Pressure-free thermal conductive adhesive sheet iCas KR in the cure process.
It exhibits high heat dissipation characteristics without pressure. During temporary adhesion, the adhesive layer becomes soft, allowing it to conform to the unevenness of the substrate and reduce thermal resistance.
- Achieves high insulation and heat dissipation Insulation breakdown strength: AC 65kV/mm Thermal conductivity: 3.5 W/m·K (laser flash method) - No decrease in insulation breakdown voltage after 1000 hours at 150°C - Can be bonded with uniform thickness due to sheet shape, eliminating concerns about pump-out or liquid dripping 【Examples of Applications】 - Interlayer bonding of electronic components - Joining of various device parts - Power devices for automotive use, etc.
- Company:TOMOEGAWA CORPORATION
- Price:Other