ウェル List of Products and Services

Facilitates the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving a reduction in capital investment and running costs!

• Molding Equipment
• Circuit board processing machine
• Plasma surface treatment equipment

Facilitating the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving reductions in capital investment and running costs!

• Plasma surface treatment equipment
• Molding Equipment
• Circuit board processing machine

Facilitates the construction of mass production inline systems for large workpieces (such as glass substrates) from semiconductor IC pad cleaning to FPC substrates and LCD glass substrates, achieving reductions in capital investment and running costs! Simple plasma unit equipped with a manual stage Compatible with build-in for various devices.

• Plasma surface treatment equipment
• Molding Equipment
• Circuit board processing machine

We can accommodate custom manufacturing from small lots based on standard products of small LCD panels.

• LCD display
• Embedded system design service
• Contract manufacturing

LED bar module type equipped with high-brightness white LEDs in SMT packages on a rigid substrate.

• Other electronic parts

LED bar module type equipped with white LEDs in SMT packages on a rigid substrate.

• Other electronic parts

Test chip equipped with solder bumps (narrow pitch area type) □Product name ... JTEG Phase2E200/JTEG Phase2E175/JTEG Phase2E150 ■Main applications Material development, equipment development, substrate development, package development Process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Liquid Crystal Driver Implementation Evaluation Test Chip □ Product Names ... JTEG Phase6_50/JTEG Phase6_35 JTEG Phase6_30/JTEG Phase6_25 JTEG Phase6_15S/JTEG Phase6_20 JTEG Phase6_40/JTEG Phase6_25E JTEG Phase6_60 ■ Main Applications Material development, equipment development, substrate development, process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Thermal resistance and stress measurement test chip □Product name... JTEG Phase5/JTEG Phase5GB2 ■Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Well, we provide turnkey solutions from the development of flip chip implementation methods using TEG chips as our core business to the prototyping of implementations using various methods, including bumping for flip chips, re-wiring processing, and 3D implementation wafer MEMS processing (cavity and through-via processing).

• Bonding Equipment
• Circuit board processing machine
• Other semiconductor manufacturing equipment

We offer a contract assembly service specialized in flip chip assembly that can achieve high-density implementation at low cost. We support prototype flip chip assembly from rigid substrates to COF, COG substrates, and Si interposer substrates, as well as 3D assembly prototypes using TSV electrodes.

• Other analyses
• Contract measurement
• Processing Contract

High-speed tester burn-in device compatible with next-generation MRAM

• Tester
• Semiconductor inspection/test equipment

Test chip equipped with solder bumps □Product name ... JTEG Phase1E50/JTEG Phase1E28/JTEG Phase1E15 ■Main applications Material development, equipment development, substrate development, package development Process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

A desktop semi-automatic machine for cell production that applies ACF to one location on the LCD, FPC, and PCB.

• Circuit board processing machine

Glass substrate compatible with the liquid crystal driver evaluation test chip "Phase 6" □Product name ... JKIT Type G1 / JKIT Type G2 / JKIT Type G3 / JKIT Type G4 / JKIT Type G5

• Other electronic parts
• others
• Processing Contract

This device is equipped with a high-precision Peltier element and a self-developed Peltier controller, allowing for high-precision and rapid temperature control of individual LEDs while conducting reliability evaluations and accelerated lifespan tests of the LEDs.

• Semiconductor inspection/test equipment
• Optical Measuring Instruments
• Contract measurement

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

• Other electronic parts
• others
• Processing Contract

A desktop semi-automatic machine for cell production that performs terminal cleaning before attaching ACF to the LCD panel electrode section.

• Other semiconductor manufacturing equipment
• Surface treatment contract service

A 3D surface shape measurement module that enables automatic 3D inspection of surface shapes simply by attaching it to the metal microscope installed by the customer.

• Semiconductor inspection/test equipment

Providing mounting solutions from bump-equipped chips compatible with all types of bonding methods to advanced mounting assembly and reliability evaluation.

• Other electronic parts
• others
• Processing Contract

Improved maintainability with automatic flux supply and discharge functions, and open front and top.

• spray
• Circuit board processing machine
• Other semiconductor manufacturing equipment

Underfill Encapsulation Void Observation Glass Chip ■Wafer Size: 5-inch Wafer ■Base Chip Size: 5.02mm × 5.02mm ■Pad Pitch: 200μm ■Number of Pads: 484 Bumps ■Compatible Bump Processes: Eutectic Solder / Lead-Free Solder ■Compatible Substrates: JKIT Type1 (SIDE A) / JKIT Type5 ■Base Material: Natural Quartz Glass ■Options: Bump Mounting / Dicing Processing ■Main Applications: Material Development, Process Startup/Verification, Promotional Data Acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Next-generation test chip with Low-K film used in the interlayer dielectric layer for solder bumps ■Wafer size: 8-inch wafer ■Base chip size: 5.02mm × 5.02mm ■Pad pitch: 200μm (staggered pads) ■Number of pads: 484 bumps ■Compatible bump processes: Eutectic solder / Lead-free solder ■Compatible substrate: JKIT Type 5 ■Options: Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation ■Main applications: Package development, process ramp-up / Development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Ultra-small chip size 0.55mm□ test chip ■ Wafer size ... 6-inch wafer ■ Base chip size ... 0.55mm × 0.55mm□ ■ Pad pitch ... 110μm ■ Number of pads ... 8 pads ■ Compatible bump processes ... Gold-plated bump / Gold stud bump ■ Options ... Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

A desktop semi-automatic machine for cell production that aligns and performs main pressing of FPC at one location on the LCD and PCB.

• Bonding Equipment
• Circuit board processing machine
• Other semiconductor manufacturing equipment

A desktop semi-automatic machine for cell production that performs IC bonding at one location on the LCD and FPC.

• Bonding Equipment
• Circuit board processing machine
• Other semiconductor manufacturing equipment

Desktop semi-automatic machine for cell production that applies polarizing films to LCD panels.

• Circuit board processing machine
• Other semiconductor manufacturing equipment

Ultra-precision laser analysis device for evaluating phase change conditions and material properties in diverse area states.

• Semiconductor inspection/test equipment

By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.

• Bonding Equipment
• Circuit board processing machine
• Other semiconductor manufacturing equipment

Full automation is possible at a low cost through integration with the conveying system.

• Bonding Equipment
• Other semiconductor manufacturing equipment

Cu bump mounted Cu bonding evaluation test chip ■Wafer size ... 8-inch wafer ■Base chip size ... 5.09mm × 5.09mm ■Pad pitch ... 150μm (staggered pads) ■Number of pads ... 841 bumps ■Compatible bump process ... Cu bump ■Compatible substrate ... None ■Options ... Bump mounting / Dicing processing / Back grinding processing ■Main applications Package development, process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Fine pitch wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose test chip ■ Wafer size: 6-inch wafer ■ Base chip size: 2.11mm × 2.11mm ■ Pad pitch: 45, 50, 60μm from the chip inner peripheral pads ■ Number of pads: 92, 92, 100 pads from the chip inner peripheral pads ■ Compatible bump processes: Gold-plated bumps (select one type from pads with 45, 50, 60μm pitch) / Gold stud bumps ■ Compatible substrates: None ■ Options: Dicing processing / Back grinding processing ■ Main applications Material development, equipment development, substrate development Process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

We provide total solution services from circuit design necessary for flip chips, bump and re-routing processing, wafer back grinding and dicing, flip chip mounting, to reliability joint evaluation, as well as sales of next-generation flip chip mounting machines.

• Bonding Equipment
• Contract manufacturing

General-purpose test chip with a larger chip size than JTEG Phase 0 ■ Wafer size ... 8-inch wafer ■ Base chip size ... 3.5mm × 3.5mm ■ Pad pitch ... 120μm ■ Number of pads ... 96 bumps (the inner pads do not have aluminum pads opened) ■ Compatible bump process ... gold stud bump ■ Compatible substrate ... none ■ Options ... bump mounting / dicing processing / back grinding processing ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Super Fine Pitch Wire Bonding Evaluation Test Chip ■Wafer Size: 8-inch wafer ■Base Chip Size: 3.0mm × 3.0mm ■Pad Pitch: 30, 35, 40, 45, 50, 55, 60μm from the chip inner peripheral pads ■Number of Pads: 120, 136, 144, 152, 152, 160, 160 pads from the chip inner peripheral pads ■Compatible Bump Process: None ■Compatible Substrate: None ■Options: Dicing processing / Back grinding processing ■Main Applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Test chip used for wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose applications. ■Wafer size: 6-inch wafer ■Base chip size: 2.13×2.1mm ■Pad pitch: 130μm ■Number of pads: 108 bumps (48 bumps on the inner circumference, 60 bumps on the outer circumference) ■Compatible bump processes: Gold-plated bumps / Gold stud bumps ■Compatible substrate: JKIT Type2 (SIDE A) ■Options: Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) / Can be changed to gallium arsenide wafer (only for gold-plated bump products) ■Main applications: Material development, equipment development, substrate development, package development, process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip ■Wafer Size ... 8-inch wafer ■Base Chip Size ... 6.0mm × 2.3mm ■Pad Pitch ... 300μm ■Number of Pads ... 16 bumps ■Compatible Bump Process ... None ■Compatible Substrate ... None ■Options ... Dicing processing / Back grinding processing ■Main Applications Material development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip □Product Name... JTEG Phase11_80/JTEG Phase11_70/JTEG Phase11_60/JTEG Phase11_50/JTEG Phase11_40 ■Main Applications Package development, process startup/development, promotional data acquisition, etc.

• Other electronic parts
• others
• Processing Contract

Silicon interposer (through holes penetrating the pad area of JTEG Phase 0)

• Other electronic parts
• others
• Processing Contract

Various bump processing for flip chip mounting

• LCD display
• Other services
• Processing Contract

The electronic display board is a compact tabletop signboard that uses high-brightness LEDs. Text input can be easily set up from a computer. It can display messages in Japanese with a maximum of 1500 characters and four types of motion effects. Thanks to the built-in lithium battery, it can operate cordlessly for up to 15 hours.

• Other electronic parts

Rigid substrate for flip chip mounting compatible with various test chips □Product name... JKIT Type1 / JKIT Type2 / JKIT Type3 / JKIT Type4 / JKIT Type5 / JKIT Type6

• Other electronic parts
• others
• Processing Contract

Outstanding promotional effect as a moving display name card at exhibitions and events! The LED light nameplate is a 'display name card' that can smoothly display not only Japanese but also emojis, symbols, original logos, English, Korean, Chinese, and Russian. You can easily create six types of catchy phrases on a computer, and it also supports flashing displays.

• Other electronic parts

● This is a compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. ● Achieves high precision at a low cost! It can be upgraded to a fully automated system for mass production with our automatic substrate transport system. ● It can accommodate a wide range of applications from multi-variety production for cell manufacturing to process and material development.

• Bonding Equipment
• Other semiconductor manufacturing equipment

The ultra-thin LED stand panel is an easy light panel that allows for image changes at any time. The energy-efficient and environmentally friendly next-generation LED light panel is perfect for exhibitions, interior design, and other spatial presentations. It is sure to enhance advertising effectiveness! Assembly is a breeze, and you can easily start displaying at any time! With a design that significantly reduces power consumption, it is a great product that is kind to both your wallet and the environment.

• Other electronic parts