Vacuum gas replacement oven
Heating multiple wafers in a clean environment of Class 1 at a maximum temperature of 450°C with high temperature stability.
Patent technology of laminar flow method The YES PB series chamber features a gas generation plenum at the top and a suction plenum at the bottom, allowing heated gas (typically N2) to flow parallel to the wafer. The parallel laminar flow is effective in removing particles generated on the wafer surface during the heating process. Equipped with a particle removal filter inside the chamber The heated process gas reaches the workpiece through a filter with holes of 100 micrometers in diameter, and after passing through the workpiece, it goes through the filter again before being discharged outside the chamber. This results in a very low amount of particles in the process gas, allowing the wafer to be heated with clean gas. Convection cooling mechanism The cooling of the 450PB is performed entirely from outside the process chamber, ensuring that the processed workpiece is not exposed to cold air. The chamber is surrounded by an independent cabinet equipped with a cooling air inlet and exhaust duct. The heated air cooling the chamber is mixed with ambient air before being exhausted, resulting in a lower temperature during discharge.
- Company:ハイソル
- Price:Other