need for exhaust gas treatment, making it an environmentally friendly film formation technology. 【Features】 ■ High insulation film characteristics ■ Multi-layer films ■ Dense and flat films ■ Low damage ■ Long-term stable operation *For more details, please refer to the catalog or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Film-forming device "Roll Coater"

Film-forming device "Roll Coater"

Achieving drumless flat web transport and non-contact transport of the processing surface before film formation! Film formation can utilize multi-process methods such as plasma CDV and sputtering.

The "Roll Coater" is a device that continuously performs surface treatment on plastic films, metal films, and the like. It enables drumless flat web transport and non-contact transport of the treatment surface before film formation, and the film formation can utilize a multi-process that combines methods such as plasma CDV, sputtering, and vacuum deposition. Additionally, a TMP + CRT exhaust system has been adopted to address the outgassing of material rolls. 【Features】 ■ Drumless flat web transport is possible ■ Non-contact transport of the treatment surface before film formation is possible ■ Multi-process capability ■ Adoption of TMP + CRT exhaust system *For more details, please refer to the catalog or feel free to contact us.

  • Coater

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Powder Low-Temperature (Room Temperature) ALD Film Deposition Device CMP-400

Powder Low-Temperature (Room Temperature) ALD Film Deposition Device CMP-400

It is said to be difficult in ALD, but it is possible to form a powder film at low temperature (room temperature) and atmospheric pressure!

**Features** - Powder film formation using swirling flow under atmospheric pressure - Control of film thickness according to application - Film formation possible at room temperature **Application Examples** - SiO and Al2O3 film formation for all-solid-state battery powders **Consultation for Film Formation and Test Coating Available** At Creative Coatings, we accept test coatings and sample creation. We can listen to your requests and suggest suitable equipment, types of films, and film thicknesses. Please feel free to consult with us. ++++++++++++++++++++++++++++++ We provide next-generation vapor phase technology demanded by the times and the environment. We contribute to technological innovation with our dual technology of low-temperature (room temperature) ALD equipment for semiconductors and powder low-temperature (room temperature) ALD film formation equipment.

  • Plasma surface treatment equipment
  • Surface treatment contract service
  • Other semiconductor manufacturing equipment

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Low-temperature DLC film deposition device (multilayer a-C:H, hydrogen-containing Cr system)

Low-temperature DLC film deposition device (multilayer a-C:H, hydrogen-containing Cr system)

Multi-layer film formation enables the improvement of load-bearing capacity for low-temperature DLC (Diamond-like carbon) thin film hard coatings!

High-density and stable high-quality film formation is possible! By performing DLC film formation that is highly hard (wear-resistant), has a low friction coefficient (wear-resistant), is corrosion-resistant, adhesion-resistant, and smooth, we contribute to the longevity of mold parts for semiconductor manufacturing equipment, resin molding molds, sliding parts, and tools. This is not only optimal for reducing customer costs but also for reducing maintenance work hours such as cleaning tasks and improving operations. It is also possible to achieve "strong adhesion, smoothness, and hard low-temperature DLC film formation" for three-dimensional ultra-precise complex-shaped molds and machine parts. In addition to improving hardness and wear resistance, we also accept "peeling treatment and re-coating," contributing to the reduction of product lifecycle costs and material waste, thus reducing environmental impact. ++++++++++++++++++++++++++++++ DLC stands for Diamond-Like Carbon, which refers to a hard thin film coating with good sliding properties that has intermediate characteristics between diamond and graphite. By adjusting the ratio of SP3 (diamond bonds) to SP2 (graphite bonds) and the ratio of H (hydrogen) contained within, as well as by applying multilayer coatings, it is possible to create thin films with various physical properties and characteristics (industrial value).

  • Plasma surface treatment equipment
  • Surface treatment contract service
  • Other semiconductor manufacturing equipment

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RAM inline sputtering deposition system

RAM inline sputtering deposition system

It is a device that can be transitioned from a pilot line to a mass production line.

This is a deposition-up horizontal inline sputtering device equipped with RAM cathodes (four-sided opposing low-damage sputtering cathodes) and strong magnetic field planar cathodes. To avoid damaging the underlying layer, the initial layer is deposited using the RAM cathode with low-damage sputtering. After that, high-speed deposition is performed using the strong magnetic field cathode. Each of the load lock stockers and unload lock stockers is vacuum-stored with 15 trays. *For more details, please refer to the PDF document or feel free to contact us.*

  • Sputtering Equipment

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