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Film forming equipment Product List and Ranking from 37 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Film forming equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. マツボー Tokyo//Trading company/Wholesale
  2. プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  3. 栗田製作所 本社・京都事業部 Kyoto//Industrial Electrical Equipment
  4. 4 Creative Coatings Co., Ltd. Tokyo//Electronic Components and Semiconductors
  5. 5 京浜ラムテック Kanagawa//Manufacturing and processing contract
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Film forming equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Polyparaxylene vapor deposition film formation device マツボー
  2. Plasma Ion Injection Film Deposition Device PBII-R1000 栗田製作所 本社・京都事業部
  3. RAM inline sputtering deposition system 京浜ラムテック
  4. 4 Powder Low-Temperature (Room Temperature) ALD Film Deposition Device CMP-400 Creative Coatings Co., Ltd.
  5. 5 Low-temperature DLC film deposition device (multi-layer ta-C, hydrogen-free) Creative Coatings Co., Ltd.

Film forming equipment Product List

16～30 item / All 72 items

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Multi-film deposition device VES-10

Multi-film deposition device VES-10

Complete integration of hydrophilic treatment, deposition equipment, and ion sputtering functions.

The multi-film deposition device VES-10 is a compact tabletop unit that fully integrates hydrophilic treatment, deposition, and ion sputtering functions. It deposits replacement leads for mechanical pencils. It uses a magnetron target for low-damage sputtering. The operations for ion sputtering and hydrophilic treatment are fully automated, allowing for automatic execution from the start of evacuation to the end of coating. Function switching is easy with just one button. For more details, please contact us or refer to the catalog.

  • Other physicochemical equipment
  • Plasma surface treatment equipment
  • Other surface treatment equipment

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Various Vacuum Deposition Equipment

Various Vacuum Deposition Equipment

We will customize a wide variety of vacuum devices to meet user needs.

Introducing the various vacuum deposition devices handled by Nanotech, which values creativity and continues research and development that is not swayed by trends. Our company customizes a wide variety of vacuum devices to meet user needs. We offer the "ICF deposition device" for film deposition using the HIPIMS method, as well as the plasma etching device "NAPE500" for semiconductor plasma cleaning. 【Product Lineup】 ■ ICF deposition device ■ Plasma etching device "NAPE500" ■ Pulse bias experimental device "ICF330" *For more details, please refer to the PDF materials or feel free to contact us.

  • Coating thickness gauge
  • Vacuum Equipment

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Multi-film deposition device for development: "PVD for R&D"

Multi-film deposition device for development: "PVD for R&D"

Magnetron sputtering, thermal evaporation, and EB compatible! A composite film deposition device for the development of IoT and automotive devices.

The "PVD for R&D" is a multi-layer deposition device designed for development purposes. It supports magnetron sputtering, thermal evaporation, and E-Beam. It boasts a delivery record of over 400 units worldwide. With a modular design, combinations can be customized according to your needs. 【Features】 ■ Development-focused deposition device specialized for R&D ■ Over 400 units delivered to renowned research institutes, universities, and companies ■ Combinations of magnetron sputtering, thermal evaporation, and E-Beam are possible (Combinations can also be changed through modifications) *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Other processing machines

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Advantages of Compact and Highly Expandable Modular Vacuum Deposition Equipment

Advantages of Compact and Highly Expandable Modular Vacuum Deposition Equipment

Simple operability! Can be restructured into a completely different vacuum system in a short time and at low cost.

We would like to introduce our "Modular Vacuum Deposition System." In general vacuum systems, KF ports and CF ports are welded, and once the system is installed, the port configuration is fixed, making it impossible to change the chamber configuration. In the case of our product, all panels can be removed and replaced. Just like assembling blocks, it can be modified to various chamber configurations. 【Advantages (partial)】 ■ Compact design (can be installed on a laboratory bench) ■ Simple operability ■ Port configuration and number of ports can be changed ■ High expandability (addition of deposition sources and accessories) ■ Versatile use from simple coatings to multilayer films *For more details, please refer to the PDF document or feel free to contact us.

  • Vacuum Equipment

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Microwave Diamond Deposition Device 'MDD-2016'

Microwave Diamond Deposition Device 'MDD-2016'

A microwave diamond film deposition device that generates stable high-density plasma and synthesizes high-quality diamonds at high speed!

The "MDD-2016" is a device that generates stable high-density plasma using a high-output (up to 5kW) microwave power supply and an automatic matching device (4E tuner), enabling the rapid synthesis of high-quality diamonds. Its unique plasma control function allows for the regulation of plasma distribution on the substrate while the plasma is lit. The microwave power supply can be selected from our lineup, including magnetron oscillation (continuous wave, pulse wave, high-stability spectrum) and solid-state oscillation. 【Features】 ■ High output (up to 5kW) ■ Generates high-density plasma ■ Rapid synthesis of high-quality diamonds *For more details, please refer to the catalog or feel free to contact us.

  • others

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ECR plasma deposition device "AFTEX-6000 series"

ECR plasma deposition device "AFTEX-6000 series"

Multi-material multilayer films can be formed! A film deposition device capable of high-quality, high-crystallinity thin film formation.

The "AFTEX-6000 series" forms high-quality thin films at low temperatures and with low damage by directly reacting low-pressure, high-density ECR plasma flows with sputtered particles. Equipped with two ECR plasma sources, it enables fully automated transport and film formation, making it ideal for multilayer film formation. 【Features】 ■ Multilayer film formation with a wide range of film types ■ High refractive index control ■ High-speed film formation ■ High quality and high crystallinity at low temperatures and low damage ■ Cleaning effect on substrates and growth surfaces *For more details, please refer to the catalog or feel free to contact us.

  • Other semiconductor manufacturing equipment

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[Device Production Example] Film Formation Device

[Device Production Example] Film Formation Device

From design to after-service of the equipment! We can offer various equipment proposals.

We would like to introduce a case of the small batch-type sputtering device "SPB-311" developed as a film-forming apparatus. It features a clean exhaust system with a cryopump as the main pump and is equipped with a magnetron cathode. It allows for the selection of RF/DC power supplies. Shinano Seiki supports the entire lifecycle of the device, from design to after-sales service, through collaboration with partner companies. 【Main Specifications】 ■ Clean exhaust system with a cryopump as the main pump ■ Equipped with a magnetron cathode (up to 3 units) ■ Selection of RF/DC power supplies available ■ Substrate rotation mechanism ■ Fully automatic touch panel sequence with manual operation available *For more details, please download the PDF or feel free to contact us.

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  • Sputtering Equipment

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Creative Coatings "Vapor Technology"

Creative Coatings "Vapor Technology"

We will introduce the technologies and processing examples we propose based on the work material, film type, and film thickness!

"Vapor phase technology" is utilized in various fields such as 'new materials and substances' and 'energy' including resin raw materials and fuel cells, as well as in 'medical and healthcare' applications like medical sensors and devices, and in 'mobile devices', 'wearable devices', and 'automotive' sectors including electronic components and new displays. Additionally, it achieves film formation in the range of 1nm to 1000nm with diverse processes, film thicknesses, and types. Coating is performed using deposition methods such as evaporation, CVD, ALD, and sputtering. 【Features】 ■ ALD Robot CVA series Enables high-quality film formation at low temperatures, which is considered difficult in ALD. ■ Barrel-type ALD Robot CVA-B series A fusion of low-temperature ALD equipment and barrel mechanism. ■ Low-temperature high-frequency excitation DLC film formation device CVC series Allows for good adhesion film formation from graphite to DLC at low temperatures. ■ Bubbling CVD Robot CVB series Liquid to gas Enables low-cost and high-quality film formation at low temperatures. ■ IBAD (Ion Beam Assisted Deposition) CVI series Examples of contract film formation using IBAD Allows for low-energy irradiation at low temperatures, improving the adhesion of transparent conductive films (Zn O) and high-melting-point metal electrode formation for touch panels.

  • Contract manufacturing

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Low-temperature DLC film deposition device (multi-layer ta-C, hydrogen-free)

Low-temperature DLC film deposition device (multi-layer ta-C, hydrogen-free)

It is now possible to achieve low-temperature DLC (Diamond-like carbon) thin film hard coatings with improved adhesion compared to conventional ta-C!

High-density and stable high-quality film formation is possible! By performing DLC film formation that is highly hard (wear-resistant), has a low friction coefficient (wear-resistant), is corrosion-resistant, adhesion-resistant, and smooth, we contribute to the longevity of mold parts for semiconductor manufacturing equipment, resin molding molds, sliding components, and tools. This is not only optimal for reducing customer costs but also for reducing maintenance work hours, such as cleaning tasks, and for business improvement. It is also possible to achieve "high adhesion, smooth & hard low-temperature DLC film formation" for three-dimensional ultra-precise complex-shaped molds and machine parts. In addition to improving hardness and wear resistance, we also accept "peeling treatment and re-coating," contributing to the reduction of product life cycle costs and material waste, thus reducing environmental impact. ++++++++++++++++++++++++++++++ DLC stands for Diamond-Like Carbon, which refers to a hard thin-film coating with good sliding properties that has intermediate characteristics between diamond and graphite. By adjusting the ratio of SP3 (diamond bonds) to SP2 (graphite bonds) and the ratio of H (hydrogen) contained within, as well as by applying multilayer coatings, it is possible to create thin films with various physical properties and characteristics (industrial value).

  • Plasma surface treatment equipment
  • Surface treatment contract service
  • Other semiconductor manufacturing equipment

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RAM cluster-type sputtering deposition device

RAM cluster-type sputtering deposition device

There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.

The RAM cluster sputtering system is a cluster-type sputtering device equipped with RAM cathodes (four-sided low-damage sputtering cathodes). To avoid damaging the underlying layer, the initial layer is deposited using low-damage sputtering with the RAM cathode. It has five expansion slots, allowing for the addition of sputtering chambers, deposition devices, glove boxes, and more. Additionally, it is equipped with a 25-stage multi-tier load lock, enabling automatic deposition of a wide variety of film recipes for each slot, making it suitable for all kinds of research and development.

  • Sputtering Equipment

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Roll-to-roll vacuum deposition system

Roll-to-roll vacuum deposition system

A compact roll-to-roll film deposition device suitable for experimental research!

The "Roll-to-Roll Vacuum Deposition Device" is a machine capable of continuously forming thin films on a film substrate using a roll-to-roll method. It is a compact and economical device, making it suitable for research and development. By innovating the film transport system, high-speed film deposition becomes possible. Please feel free to contact us if you have any inquiries. 【Main Specifications】 ■Deposition Method: DC Magnetron Sputtering (RF compatible as an option) ■Substrate Transport: Roll-to-Roll (with tension control), speed 0.2~3.0m/min, tension 15~80N ■Roller Surface Length: 140mm ■Film Dimensions: Maximum width 100mm, length 100m (film thickness 50μm) *For more details, please download the PDF or contact us.

  • Vacuum Equipment
  • Vacuum forming machine

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Plasma deposition device "KOBUS F.A.S.T.(R)"

Plasma deposition device "KOBUS F.A.S.T.(R)"

Utilizing pulse functionality! It is possible to produce thin films equivalent to ALD in the same processing time as conventional CVD.

"KOBUS F.A.S.T.(R)" is a plasma deposition device for industrial ALD-level film quality. By utilizing a pulse function, it is possible to produce films equivalent to ALD (Atomic Layer Deposition) in the same processing time as conventional CVD. The process temperature ranges from 80°C to 500°C, with wafer sizes of 150mm and 200mm, and a deposition rate of 0.1nm/min to 500nm/min. 【Specifications】 ■ Process temperature: 80°C to 500°C ■ Wafer sizes: 150mm, 200mm ■ Deposition rate: 0.1nm/min to 500nm/min ■ Aspect ratio ・20:1 * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

  • Other inspection equipment and devices

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Film-forming device "Corial 200 Series"

Film-forming device "Corial 200 Series"

A plasma etching and deposition device that can be configured according to its purpose.

We would like to introduce our "Corial 200 Series." This research and development equipment utilizes a common platform and can be configured as RIE, ICP, ICP+RIE, ICP-CVD, or PECVD depending on the application. Wafer sizes are 50mm, 100mm, 150mm, and 200mm. 【Features】 ■ Utilizes a common platform ■ RIE, ICP, ICP+RIE, ICP-CVD, or PECVD equipment ■ Designed for research and development ■ Wafer sizes are 50mm, 100mm, 150mm, and 200mm * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Custom-made sputtering deposition equipment

Custom-made sputtering deposition equipment

Difficult materials, various substrate shapes, and applications! Capable of accommodating a very wide range of substrate sizes.

We offer a "custom-made sputtering deposition system (PVD)" that can handle everything from research and prototyping to mass production. We support coating for decorative and surface protection purposes, as well as research and development to mass production of thin film devices such as flexible electronics, optical communication technologies, thin film solar cells, and batteries. We can assemble the system according to your needs, including sample size, deposition target materials, and batch processes. 【Features】 - Unique technology that accommodates all metal and oxide targets - Wafer sizes from 1mm x 1mm to 300mm x 560mm, with thicknesses up to 25mm - No need for hardware or software changes for deposition on different sizes - Thin Film Equipment recommended by research institutions across Europe *You can download the English version of the materials. For more details, please feel free to contact us.

  • Sputtering Equipment

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