Film forming equipment Product List and Ranking from 36 Manufacturers, Suppliers and Companies

Ion Assist Sputtering Deposition Equipment

For engineers in the wear-resistant coating industry! Precise control of film stress.

We offer an "Ion Assist Sputtering Deposition System (PVD)" that can handle everything from research and development to small-scale production. This system can be applied to a wide range of fields, including semiconductor devices, nanotechnology, ferroelectric and ferromagnetic thin films, and superconducting thin films. In particular, as an alternative technology to bias sputtering, it achieves dense and highly adherent thin film deposition, making it easy to control film stress. Furthermore, it supports high-temperature deposition up to a maximum substrate temperature of 800°C, and deposition on insulating substrates is also possible. 【Features】 - Provides dense and highly adherent thin films due to the high-temperature substrate heating mechanism and ion assist effect. - Wafer carrier with excellent thermal conductivity. - Supports alloy deposition and deposition of oxides and nitrides via reactive sputtering. - Uses an end-hole type (Kaufman type) ion source with strong directionality and concentrated ion energy bandwidth. - Accommodates lab-scale to small-scale production, delivering thin films with excellent density and adhesion. *For more details, please feel free to contact us.

Company：プラズマ・サーモ・ジャパン
Price：Other

Sputtering Equipment
Film forming equipment

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R&D cluster PVD equipment (ferromagnetic materials, alloys, dielectric film deposition)

Multilayer film formation of sputtered films and evaporated films.

In the development of new materials for ferromagnetic and ferroelectric materials, controlling composition and crystal orientation is extremely important. This device provides a highly useful film deposition environment for exploring the physical properties of these functional materials by adopting a confocal sputtering method with up to four cathodes (sputter up/down). Additionally, it is equipped with an automatic load lock and transfer chamber, and is compatible with an electron beam evaporation source (6 kW with four crucibles), allowing for efficient co-sputtering and multi-material film deposition through PC-controlled automatic/semi-automatic operation. In particular, when depositing ferromagnetic materials, the low target utilization efficiency of ferromagnetic targets (Fe, Co, especially high-purity pure iron 3N5–4N) is known to hinder the efficiency of research and development. This device addresses this issue by employing a cathode with a very high magnetic field at the target surface, thereby improving the film deposition efficiency of ferromagnetic materials, including pure iron targets. As a result, it demonstrates high performance and flexibility as a thin film deposition device for R&D, from material exploration to prototype research.

Company：プラズマ・サーモ・ジャパン
Price：Other

Sputtering Equipment
Film forming equipment

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Vacuum Coating Technology & Equipment

Conductive protective film for separators! The layer stack's ICR, corrosion resistance, and stacking performance are comparable to gold.

We would like to introduce our "Vacuum Coating Technology & Equipment." The carbon-based multilayer film structure is optimized to achieve low ICR (interfacial contact resistance), excellent substrate adhesion, and corrosion resistance simultaneously. The ICR, corrosion resistance, and stack performance of this layer stack are comparable to gold (the reference material). Please feel free to contact us when you need assistance. 【Film Deposition Equipment】 ■ High-throughput electron beam evaporation and sputter deposition of carbon, metals, oxides, etc., on metal substrates ■ Surface activation and cleaning through plasma pretreatment ■ Equipment for research and development, small-scale production, and manufacturing that processes metal foils (R2R) and embossed separators (S2S) *For more details, please refer to the PDF materials or feel free to contact us.

Company：フォンアルデンヌジャパン
Price：Other

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High-speed wafer deposition equipment HEXAGON

Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!

"HEXAGON" is a mass production dedicated wafer-level packaging platform that provides atmospheric degassing, etching, and metal deposition at a very low cost of ownership for applications such as FOWLP. High-speed wafer processing is made possible by wafer transport using a synchronous indexer. With wafer handling, during 24/7 production, the wafer sensing function within the chamber allows for accurate and reproducible positioning, enabling full-face etching and deposition processes. 【Features】 - Processing of wafers passivated with organic films that degas in large quantities - High-performance dual-end effectors achieving short wafer exchange times Atmospheric front-end module using robots - Wafer transport via synchronous indexer enabling high-speed wafer processing - Over 20,000 etching shield kit lifespan due to enhanced uptime and reduced maintenance *For more details, please refer to the related links or feel free to contact us.

Company：日本エバテック
Price：Other

Sputtering Equipment
Etching Equipment
Film forming equipment

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Brochure giveaway! "Choosing the Right Coating Without Making Mistakes" Volume 2!

Understand "Quality Control of Hard Coatings" just by reading! Explanation of measurement methods for film thickness, hardness, and adhesion strength.

Our company, specializing in DLC coatings with excellent wear resistance and lubrication properties, is proud to present the highly popular booklet "Choosing Coatings Without Making Mistakes" Volume 2! This time, the theme is "Quality Control of Hard Thin Films," covering fundamental knowledge of quality control, as well as in-depth explanations of measurement methods for film thickness, hardness, and adhesion strength, including "Masking Step Measurement Method," "Indentation Hardness Test," and "Scratch Test Method." If you would like a copy of the booklet, please request it through the "Contact Us" section. 【Contents】 ■ What is Quality Control of Hard Thin Films? ■ Measurement Methods for Film Thickness ■ Measurement Methods for Hardness ■ Testing Methods for Adhesion Strength *For more details, please download the catalog or contact us.

Company：ナノコート・ティーエス石川事業所
Price：Other

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Film forming equipment

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DLC (Diamond-Like Carbon) Film Deposition Device

For medical applications and optical components! Plasma CVD equipment that can reduce initial and running costs.

The "Diamond-Like Carbon Film Deposition Device" is a thermal cathode PIG (Penning Ion Gauge Discharge Type) plasma CVD device. It enables processing at low temperatures and high vacuum, achieving the formation of DLC (Diamond-Like Carbon) films with excellent hardness and smoothness. Compared to other methods, it allows for independent control of the amount and energy of ions incident on the substrate, enabling extremely wide-ranging control of film quality. Additionally, Tosei Corporation also offers surface treatment processing that widely utilizes the excellent characteristics of diamond-like carbon films on materials such as cemented carbide, stainless steel, and tool steel. 【Features】 ■ Low friction coefficient ■ Wear resistance ■ Low aggressiveness ■ Non-welding ■ Insulating *For more details, please refer to the catalog or feel free to contact us.

Company：東製
Price：Other

Other contract services
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Plasma Ion Injection Film Deposition Device PBII-R1000

It can also be used as a production machine and is adopted by many users.

The Plasma Based Ion Implantation & Deposition (PBII&D) is a completely new plasma ion implantation technology developed in collaboration with Kurita Manufacturing Co., Ltd. and the Kansai Center of the National Institute of Advanced Industrial Science and Technology, and it has been patented (Patent No. 3555928). DLC coating is also possible. Due to its ease of handling, it can be used as a production machine and has been adopted by many users. For more details, please contact us or refer to the catalog.

Company：栗田製作所本社・京都事業部
Price：Other

Plasma surface treatment equipment
Ion implantation equipment
Film forming equipment

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Batch-type FCVA device

Adopting a self-rotation type sample holder! Customizable batch-type large coating equipment.

We would like to introduce our "Batch-type FCVA Device." It is effectively used for film formation on sliding parts such as automotive components and printer parts. It demonstrates a uniform film thickness distribution thanks to the self-rotating sample holder. 【Features】 ■ Adoption of a self-rotating sample holder ■ Customizable ■ Contributes to improved productivity *For more details, please feel free to contact us.

Company：株式会社ナノフィルムテクノロジーズ　ジャパン
Price：Other

Coating Agent
Film forming equipment

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Polyparaxylene vapor deposition film formation device

This is a device specialized for the film formation of polyparaxylene. The manufacturer has been engaged in the sale of polyparaxylene films and equipment in Europe for over 35 years.

This product is a device that can form a parylene film with excellent adhesion. We sell equipment that can be used not only for research and R&D but also for mass production. Additionally, we have sold over 50 units of this equipment, which is already in use on production lines. The features of this device are as follows: - The cleaning and maintenance of the device are easy. - Pre-treatment to improve adhesion with the substrate can be processed in-situ. - The process can be executed by the PLC attached to the device. The film deposition recipe logs can also be output as CSV files. - Customization of the device is possible.

Company：マツボー
Price：Other

Evaporation Equipment
Film forming equipment

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Piezoelectric film forming device

It is a film deposition device specialized for the production of MEMS and FBAR.

The US company AMS's sputtering equipment (piezoelectric films, dielectric films, metal sputtering equipment) achieves high in-plane uniformity primarily for Al films and Mo films, as well as many other films.

Company：マツボー
Price：Other

Piezoelectric Devices
Sensors
Film forming equipment

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Multilayer film formation device (Polyparaxylene + ALD)

We alternately stack polyparaxylylene (Parylene) and inorganic oxide layers using atomic layer deposition (ALD).

Parylene is a high-performance resin with biocompatibility, but it has the disadvantage of lower gas barrier properties compared to inorganic oxides. Therefore, by alternately depositing Parylene and oxides like a sandwich, it becomes possible to create high-performance films with excellent barrier properties, making it ideal for medical applications that require miniaturization and thin films. Parylene and ALD can be deposited in the same chamber (in-situ) without breaking the vacuum, so there is no concern about particles. Additionally, manufacturers have process know-how, so information regarding recipes can also be provided. We also conduct demonstration film deposition, so please feel free to contact us.

Company：マツボー
Price：Other

CVD Equipment
Film forming equipment

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High-speed film forming device

To MEMS manufacturing sacrificial layers and optical waveguides, etc.

High-speed film formation device for inorganic films. We accept demo experiments and consultations. Please feel free to contact us.

Company：魁半導体
Price：Other

Other processing machines
Other semiconductor manufacturing equipment
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Roll to Roll Coating

Roll to Roll deposition for the manufacturing of flexible devices such as solar cells and 5G antennas.

■Overview Suitable for mass production of resin films and metal foils, it can form films on materials wound in rolls. We have a track record of ultra-thin films with a thickness of 4µm. We also offer consulting for functional thin film design for development products, including specification determination based on customer application purposes. Please make use of our long-standing expertise and knowledge in "transparent conductive films and ITO films" in your product development.

Company：ジオマテック
Price：Other

Processing Contract
Touch Panel
Film forming equipment

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Graphene CVD deposition device

Equipped with a rapid cooling mechanism using slide movement of the furnace.

This is a tubular furnace thermal CVD device for synthesizing graphene films. It is equipped with a slide movement mechanism for the furnace, allowing for rapid heating and cooling of samples. An optional motor-driven automatic slide function can also be added. Additionally, by adding a turbo vacuum pump as an option, even higher quality graphene can be deposited.

Company：マイクロフェーズ
Price：5 million yen-10 million yen

Other physicochemical equipment
CVD Equipment
Film forming equipment

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Tabletop CNT/Graphene Film Deposition Device

This is a tabletop CVD device that can easily synthesize long-length powder CNTs, vertically aligned CNTs, and graphene films.

Of course, organic liquid raw materials, as well as hydrocarbon raw gases such as acetylene gas and methane gas, are standardly equipped with introduction ports for H2 reduction gas, making it easy to synthesize various types of CNTs. Additionally, rapid cooling of the substrate heater is possible, allowing for easy film formation of graphene membranes.

Company：マイクロフェーズ
Price：1 million yen-5 million yen

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Organic EL film formation device

It is a hybrid deposition device that allows for the deposition of organic materials and metal materials in the same chamber. Co-evaporation of organic and metal materials is possible.

Eight organic deposition cells (KOD-Cell) for organic material film formation are available, and during metal material deposition, a metal deposition cell is standardly equipped in the same room. Both the organic and metal systems are configured with small-sized crucibles, focusing on minimizing chamber contamination within the device chamber. Additionally, it is a system that can be connected to a glove box. This system is a hybrid deposition device that allows for film formation of organic materials and metal materials in the same room.

Company：北野精機
Price：Other

Evaporation Equipment
Organic EL
Other clean room equipment and facilities
Film forming equipment

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Wear resistance DLC

High-performance DLC with plasma ion assist!

This is an introduction to PIA's i-DLC.

Company：プラズマイオンアシスト
Price：Other

Surface treatment contract service
Film forming equipment

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Cutting and grinding properties DLC

High-performance DLC with plasma ion assistance!

This is an introduction to PIA's i-DLC.

Company：プラズマイオンアシスト
Price：Other

Surface treatment contract service
Film forming equipment

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Sputtering and deposition source composite thin film deposition device [nanoPVD-ST15A]

Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.

Three types of film formation components are installed in the chamber: resistance heating evaporation source (metal evaporation), organic evaporation source (organic materials), and magnetron sputtering (metal and insulating materials), allowing for various thin film experimental setups to be accommodated within a single chamber. ◉ Three combinations are available: 1. Sputter cathode + resistance heating evaporation source x2 2. Sputter cathode + organic evaporation source x2 3. Sputter cathode + resistance heating source x1 + organic evaporation source x1 (*DC sputtering only) - Evaporation range: Φ4 inch / Φ100 mm - Vacuum exhaust system: Turbo molecular pump + auxiliary pump (rotary or dry scroll pump) - Substrate rotation and vertical lifting stage - Max 500℃ substrate heating heater - Quartz oscillator film thickness sensor - 7” touch panel HMI operation (includes 'IntelliLink' Windows PC remote monitoring software)

Company：テルモセラ・ジャパン本社
Price：Other

Sputtering Equipment
Evaporation Equipment
Annealing furnace
Film forming equipment

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Huz Technonet DLC Coating Device

Technology accelerates within possibilities.

DCL refers to a carbon film that has properties similar to diamond. It possesses significant characteristics such as an extremely hard surface, and there are expectations for its use in industrial materials and processed products, as well as the birth of new materials.

Company：ヒューズテクノネット
Price：Other

Other semiconductor manufacturing equipment
Film forming equipment

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Metal film + protective film forming device

A must-see for engineers considering new film formation methods! Fully automated film formation of metal films and protective films on resin substrates.

The newly developed injection molding machine-linked high-speed sputtering and polymerization system, SPP-SERIES, enables automatic film formation of metal films and protective films on resin substrates used in automotive and decorative parts. It is capable of fully automatic vacuum film formation (sputtering and polymerization) on injection molded substrates. 【Target Products】 ◆ Automotive headlamp reflectors ◆ Mirrors ◆ Metal decorative films *For more details, please contact us or download the PDF to view.

Company：昭和真空
Price：Other

Vacuum Equipment
Sputtering Equipment
Film forming equipment

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Solid Source ECR Plasma Deposition Device "AFTEX-9000 Series"

Low-temperature process, high refractive index control, high-speed reactive film formation, dense and flat film.

The "AFTEX-9000 series" is a device capable of achieving high-quality nano thin film formation at low temperatures and with low damage. It supports substrate sizes of up to 8 inches and can accommodate up to three ECR plasma sources, significantly improving productivity by operating them simultaneously. Please use our equipment for nano thin film formation. 【Features】 ■ A fully automated C to C single wafer system with a multi-chamber design that can connect up to three ECR deposition modules for 8-inch substrates. ■ Achieves high productivity with simultaneous deposition using three ECR plasmas. ■ Allows for the setting of transport flow, deposition chamber, and deposition process through recipes, enabling fully automated deposition of multilayer films with any material. ■ Excellent uniformity is achieved through substrate tilt rotation and low-pressure deposition. ■ An in-device spectroscopic system (optional) enables measurement of film thickness, refractive index dispersion, etc. ■ Directly reacts raw material particles from solid sources with a highly active ECR plasma flow, eliminating the need for expensive exhaust treatment equipment and being environmentally friendly. *For more details, please refer to the catalog or feel free to contact us.

Company：JSWアフティ
Price：Other

Other semiconductor manufacturing equipment
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Solid Source ECR Plasma Deposition Device "AFTEX-2300"

It is possible to obtain highly crystalline thin films at low temperatures! A cost-effective plasma deposition device.

The "AFTEX-2300" is a high-performance solid source ECR plasma deposition system equipped with a microwave branch-coupled ECR ion source, a load-lock mechanism, and a turbo molecular pump, all at a low price. Thin films grow under the irradiation of high-density ions controlled at low energies of 10-30 eV, resulting in dense, high-quality thin films with atomic-level smoothness. Thanks to the ion assist effect, it is possible to form compound thin films such as oxide and nitride films without high-temperature heating, and it is also possible to obtain highly crystalline thin films at low temperatures. 【Features】 ■ Equipped only with the basic functions of a solid source ECR plasma deposition system ■ Lower price compared to automatic deposition systems ■ Achieves long-term stable operation ■ Clean deposition environment ■ Various interlock mechanisms adopted *For more details, please refer to the catalog or feel free to contact us.

Company：JSWアフティ
Price：Other

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Solid Source ECR Plasma Deposition Device "AFTEX-8000 Series"

A fully automatic multilayer film forming device that can form multilayer films with excellent uniformity!

The AFTEX-8000 series is a fully automatic multi-layer film formation device that features two ECR plasma sources arranged at an angle in a single film formation chamber, capable of forming high-quality optical thin films and multi-layer films with excellent uniformity on substrates up to 8 inches in diameter. By using a high-activity, high-density ECR (Electron Cyclotron Resonance) plasma source and placing a target in the plasma extraction section, it achieves ECR plasma deposition using a solid source. There is no need to use hazardous gases like those in CVD, eliminating the need for exhaust gas treatment, making it an environmentally friendly film formation technology. 【Features】 ■ High insulation film characteristics ■ Multi-layer films ■ Dense and flat films ■ Low damage ■ Long-term stable operation *For more details, please refer to the catalog or feel free to contact us.

Company：JSWアフティ
Price：Other

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Film-forming device "Roll Coater"

Achieving drumless flat web transport and non-contact transport of the processing surface before film formation! Film formation can utilize multi-process methods such as plasma CDV and sputtering.

The "Roll Coater" is a device that continuously performs surface treatment on plastic films, metal films, and the like. It enables drumless flat web transport and non-contact transport of the treatment surface before film formation, and the film formation can utilize a multi-process that combines methods such as plasma CDV, sputtering, and vacuum deposition. Additionally, a TMP + CRT exhaust system has been adopted to address the outgassing of material rolls. 【Features】 ■ Drumless flat web transport is possible ■ Non-contact transport of the treatment surface before film formation is possible ■ Multi-process capability ■ Adoption of TMP + CRT exhaust system *For more details, please refer to the catalog or feel free to contact us.

Company：C&Vテクニクス
Price：Other

Coater
Film forming equipment

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Powder Low-Temperature (Room Temperature) ALD Film Deposition Device CMP-400

It is said to be difficult in ALD, but it is possible to form a powder film at low temperature (room temperature) and atmospheric pressure!

**Features** - Powder film formation using swirling flow under atmospheric pressure - Control of film thickness according to application - Film formation possible at room temperature **Application Examples** - SiO and Al2O3 film formation for all-solid-state battery powders **Consultation for Film Formation and Test Coating Available** At Creative Coatings, we accept test coatings and sample creation. We can listen to your requests and suggest suitable equipment, types of films, and film thicknesses. Please feel free to consult with us. ++++++++++++++++++++++++++++++ We provide next-generation vapor phase technology demanded by the times and the environment. We contribute to technological innovation with our dual technology of low-temperature (room temperature) ALD equipment for semiconductors and powder low-temperature (room temperature) ALD film formation equipment.

Company：Creative Coatings Co., Ltd.
Price：Other

Plasma surface treatment equipment
Surface treatment contract service
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Low-temperature DLC film deposition device (multilayer a-C:H, hydrogen-containing Cr system)

Multi-layer film formation enables the improvement of load-bearing capacity for low-temperature DLC (Diamond-like carbon) thin film hard coatings!

High-density and stable high-quality film formation is possible! By performing DLC film formation that is highly hard (wear-resistant), has a low friction coefficient (wear-resistant), is corrosion-resistant, adhesion-resistant, and smooth, we contribute to the longevity of mold parts for semiconductor manufacturing equipment, resin molding molds, sliding parts, and tools. This is not only optimal for reducing customer costs but also for reducing maintenance work hours such as cleaning tasks and improving operations. It is also possible to achieve "strong adhesion, smoothness, and hard low-temperature DLC film formation" for three-dimensional ultra-precise complex-shaped molds and machine parts. In addition to improving hardness and wear resistance, we also accept "peeling treatment and re-coating," contributing to the reduction of product lifecycle costs and material waste, thus reducing environmental impact. ++++++++++++++++++++++++++++++ DLC stands for Diamond-Like Carbon, which refers to a hard thin film coating with good sliding properties that has intermediate characteristics between diamond and graphite. By adjusting the ratio of SP3 (diamond bonds) to SP2 (graphite bonds) and the ratio of H (hydrogen) contained within, as well as by applying multilayer coatings, it is possible to create thin films with various physical properties and characteristics (industrial value).

Company：Creative Coatings Co., Ltd.
Price：Other

Plasma surface treatment equipment
Surface treatment contract service
Other semiconductor manufacturing equipment
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RAM inline sputtering deposition system

It is a device that can be transitioned from a pilot line to a mass production line.

This is a deposition-up horizontal inline sputtering device equipped with RAM cathodes (four-sided opposing low-damage sputtering cathodes) and strong magnetic field planar cathodes. To avoid damaging the underlying layer, the initial layer is deposited using the RAM cathode with low-damage sputtering. After that, high-speed deposition is performed using the strong magnetic field cathode. Each of the load lock stockers and unload lock stockers is vacuum-stored with 15 trays. *For more details, please refer to the PDF document or feel free to contact us.*

Company：京浜ラムテック
Price：Other

Sputtering Equipment
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Electrostatic Spray Coating Device 'PDS-D01'

Easily achieve the dispersion coating and film formation of nanomaterials!

We offer the electrostatic spray coating device 'PDS-D01', which forms a film of nanoparticles on the workpiece using high-quality electrostatic spraying technology. By adjusting the distance between the nozzle and the workpiece, it is possible to select a fine filling structural film (wet mode) or a porous film (dry mode). Additionally, by selecting the applied voltage (three types: DC, pulse, AC), it enables the spraying of large particles on the micron order and the coating on insulating workpieces. 【About the device】 ■ Composed of a desktop PC, controller, and the main coating mechanism ■ The coating mechanism is equipped with a light source and camera to observe the spraying state ■ The standard coating area is 50mm square ■ There is a test area for preliminary spraying *For more details, please download the PDF or feel free to contact us.

Company：浜松ナノテクノロジー
Price：Other

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High Rate Ion Beam Sputtering High-Speed Film Deposition System (HR-PVD)

High-rate and high-quality film formation of dielectric and ferromagnetic materials.

This is a high-speed ion beam sputtering (IBD) device that excels in the deposition of dielectrics such as Al2O3 and SiO2, which typically have low deposition rates in conventional magnetron sputtering, as well as ferromagnetic materials like Fe. By using a helicon plasma source as the ion source and a groundbreaking method that accelerates the high-density ions obtained from it through the application of bias voltage to the target, it achieves high-rate and highly directional film deposition. It also contributes to cost reduction in deposition processes using valuable and rare targets by efficiently utilizing the entire target surface. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieving both high-speed sputtering and low contamination Reduction of running costs through improved target utilization efficiency Maintenance reduction due to gridless structure Sputtering while keeping the substrate at low temperature through remote plasma configuration ■ Wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality Uniform film thickness can be achieved with a highly directional ion beam, resulting in excellent step coverage in film deposition.

Company：ティー・ケイ・エス
Price：Other

Sputtering Equipment
Film forming equipment

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Film forming equipment Product List and Ranking from 36 Manufacturers, Suppliers and Companies | IPROS GMS

Film forming equipment Manufacturer, Suppliers and Company Rankings

Film forming equipment Product ranking