We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Film forming equipment.
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Film forming equipment Product List and Ranking from 37 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Film forming equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. マツボー Tokyo//Trading company/Wholesale
  2. プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  3. 栗田製作所 本社・京都事業部 Kyoto//Industrial Electrical Equipment
  4. 4 Creative Coatings Co., Ltd. Tokyo//Electronic Components and Semiconductors
  5. 5 京浜ラムテック Kanagawa//Manufacturing and processing contract
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Film forming equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Polyparaxylene vapor deposition film formation device マツボー
  2. Plasma Ion Injection Film Deposition Device PBII-R1000 栗田製作所 本社・京都事業部
  3. RAM inline sputtering deposition system 京浜ラムテック
  4. 4 Powder Low-Temperature (Room Temperature) ALD Film Deposition Device CMP-400 Creative Coatings Co., Ltd.
  5. 5 Low-temperature DLC film deposition device (multi-layer ta-C, hydrogen-free) Creative Coatings Co., Ltd.

Film forming equipment Product List

61～72 item / All 72 items

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Electrostatic Spray Coating Device 'PDS-D01'

Electrostatic Spray Coating Device 'PDS-D01'

Easily achieve the dispersion coating and film formation of nanomaterials!

We offer the electrostatic spray coating device 'PDS-D01', which forms a film of nanoparticles on the workpiece using high-quality electrostatic spraying technology. By adjusting the distance between the nozzle and the workpiece, it is possible to select a fine filling structural film (wet mode) or a porous film (dry mode). Additionally, by selecting the applied voltage (three types: DC, pulse, AC), it enables the spraying of large particles on the micron order and the coating on insulating workpieces. 【About the device】 ■ Composed of a desktop PC, controller, and the main coating mechanism ■ The coating mechanism is equipped with a light source and camera to observe the spraying state ■ The standard coating area is 50mm square ■ There is a test area for preliminary spraying *For more details, please download the PDF or feel free to contact us.

  • Other processing machines

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High Rate Ion Beam Sputtering High-Speed Film Deposition System (HR-PVD)

High Rate Ion Beam Sputtering High-Speed Film Deposition System (HR-PVD)

High-rate and high-quality film formation of dielectric and ferromagnetic materials.

This is a high-speed ion beam sputtering (IBD) device that excels in the deposition of dielectrics such as Al2O3 and SiO2, which typically have low deposition rates in conventional magnetron sputtering, as well as ferromagnetic materials like Fe. By using a helicon plasma source as the ion source and a groundbreaking method that accelerates the high-density ions obtained from it through the application of bias voltage to the target, it achieves high-rate and highly directional film deposition. It also contributes to cost reduction in deposition processes using valuable and rare targets by efficiently utilizing the entire target surface. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieving both high-speed sputtering and low contamination Reduction of running costs through improved target utilization efficiency Maintenance reduction due to gridless structure Sputtering while keeping the substrate at low temperature through remote plasma configuration ■ Wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality Uniform film thickness can be achieved with a highly directional ion beam, resulting in excellent step coverage in film deposition.

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  • Sputtering Equipment

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Preparation of combinatorial composition gradient samples

Preparation of combinatorial composition gradient samples

It is possible to create composition gradient films of 2 yuan and 3 yuan! We will deposit functional materials used in various solid devices.

Since our establishment, we have received great acclaim for our unique service of creating thin film samples using combinatorial technology. We can produce single composition films of arbitrary compositions, as well as binary and ternary composition gradient films. We deposit functional materials used in various solid-state devices, such as thermoelectric materials, ferroelectrics, ferromagnets, battery electrodes, phase change memory materials, and intermetallic compounds. 【Features】 ■ Experienced technical staff to assist in the development of new functional materials ■ We use sputtering and PLD (Pulsed Laser Deposition) methods for thin film deposition ■ We can produce single composition films of arbitrary compositions, as well as binary and ternary composition gradient films *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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Ion Beam Etching and Deposition Device 'QuaZar(TM)'

Ion Beam Etching and Deposition Device 'QuaZar(TM)'

Achieving high throughput! Large-area ion source and advanced motion control.

We would like to introduce our ion beam etching and deposition system, 'QuaZar(TM)'. With a large-area ion source and advanced motion control, it achieves high throughput. In particular, the Marathon(TM) grid allows for excellent uniformity over a long period compared to conventional methods. 【Specifications】 ■ Ion beam system ■ Process temperature: -40℃ to +60℃ ■ Tilt angle: +90 degrees to -80 degrees ■ Load lock or CtoC ■ Wafer sizes: 100mm, 150mm, 200mm * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Ion Beam Etching and Deposition Equipment 'QuaZar'

Ion Beam Etching and Deposition Equipment 'QuaZar'

It is possible to reduce total ownership costs! Achieving top-class uniformity and throughput.

"QuaZar" is an etching and deposition device that achieves process results in challenging etching processes and thin film formation applications through a large-area ion source and advanced motion control. The Marathon grids technology of this product is a key element and can be installed in your existing systems. Many customers around the world have successfully improved the performance of their existing equipment with grid technology, extending its lifespan by more than double. 【Features】 ■ Uniformity <2% 3σ (200mm wafer), with scanning motion achieving <0.6% 3σ ■ Ion Source, Marathon Grid, and Dual PBN have doubled the MTBM compared to conventional systems and can be equipped on existing devices from other manufacturers ■ Clustering with our PVD, CVD, etc. is possible ■ 150mm, 200mm *For more details, please feel free to contact us.

  • Etching Equipment

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Tabletop Type Etching and Film Deposition Device 'Plasma POD Series'

Tabletop Type Etching and Film Deposition Device 'Plasma POD Series'

For educational institutions and small facilities! A desktop system that allows for easy operation with a touch panel.

The "Plasma POD Series" is a small and compact tabletop etching and deposition device. It is recommended for those who have limited installation space and are considering the introduction of an etching and deposition device at a low cost. Please feel free to contact us if you have any inquiries. 【Features】 ■ Maximum device size: 80cm x 80cm x 80cm (height) ■ Easy operation with a touch panel * You can download the English version of the catalog. * For more details, please feel free to contact us.

  • Etching Equipment

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Damage-free ion beam film deposition solution "QuaZar"

Damage-free ion beam film deposition solution "QuaZar"

The tilt/rotation function of the wafer stage allows for feature setting!

"QuaZar" is a damage-free ion beam deposition solution that enables a precise thin film deposition application through a large-area ion source and advanced motion control. The extension of maintenance cycles, including the application of our uniquely developed Marathon-grids technology, is a crucial factor for production and can also be installed in your existing systems. The target is sputtered by an ion beam with the set energy, allowing for a wide process window. 【Features】 ■ REDEP breaker that prevents short circuits in the ion source using RF shunting ■ Auxiliary electrode system that prevents anode loss in the ion source ■ Adoption of a virtual shutter that eliminates the need for a mechanical shutter, reducing particles ■ Dual PBN (optional) that integrates two neutralizers *For more details, please feel free to contact us.

  • others

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Business Introduction: Thin-Film Solar Cells

Business Introduction: Thin-Film Solar Cells

Low cost and high productivity! With modular design, the equipment can be configured to meet customer requirements.

Our film deposition systems continue to set the standard for thin-film solar cells. PIA|nova and XENIA are advanced automated equipment platforms that adopt a modular approach for depositing back electrode layers, transparent conductive films (TCO), and various types of absorber layers such as CIGS and CdTe technologies. Through long-standing partnerships with thin-film solar cell manufacturers and the experience accumulated in the deposition of large glass substrates, we are driving down production costs while simultaneously improving conversion efficiency. 【Other Businesses (Partial)】 ■ Glass deposition for building materials and mobility ■ Crystalline solar cells ■ Flexible substrates ■ Special applications ■ Modular process systems *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Wafer

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Large panel deposition system CLUSTERLINE 600

Large panel deposition system CLUSTERLINE 600

Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.

The "CLUSTERLINE600" is a PVD deposition system specialized for large panels. All platforms share a cluster architecture equipped with cassette-to-cassette processing and fully automated processing. 【Chamber Configuration】 ■ Degassing Chamber ■ Ion Etching ■ Ti Sputtering ■ Cu Sputtering *For more details, please download the PDF (English version) or feel free to contact us.

  • Sputtering Equipment
  • Etching Equipment

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Retrofitting services for existing equipment.

Retrofitting services for existing equipment.

From site surveys to design and construction, experienced engineers will handle it!

We will introduce advanced film deposition technology while making the most of your existing equipment. This is ideal for companies that want to upgrade performance while keeping their current facilities as they are. We also handle the import and sale of overseas equipment, and even first-time representatives can consult with us confidently through careful hearings and on-site investigations. Additionally, we sell our own sputtering deposition sources and engage in the import and sale of overseas products. 【Service Content】 ■ Achieve cost reduction, extend equipment life, and improve performance ■ Considerate planning for on-site operations ■ Direct support from technicians who are well-versed in the actual equipment ■ Tailored designs to meet customer challenges *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts
  • Sputtering Equipment

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Low-temperature DLC film deposition device (multilayer CrN/TiAIN, hydrogen-containing Ti-based)

Low-temperature DLC film deposition device (multilayer CrN/TiAIN, hydrogen-containing Ti-based)

Multi-layer film formation enables the creation of low-temperature DLC (Diamond-like carbon) thin film hard coatings with improved impact resistance!

High-density and stable high-quality film formation is possible! By performing DLC film formation that is highly hard (wear-resistant), has a low friction coefficient (wear-resistant), is corrosion-resistant, adhesion-resistant, and smooth, we contribute to the longevity of mold parts for semiconductor manufacturing equipment, resin molding molds, sliding parts, and tools. This is not only optimal for customer cost reduction but also for reducing maintenance work hours such as cleaning tasks and improving operations. It is also possible to achieve "strong adhesion, smooth & hard low-temperature DLC film formation" for three-dimensional ultra-precise complex-shaped molds and machine parts. In addition to improving high hardness and wear resistance, we also accept "peeling treatment and re-coating," contributing to the reduction of product lifecycle costs and material waste, thus reducing environmental impact. ++++++++++++++++++++++++++++++ DLC stands for Diamond-Like Carbon, which refers to a hard thin film coating with good sliding properties that possesses intermediate characteristics between diamond and graphite. By adjusting the ratio of SP3 (diamond bonds) to SP2 (graphite bonds) and the ratio of H (hydrogen) contained within, as well as by applying multilayer coatings, it is possible to create thin films with various physical properties and characteristics (industrial value).

  • Plasma surface treatment equipment
  • Surface treatment contract service
  • Other semiconductor manufacturing equipment

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[Case Study on the Use of Conductive Diamond Technology] Decomposition of PFAS by Electrolytic Oxidation Method

[Case Study on the Use of Conductive Diamond Technology] Decomposition of PFAS by Electrolytic Oxidation Method

Decomposition of PFAS through electrochemical oxidation using the power of diamonds.

Chemically stable and considered difficult to decompose, organic fluorine compounds (PFAS). The method we propose for their treatment is an electrochemical decomposition method using diamond electrodes. The extensive potential window of diamond electrodes efficiently generates reactive species such as ozone (O₃) and hydroxyl radicals (•OH), which have extremely strong oxidative power during the electrolysis of water. These reactive species strongly attack and cleave the chemical bonds of PFAS, breaking them down into harmless substances. Additionally, when sulfuric acid is used as the electrolyte, peroxodisulfate (S₂O₈²⁻) is generated due to the action of the diamond electrode. This powerful oxidizing agent has also been reported in recent studies to significantly contribute to the decomposition of PFAS, attracting attention.

  • Company：DIAM
  • Price：Other
  • Other water treatment

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