Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 58 items
Non-contact measurement of the thickness of fiber membranes such as non-woven fabric - Sample measurement in progress -
Detecting thickness variations in nanofiber non-woven fabric using transmitted light - Non-contact real-time high-speed measurement - 3D display of fiber surface shape - Interchangeable fiber sensors tailored to the target
Non-destructive line measurement of film and sheet thickness.
First of all, each device component is designed to be simple, allowing us to introduce customized packaging that meets the needs of each customer, which is also optimal for cost reduction. We have adopted a highly reliable measurement calculation method called FFT, so you can collect data with confidence.
Just spread out the rice and set it up! A grain quality tester that allows for easy and accurate grain quality assessment. It captures images while changing the light source and processes multiple images taken.
The "RN-700" is a grain quality assessment device equipped with a newly developed image recognition engine. It captures images of rice on a tray while changing the light source and processes multiple images taken. It assesses the quality of each individual grain of rice. Operation is simple; just spread the rice on the tray and set it. The results are automatically output. The accuracy aims to match that of a human inspector, while the measurement of grain count and result analysis are performed at a speed surpassing that of humans. 【Features】 ■ Accurate with three images ■ Assessment results tailored to the application (Display on the main unit, printed output from the built-in printer, rear panel, and external output) ■ Detailed assessment results can be checked immediately *For more details, please refer to the PDF document or feel free to contact us.
Broken rice (fragments) and rice with cracks can cause mushiness during cooking. Measure the ratio to prevent this in advance.
Broken rice causes starch to leak out during cooking, resulting in a mushy texture and poor quality. Measuring the ratio of broken and cracked grains during the acceptance inspection of milled rice and before cooking can help prevent troubles and complaints during cooking. ◇ Simple operation: just spread it on the tray and insert it ◆ PC software allows you to check image data of each grain (optional) ◇ Widely adopted by rice wholesalers and milling factories nationwide You can verify the accuracy and ease of operation with a demo unit. If you are interested, please contact us.
A film thickness measuring device designed not only for research purposes but also for use in production environments.
The "Film Thickness Measurement Device" is a product of THETA METRISIS, handled by Outex. It is a film thickness measurement system that uses white light reflection spectroscopy, capable of measuring from the nano range to the micron range. A variety of models are available to suit different applications, ranging from convenient portable types to large stationary types. We offer numerous modules necessary for measurements in high temperatures, in liquids, microscope attachment types, gas chambers, flow cells, and more. This product is designed not only for research purposes but also with an eye towards use in production environments. 【Features】 ■ Film thickness measurement system from nano range to micron range using white light reflection spectroscopy ■ A wide selection of models available to suit various applications ■ Numerous modules available ■ Usable in both research and production environments *For more details, please refer to the PDF document or feel free to contact us.
Automation is possible at various points! Instant measurement of copper film thickness and the potential for increased production efficiency through advanced statistical processing is here!
How about fully automated measurement for the inspection of copper plating film thickness? The handheld copper plating thickness measurement device "Cabidarm" can automate various points such as the plating process, final inspection process, and incoming inspection. 【Features】 ○ Measurements are taken instantly ○ The dedicated probe does not scratch the substrate ○ It is possible to connect to a PC via USB cable for advanced statistical processing For more details, please contact us or download the catalog.
No need for electrode formation with mercury probes! Provides reduced development time and lower costs in R&D.
The "MCV-530/530L/2200/2500" is a device that enables the evaluation of electrical characteristics of semiconductor silicon wafers and the characteristics of MOS device oxide films, among others. Traditionally, gate electrodes such as Poly-Si or Al were deposited on the wafer, and after forming MOS structures or Schottky structures, CV/IV characteristic evaluations were conducted. This product has its own gate electrode, allowing for the acquisition of electrical characteristics of oxide films and wafers without the need to create a metal gate. It provides quick feedback through process monitoring, reduces development time in R&D, and lowers costs. 【Features】 ■ No need for electrode formation due to the mercury probe ■ Excellent reproducibility ・Schottky: 0.3% (1σ) / MOS: 0.1% (1σ) ■ Mapping of the wafer surface is possible ■ Safe and easy mercury exchange enabled by a newly developed mercury exchange mechanism *For more details, please refer to the PDF document or feel free to contact us.
Function to measure surface and nano structures! Covers from millimeters to atomic level.
We introduce a combined system of Scanning Electron Microscope (SEM) and Atomic Force Microscope (AFM). Using the zoom function of the SEM, the AFM chip can be directly moved to the target area. Information about surface morphology and mechanical, electrical, and magnetic properties can be obtained with nanometer resolution. AFM can be utilized with the Merlin series and Crossbeam series, and existing systems can be updated with a simple door replacement. 【Features】 ■ SEM and FIB intersect with a cantilever chip ■ Composite measurements of all three methods can be performed at the exact same point in space and on the sample ■ Designed to achieve 3D resolution at the single atom level ■ Maintains a minimum SEM working distance of 5mm while allowing a viewing angle of 0° to 85° with the SEM ■ Supports in-situ chip sharpening with FIB *For more details, please refer to the PDF document or feel free to contact us.
Measurement device that enables the use of IR reflectance measurement heads! Achieves high-throughput measurement of epitaxial film thickness.
The "EIR-2500" is a unique epitaxial film thickness measurement device equipped with an infrared spectroscopic reflectometer and FTIR functionality. It achieves high-throughput epitaxial film thickness measurements and fully complies with applicable SEMI/CE standards. Additionally, the EIR product series is based on high-performance and reliable electronic components, improving equipment uptime and reducing maintenance needs. 【Features】 ■ Wafer size: 4 to 12 inches ■ Materials: Si, SOI, SiC, SiGe, III-V, etc. ■ FTIR functionality ■ High-precision measurement of epitaxial film thickness ■ Measurement of film thickness in the transition region *For more details, please refer to the related link page or feel free to contact us.
