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Ion Mass Spectrometer Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Ion Mass Spectrometer Product List

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High-performance automated SIMS

High-performance automated SIMS

It is possible to provide rapid feedback for process development and defect analysis of semiconductor devices!

Secondary Ion Mass Spectrometry (SIMS) enables depth profiling analysis with high sensitivity and high mass resolution for all elements. Furthermore, our company has added automation features from sample introduction to analysis, allowing for high-precision automated measurements. As a result, we can provide rapid feedback for process development and defect analysis in semiconductor devices, where quick responses are required. 【Features】 ■ High sensitivity measurement: Capable of high sensitivity measurement of heavy elements such as Ag, In, and Sb. ■ High mass resolution measurement ・M/ΔM = ~10,000 ・Evaluation of contamination levels of P, Al, Fe, Ni, etc., in Si and SiO2. *For more details, please download the PDF or feel free to contact us.

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Secondary Ion Mass Spectrometry (SIMS)

Secondary Ion Mass Spectrometry (SIMS)

There are various types of mass spectrometers, such as magnetic field type, quadrupole type, and time-of-flight type, which are used according to the purpose of the analysis!

Secondary Ion Mass Spectrometry (SIMS) is a highly sensitive analytical technique capable of identifying and quantifying trace impurity elements at the ppb level. Since measurements are conducted while sputtering, it is possible to obtain the depth distribution of impurities within the film. Please feel free to contact us when you need assistance. 【Features】 ■ Magnetic Field SIMS: Used for evaluating impurities that require high sensitivity. ■ Quadrupole SIMS: Used for evaluations that require depth resolution and for assessing multilayer films that include insulating films. ■ Time-of-Flight SIMS: Used for evaluating the molecular structure level of trace substances on the surface, as well as for assessing the contamination state of organic materials and minute foreign substances on the surface. *For more details, please download the PDF or feel free to contact us.

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High-performance magnetic field SIMS

High-performance magnetic field SIMS

SIMS equipped with three features: high sensitivity, high mass resolution, and high depth resolution!

The "high-performance magnetic field SIMS" is a device that can analyze all elements with high sensitivity in depth direction. With high-performance SIMS capable of high-sensitivity and high mass resolution analysis even in low-energy analysis, it has become possible to achieve high-precision measurements in challenging, extremely shallow regions. As a result, it can now be applied to semiconductor devices, which are advancing in miniaturization and diversification of materials. 【Features】 ■ High sensitivity measurement (high transmission rate) ■ High mass resolution ■ Various measurements possible from ultra-low energy analysis to standard analysis ■ Equipped with a high-brightness ion gun ■ Automatic measurement with high repeatability precision, capable of measuring up to 25 samples *For more details, please download the PDF or feel free to contact us.

  • Analytical Equipment and Devices

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Dynamic SIMS

Dynamic SIMS

Suitable for analysis of glass, metal, ceramics, silicon, compound semiconductors, shallow implants, and more!

"DYNAMIC SIMS" is a secondary ion mass spectrometry method that can detect trace amounts of all elements (from H to U) in samples with high sensitivity, ranging from ppm to ppb. It allows for qualitative analysis and depth profiling, and additionally enables high-precision quantitative analysis using standard samples (conducted at our partner company's facility). The minimum beam diameter is approximately 30 µm, and it can be further reduced depending on the material. 【Features】 ■ Automatic loading/unloading of samples, high throughput (24 samples/load) ■ Unmatched depth profiling capability and high depth resolution, wide dynamic range ■ Optimized for the analysis of glass, metals, ceramics, silicon, compound semiconductors, shallow implants, etc. ■ Highest detection limit: from ppm to ppb (10^-6 to 10^-9) *For more details, please refer to the PDF document or feel free to contact us.

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  • Analytical Equipment and Devices

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SIMS (Secondary Ion Mass Spectrometry)

SIMS (Secondary Ion Mass Spectrometry)

This is a method for qualitative and quantitative analysis of components contained in a sample by detecting secondary ions and measuring the detection amount at each mass.

When ions are incident on the sample surface, various particles such as electrons, neutral particles, and ions are emitted from the sample surface. SIMS is a technique that detects these ions and measures the detection quantity at each mass to perform qualitative and quantitative analysis of the components contained in the sample. - High sensitivity (ppb to ppm) - Analysis of all elements from H to U is possible - Wide detection concentration range (from major component elements to trace impurities) - Quantitative analysis using standard samples is possible - Depth direction analysis is possible - Evaluation with depth direction resolution of a few to several tens of nm is possible - Measurement of micro-regions up to a few micrometers in size is possible - Isotope analysis is possible - Destructive analysis

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[TOF-SIMS] Time-of-Flight Secondary Ion Mass Spectrometry

[TOF-SIMS] Time-of-Flight Secondary Ion Mass Spectrometry

This is a method for structural analysis of the sample surface. Due to its sensitivity to the surface compared to other analytical devices, it is suitable for identifying organic contaminants on the very surface.

This is a method for structural analysis of sample surfaces. It is suitable for identifying organic contamination on the very surface due to its sensitivity compared to other analytical devices. Using a sputter ion source, it is possible to analyze the distribution of inorganic and organic materials in the depth direction. - Structural analysis and identification of organic and inorganic compounds are possible. - Coordination data from foreign substance inspection devices can be linked. - Qualitative analysis is possible from micron-order microforeign substances to several centimeters. - It is possible to analyze the very surface with high sensitivity. - Image analysis is possible. - Qualitative analysis of depth direction analysis is possible.

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[Analysis Case] Evaluation of the Depth Distribution of B near the Si Surface using SIMS

[Analysis Case] Evaluation of the Depth Distribution of B near the Si Surface using SIMS

High-precision B profile analysis through sample cooling.

The concentration distribution of boron (B) in silicon (Si), which significantly affects the characteristics of device design, can be evaluated with high sensitivity and high depth resolution through SIMS analysis. However, it has been found that under general analysis conditions, distortions occur in the concentration distribution of B due to measurement-related factors. In MST, it has been confirmed that sample cooling is effective for correcting these distortions, enabling a more accurate evaluation of the concentration distribution.

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[Analysis Case] Depth Direction Analysis of TFT Wiring Intersection Using SSDP-SIMS

[Analysis Case] Depth Direction Analysis of TFT Wiring Intersection Using SSDP-SIMS

Analysis using SSDP is also possible for microdomains and glass substrates.

An example is shown where secondary ion mass spectrometry (SIMS) was used to analyze the intersection (4μm×10μm) of the data signal wiring and gate electrode wiring of a commercially available TFT LCD from the substrate side (SSDP-SIMS). By measuring from the substrate side (SSDP-SIMS), it becomes possible to provide data free from the influence of high-concentration layers or metal films on the surface side.

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[Analysis Case] Evaluation of Ultra-Shallow Implant Profiles by SIMS

[Analysis Case] Evaluation of Ultra-Shallow Implant Profiles by SIMS

Evaluation of dopant distribution and junctions is possible even in extremely shallow regions.

The miniaturization of devices has increased the need for evaluating the depth distribution of impurities in extremely shallow regions. To conduct an accurate assessment, SIMS analysis using a primary ion beam with lower energy (below 1 keV) is required. Figure 1 shows examples of measurements of Si wafers implanted with BF2+ 1 keV, P+ 1 keV, and As+ 1 keV, using a primary ion beam energy of 250 eV to 300 eV.

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[Analysis Case] High-Precision Analysis of Ultra-Shallow Dopant Distribution Using SIMS

[Analysis Case] High-Precision Analysis of Ultra-Shallow Dopant Distribution Using SIMS

Can be evaluated with high reproducibility.

Due to the miniaturization of devices, it is necessary to evaluate the depth distribution of impurities in extremely shallow regions. To perform an accurate evaluation, SIMS analysis using a primary ion beam with lower energy (below 1 keV) is required. In this study, the relative standard deviation of the surface density of B calculated from six measurements conducted over multiple days using a 1 keV oxygen ion beam on Si wafers implanted with B+ at low energy was found to be less than 3%, demonstrating that high reproducibility can be achieved in the evaluation of extremely shallow impurity distributions, similar to conventional SIMS analysis.

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[Analysis Case] Depth Profile Analysis of Dopant Elements in SiC Using SIMS

[Analysis Case] Depth Profile Analysis of Dopant Elements in SiC Using SIMS

It is possible to evaluate the depth distribution of B, Al, N, P, and As in SiC with high sensitivity.

SiC is used as a power device material due to its physical properties, but unlike Si, the diffusion of dopants after thermal treatment following ion implantation is difficult. Therefore, it is necessary to control the distribution in the depth direction through multi-step ion implantation. SIMS analysis can evaluate impurity concentrations in the depth direction with high sensitivity (below ppm), making it suitable for assessing the distribution of dopant elements in SiC. It is also possible to evaluate the distribution of light elements (such as H, C, O, F, etc.). Please contact us regarding any elements you would like to evaluate.

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[Analysis Case] SSDP-SIMS Analysis on SiC Substrates

[Analysis Case] SSDP-SIMS Analysis on SiC Substrates

It is possible to obtain the dopant concentration profile from the SiC substrate side.

In the SiC power MOSFET (Figure 1), the concentration distribution of the dopant element Al in the SiC beneath the gate pad was evaluated using SIMS from both the surface side and the backside (Figure 2). Regardless of the direction of analysis, the distribution beyond a depth of approximately 0.5 μm also matches well, suggesting that the spread of the Al concentration distribution reflects the actual elemental distribution rather than being measurement-induced. SSDP-SIMS analysis is possible even on hard substrates like SiC, which are difficult to process. Please feel free to consult us first.

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[Analysis Case] Composition Analysis of GaN-based LED Structures using SIMS

[Analysis Case] Composition Analysis of GaN-based LED Structures using SIMS

Capable of evaluating the composition of the main elemental components of GaN-based LEDs in the depth direction.

In general, the quantification of major elements with concentrations exceeding a certain percentage in SIMS is considered to be low. However, by using the M Cs+ (M: element of interest) detection mode with Cs+ as the primary ion, it is possible to determine the compositional distribution of major element elements in the depth direction. An example of depth compositional evaluation for Al, Ga, and In in GaN-based LED structures is presented.

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[Analysis Case] Evaluation of Ti Diffusion into IGZO Film

[Analysis Case] Evaluation of Ti Diffusion into IGZO Film

Measurement avoiding the influence of high concentration layers using SSDP-SIMS.

IGZO films are materials that are being researched and developed as TFT materials for displays. There are concerns that the diffusion of metal elements into the IGZO film may degrade the TFT characteristics, so it is necessary to accurately measure the metal concentration within the film for evaluating the device characteristics and reliability using IGZO films. We will introduce a case where the Ti concentration in the IGZO film was evaluated from the opposite side of the metal electrode using SSDP-SIMS.

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[Analysis Case] Ultra-high Sensitivity Measurement of Impurities in Silicon Using SIMS

[Analysis Case] Ultra-high Sensitivity Measurement of Impurities in Silicon Using SIMS

We will enhance the sensitivity and evaluate the concentration distribution at the ppt level.

The detection sensitivity in SIMS analysis depends on the amount of sputtered sample per unit time. Depending on the element, significantly improved sensitivity can be achieved by limiting the impurities to one element, allowing evaluation down to ppt (parts per trillion) levels of less than 5E13 atoms/cm3, which is effective for assessing low-concentration impurities in IGBT devices and high-purity wafers. This document presents examples of ultra-high sensitivity evaluations of low-concentration impurities in silicon.

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